公开(公告)号：US20160020367A1

公开(公告)日：2016-01-21

申请号：US14798720

申请日：2015-07-14

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  Dezhong Liu

IPC: H01L33/54 ,  H01L33/44 ,  H01L33/50 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/0095 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/24 ,  H01L2224/48091 ,  H01L2224/82 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/18165 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for fabricating a package structure is provided. At least one light emitting component is sucked and adhered to a carrier. An encapsulating member encapsulates the light emitting component. A conductive component is connected to the light emitting component.

Abstract translation: 提供一种制造封装结构的方法。 至少一个发光部件被吸附并附着在载体上。 封装构件封装发光部件。 导电部件连接到发光部件。

公开(公告)号：US20150333238A1

公开(公告)日：2015-11-19

申请号：US14715959

申请日：2015-05-19

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  Dezhong Liu

IPC: H01L33/62 ,  H01L33/54 ,  H01L33/50

CPC classification number: H01L33/642 ,  H01L24/32 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A package structure is provided, which includes a metal element, a light emitting element disposed on the metal element, an insulative body encapsulating the light emitting element, a conductive adhesive coupled to the light emitting element, and a phosphor layer covering the light emitting element and the conductive adhesive. By using the conductive adhesive as a circuit, the fabricating cost can be reduced for meeting the low-profile requirement. The present invention further provides a method of fabricating the package structure.

Abstract translation: 提供了一种封装结构，其包括金属元件，设置在金属元件上的发光元件，封装发光元件的绝缘体，耦合到发光元件的导电粘合剂和覆盖发光元件的荧光体层 和导电粘合剂。 通过使用导电粘合剂作为电路，可以减少制造成本以满足低调要求。 本发明还提供一种制造封装结构的方法。

公开(公告)号：US20150155461A1

公开(公告)日：2015-06-04

申请号：US14094063

申请日：2013-12-02

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  DeZhong Liu

IPC: H01L33/64 ,  H01L33/54 ,  H01L33/56 ,  H01L33/36 ,  H01L33/50

CPC classification number: H01L33/54 ,  H01L33/0095 ,  H01L33/50 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.

Abstract translation: 提供了一种发光封装结构，包括密封剂，嵌入密封剂的发光部件，并且具有与发光侧相对的发光侧和非发光侧，嵌入并从密封剂露出的大坝， 以及覆盖发光侧和大坝的荧光体层。 非发光侧具有多个电极。 由于荧光体层产生的热可以通过堤坝传递到发光封装结构的外部区域，因此可以防止密封剂的腐蚀。 还提供了一种制造发光封装结构的方法。

公开(公告)号：US20140302244A1

公开(公告)日：2014-10-09

申请号：US14227048

申请日：2014-03-27

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  DeZhong Liu

IPC: B05D5/06 ,  B05D1/06

CPC classification number: H05B33/14 ,  H01L2933/0041

Abstract: A method for forming a uniform film layer structure, including providing a phosphorous powder and a first surface of an object, wherein the phosphorous powder has a plurality of phosphorous particles, at least a portion of a surface of each of the phosphorous particles is covered with an adhesive material, and the first surface does not contact the phosphorous powder; and adsorbing the phosphorous powder to the first surface of the object by using an electrostatic adsorption method.

Abstract translation: 一种形成均匀的膜层结构的方法，包括提供磷粉末和物体的第一表面，其中磷粉末具有多个磷颗粒，每个磷颗粒的至少一部分表面被覆盖 粘合剂材料，第一表面不接触磷粉末; 并通过静电吸附法将磷粉末吸附在物体的第一表面上。

公开(公告)号：US20130243964A1

公开(公告)日：2013-09-19

申请号：US13799283

申请日：2013-03-13

Applicant: ACHROLUX INC.

Inventor： Peiching Ling ,  Dezhong Liu

IPC: B05D5/00 ,  B05D1/00

CPC classification number: B05D5/00 ,  B05D1/007 ,  B29D11/00865 ,  H01L33/502 ,  H01L33/507 ,  H01L2933/0041

Abstract: A method for forming a phosphor material on a surface of a target is provided. The method includes the steps of: providing a chamber for receiving the phosphor material, which is constituted by a plurality of particles; exposing the surface of the target to the phosphor material; and creating a charge on the plurality of particles and generating an electric field between the chamber and the surface of the target, so as to drive the plurality of particles toward the surface of the target and to be deposited on the surface of the target.

Abstract translation: 提供了在靶的表面上形成荧光体材料的方法。 该方法包括以下步骤：提供用于接收由多个颗粒构成的荧光体材料的室; 将靶的表面暴露于荧光体材料; 并在所述多个颗粒上产生电荷并在所述室与所述靶的表面之间产生电场，以将所述多个颗粒驱动到所述靶的表面并沉积在所述靶的表面上。