公开(公告)号：US20080226845A1

公开(公告)日：2008-09-18

申请号：US11723120

申请日：2007-03-16

Applicant: Chuan-Ter Yan ,  Chih-Hsiung Huang ,  Chao-Ching Huang ,  Chin-Wang Kao ,  Tin-Hun Hung

Inventor： Chuan-Ter Yan ,  Chih-Hsiung Huang ,  Chao-Ching Huang ,  Chin-Wang Kao ,  Tin-Hun Hung

IPC: C09K19/00

CPC classification number: G02F1/133723 ,  C08L79/08 ,  C08L2205/02 ,  Y10T428/1018 ,  C08L2666/20

Abstract: A polyamic acid-based composition includes: a polyamic acid A prepared by a process including reacting an aromatic tetracarboxylic dianhydride and an aromatic diamine; and a polyamic acid B prepared by a process including reacting an aliphatic tetracarboxylic dianhydride, an aromatic diamine having a side chain, and a non-aromatic diamine. A liquid crystal orienting film is formed by a process including: preparing a mixture containing the aforesaid polyamic acid-based composition and a solvent; coating the mixture onto a substrate so as to form a film on the substrate; and heating the film so as to convert polyamic acid of the polyamic acid-based composition into polyamide.

Abstract translation: 基于聚酰胺酸的组合物包括：通过包括使芳族四羧酸二酐和芳族二胺反应的方法制备的聚酰胺酸A; 和通过使脂肪族四羧酸二酐，具有侧链的芳香族二胺与非芳香族二胺反应的方法制备的聚酰胺酸B。 通过包括以下工艺形成液晶取向膜：制备含有上述聚酰胺酸基组合物和溶剂的混合物; 将混合物涂布在基材上，以在基材上形成膜; 并加热该膜以将聚酰胺酸基组合物的聚酰胺酸转化为聚酰胺。

公开(公告)号：US20140007425A1

公开(公告)日：2014-01-09

申请号：US13542178

申请日：2012-07-05

Applicant: Ju-Mei LU ,  Yao-Min Huang ,  Jui-Chin Peng ,  Shih-Ting Yang ,  Chao-Ching Huang

Inventor： Ju-Mei LU ,  Yao-Min Huang ,  Jui-Chin Peng ,  Shih-Ting Yang ,  Chao-Ching Huang

IPC: H05K3/22

CPC classification number: B81C1/00309 ,  B81C1/00269 ,  B81C1/00873 ,  B81C2203/0118 ,  H05K3/0052 ,  H05K3/34 ,  H05K2201/049 ,  H05K2201/10083 ,  H05K2201/10371 ,  Y10T29/49128

Abstract: A manufacturing method of electronic packaging includes the steps of preparing a metallic plate having an array of cover portions, soldering the metallic plate to a circuit board having encapsulated areas corresponding to the cover portions and employing a cutting process to obtain multiple electronic packages. Thus, the invention has the advantages of low cost and high efficiency

Abstract translation: 电子封装的制造方法包括以下步骤：制备具有盖部分阵列的金属板，将金属板焊接到具有与盖部分对应的封装区域的电路板，并采用切割工艺以获得多个电子封装。 因此，本发明具有成本低，效率高的优点

公开(公告)号：US20130322662A1

公开(公告)日：2013-12-05

申请号：US13486074

申请日：2012-06-01

Applicant: Hung-Jen Chen ,  Chao-Ching Huang ,  Kuan-Hsun Chiu ,  Yung-Ta Chen ,  Xian-Gen Liao

Inventor： Hung-Jen Chen ,  Chao-Ching Huang ,  Kuan-Hsun Chiu ,  Yung-Ta Chen ,  Xian-Gen Liao

IPC: H04R19/04

CPC classification number: H04R19/005 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/16151 ,  H01L2924/16152 ,  H04R19/04 ,  H04R31/00 ,  H01L2924/00014

Abstract: A MEMS microphone module includes a substrate and a conducting lid covered on the substrate to define a chamber therebetween for accommodation of a MEMS chip and an ASIC chip. A ground layer of the substrate is electrically coupled to a protrusion of the conductive lid to form an EMI shielding structure. By this way, an EMI shielding effect can be applied by the EMI shielding structure to the MEMS chip and the ASIC chip.

Abstract translation: MEMS麦克风模块包括衬底和覆盖在衬底上的导电盖，以在其间限定用于容纳MEMS芯片和ASIC芯片的腔室。 衬底的接地层电耦合到导电盖的突起，以形成EMI屏蔽结构。 通过这种方式，可以通过EMI屏蔽结构将EMI屏蔽效应应用于MEMS芯片和ASIC芯片。