公开(公告)号：US2988839A

公开(公告)日：1961-06-20

申请号：US59112156

申请日：1956-06-13

Applicant: ROGERS CORP

Inventor： GREENMAN NORMAN L ,  ZAGUSTA JOHN A ,  ANDERSON PAUL L

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K3/041 ,  H05K3/046 ,  H05K3/107 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/025 ,  H05K2203/0522 ,  H05K2203/0528 ,  H05K2203/0557 ,  Y10S29/029 ,  Y10T29/49155 ,  Y10T156/1028 ,  Y10T156/1054 ,  Y10T156/1056 ,  Y10T156/108 ,  Y10T156/1082

公开(公告)号：US3161945A

公开(公告)日：1964-12-22

申请号：US73684658

申请日：1958-05-21

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC: H05K3/04 ,  H05K3/20 ,  H05K3/28 ,  H05K3/38

CPC classification number: H05K3/38 ,  H05K3/041 ,  H05K3/202 ,  H05K3/281 ,  H05K2201/0376 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0278 ,  Y10T29/49158

公开(公告)号：US3504103A

公开(公告)日：1970-03-31

申请号：US3504103D

申请日：1968-06-28

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  RANDALL BENJAMIN J ,  IOSUE MICHAEL F

IPC: H01B7/08 ,  H02G5/00 ,  C09J7/00

CPC classification number: H01B7/08 ,  H02G5/005 ,  Y10T428/3154 ,  Y10T428/31786

公开(公告)号：US3340606A

公开(公告)日：1967-09-12

申请号：US23692062

申请日：1962-11-13

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC: H05K1/03 ,  H05K3/00 ,  H05K3/04

CPC classification number: H05K1/036 ,  H05K1/0366 ,  H05K3/0064 ,  H05K3/041 ,  H05K2203/0108 ,  Y10T29/4916 ,  Y10T83/9309

公开(公告)号：US3301730A

公开(公告)日：1967-01-31

申请号：US10022661

申请日：1961-04-03

Applicant: ROGERS CORP

Inventor： LAZARUS SPIWAK ,  TRAUT GEORGE R ,  ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC: H05K1/00 ,  H05K3/04 ,  H05K3/38

CPC classification number: H05K3/041 ,  H05K1/0393 ,  H05K3/386 ,  H05K2203/0108 ,  H05K2203/1327 ,  Y10T29/49155 ,  Y10T156/108

公开(公告)号：US2971249A

公开(公告)日：1961-02-14

申请号：US53779255

申请日：1955-09-30

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  ZAGUSTA JOHN A ,  GREENMAN NORMAN L

IPC: H05K3/04 ,  H05K3/38

CPC classification number: H05K3/041 ,  H05K3/386 ,  H05K2203/0108 ,  Y10S425/811 ,  Y10T29/49128

公开(公告)号：US3052823A

公开(公告)日：1962-09-04

申请号：US74168058

申请日：1958-06-12

Applicant: ROGERS CORP

Inventor： ANDERSON PAUL L ,  ZAGUSTA JOHN A

IPC: H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4084 ,  H05K1/144 ,  H05K3/363 ,  H05K3/368 ,  H05K3/4038 ,  H05K3/4611 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/0919 ,  H05K2201/09645 ,  H05K2201/09845 ,  H05K2201/10053 ,  H05K2201/10477 ,  H05K2203/063

公开(公告)号：US2972003A

公开(公告)日：1961-02-14

申请号：US56696256

申请日：1956-02-21

Applicant: ROGERS CORP

Inventor： GREENMAN NORMAN L ,  ZAGUSTA JOHN A ,  ANDERSON PAUL L

IPC: H05K3/00 ,  H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/0014 ,  H05K3/041 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/0376 ,  H05K2201/09118 ,  H05K2203/0108 ,  H05K2203/0278

公开(公告)号：US3663866A

公开(公告)日：1972-05-16

申请号：US3663866D

申请日：1970-03-27

Applicant: ROGERS CORP

Inventor： IOSUE MICHAEL F ,  ROBINSON RONALD F ,  ANDERSON PAUL L ,  ZIOBROWSKI EDWIN P

IPC: H01R12/51 ,  H05K1/18 ,  H05K3/22 ,  H05K3/46 ,  H05K1/04

CPC classification number: H05K1/185 ,  H05K3/222 ,  H05K3/4641 ,  H05K2201/044 ,  H05K2201/09309 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704

Abstract: A back plane for use as a power bus which supports and electrically energizes microcircuit chips. The back plane is formed by a laminated structure in which are mounted wire wrap pins that form terminals for the microcircuits. The laminates are sheets of conductive material insulated from one another and the wrap pins are mounted in the laminated structure so that electrical contact for each pin is made with only one of the conductive laminates. There are sufficient wrap pins to provide electrical contact with each of the respective conductive laminates. The laminates also include channels in which microcircuit chips may be mounted. The leads from the chips can be wrapped around the terminal pins which are connected respectively to the laminates energized at appropriate voltage levels.

Abstract translation: 用作电源总线的背板，支持微电路芯片的电能。 背板由层压结构形成，其中安装有形成用于微电路的端子的绕线销。 层压板是彼此绝缘的导电材料片，并且绕线销安装在层压结构中，使得每个销的电接触仅由一个导电层压板制成。 存在足够的缠绕销以与每个相应的导电层压板电接触。 层压板还包括可以安装微电路芯片的通道。 来自芯片的引线可以缠绕在分别连接到以适当电压电平激励的层压体的端子引脚上。

公开(公告)号：US2986804A

公开(公告)日：1961-06-06

申请号：US63849157

申请日：1957-02-06

Applicant: ROGERS CORP

Inventor： GREENMAN NORMAN L ,  ZAGUSTA JOHN A ,  ANDERSON PAUL L

IPC: H05K3/04 ,  H05K3/10 ,  H05K3/38

CPC classification number: H05K3/041 ,  H05K3/107 ,  H05K3/386 ,  H05K2201/09118 ,  H05K2203/0108 ,  Y10T29/49165