公开(公告)号：US20080303159A1

公开(公告)日：2008-12-11

申请号：US12221997

申请日：2008-08-08

Applicant: Sriram Muthukumar ,  Devendra Natekar

Inventor： Sriram Muthukumar ,  Devendra Natekar

IPC: H01L23/48

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49822 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.

Abstract translation: 本发明的实施例提供一种具有模具和基板的装置，其具有与模具的热膨胀系数相似的热膨胀系数。 衬底可以包括硅基层。 可以在距离模具更远的基底层的侧面上形成堆积层。

公开(公告)号：US20070231953A1

公开(公告)日：2007-10-04

申请号：US11395549

申请日：2006-03-31

Applicant: Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

Inventor： Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

IPC: H01L21/00

CPC classification number: H01L21/4867 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/5389 ,  H01L24/24 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract translation: 本发明的一个实施例是制造金属互连的技术。 将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。 设备安装在第一个金属轨迹上。 当封装电源时，该设备从基板接收电力。

公开(公告)号：US20060290002A1

公开(公告)日：2006-12-28

申请号：US11169595

申请日：2005-06-28

Applicant: Leonel Arana ,  Devendra Natekar ,  Michael Newman ,  Charan Gurumurthy

Inventor： Leonel Arana ,  Devendra Natekar ,  Michael Newman ,  Charan Gurumurthy

IPC: H01L23/48 ,  H01L23/52

CPC classification number: H01L21/76898 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method of forming a via having a stress buffer collar, wherein the stress buffer collar can absorb stress resulting from a mismatch in the coefficients of thermal expansion of the surrounding materials. Other embodiments are described and claimed.

Abstract translation: 一种形成具有应力缓冲套环的通孔的方法，其中所述应力缓冲环可以吸收由周围材料的热膨胀系数不匹配引起的应力。 描述和要求保护其他实施例。

公开(公告)号：US07144299B2

公开(公告)日：2006-12-05

申请号：US11125605

申请日：2005-05-09

Applicant: Leonel R. Arana ,  Terry L. Sterrett ,  Devendra Natekar

Inventor： Leonel R. Arana ,  Terry L. Sterrett ,  Devendra Natekar

IPC: B24B1/00

CPC classification number: B24B7/228 ,  B24B41/068 ,  Y10T29/49998

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract translation: 描述电子设备支持和处理方法。 一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。 该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。 从电子设备延伸的焊料凸块位于流体中。 通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。 活化流体将电子设备机械地保持在适当位置。 电子设备的表面被抛光，同时电子设备被活化的流体保持就位。 通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。 描述和要求保护其他实施例。

公开(公告)号：US20130122656A1

公开(公告)日：2013-05-16

申请号：US13734861

申请日：2013-01-04

Applicant: Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

Inventor： Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

IPC: H01L21/768

CPC classification number: H01L21/4867 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/5389 ,  H01L24/24 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract translation: 本发明的一个实施例是制造金属互连的技术。 将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。 设备安装在第一个金属轨迹上。 当封装电源时，该设备从基板接收电力。

公开(公告)号：US20120289002A1

公开(公告)日：2012-11-15

申请号：US13556079

申请日：2012-07-23

Applicant: Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

Inventor： Yoshihiro Tomita ,  David Chau ,  Gregory M. Chrysler ,  Devendra Natekar

IPC: H01L21/50

CPC classification number: H01L21/4867 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/5389 ,  H01L24/24 ,  H01L2223/6677 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/00

Abstract: An embodiment of the present invention is a technique to fabricate a metal interconnect. A first metal trace is printed on a die attached to a substrate or a cavity of a heat spreader in a package to electrically connect the first metal trace to a power contact in the substrate. A device is mounted on the first metal trace. The device receives power from the substrate when the package is powered.

Abstract translation: 本发明的一个实施例是制造金属互连的技术。 将第一金属迹线印刷在附接到封装中的散热器的基板或空腔的管芯上，以将第一金属迹线电连接到基板中的电源触点。 设备安装在第一个金属轨迹上。 当封装电源时，该设备从基板接收电力。

公开(公告)号：US07589424B2

公开(公告)日：2009-09-15

申请号：US12221997

申请日：2008-08-08

Applicant: Sriram Muthukumar ,  Devendra Natekar

Inventor： Sriram Muthukumar ,  Devendra Natekar

IPC: H01L29/00

CPC classification number: H01L23/49827 ,  H01L21/486 ,  H01L21/76898 ,  H01L23/49822 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die.

Abstract translation: 本发明的实施例提供一种具有模具和基板的装置，其具有与模具的热膨胀系数相似的热膨胀系数。 衬底可以包括硅基层。 可以在距离模具更远的基底层的侧面上形成堆积层。

公开(公告)号：US20090072013A1

公开(公告)日：2009-03-19

申请号：US12323314

申请日：2008-11-25

Applicant: DEVENDRA NATEKAR ,  Yoshihiro Tomita ,  Chi-Won Hwang

Inventor： DEVENDRA NATEKAR ,  Yoshihiro Tomita ,  Chi-Won Hwang

IPC: B23K1/20

CPC classification number: H05K1/097 ,  B82Y10/00 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29298 ,  H01L2224/838 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K3/125 ,  H05K2201/026 ,  H05K2203/013 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The paste may be used on other surfaces as well.

Abstract translation: 纳米级粒子糊可以用于使用沉积和喷墨印刷的管芯路由和其它应用。 将金属膏施加到模具的表面以电耦合模具的两个间隔开的连接点。 或者或另外，糊状物可以含有碳纳米管。 糊也可用于其他表面。

公开(公告)号：US20080265391A1

公开(公告)日：2008-10-30

申请号：US12169542

申请日：2008-07-08

Applicant: Terry L. STERRETT ,  Devendra NATEKAR

Inventor： Terry L. STERRETT ,  Devendra NATEKAR

IPC: H01L23/538 ,  H05K1/09

CPC classification number: H05K3/4038 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H05K3/06 ,  H05K2201/09881 ,  H05K2201/10378 ,  H05K2201/2018 ,  H05K2203/0369 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer. In one embodiment, the interposer 106 includes columnar interconnects which may be fabricated by etching a conductive member such as copper foil, for example. In one application, the pitch or center to center spacing of the columnar interconnects may be defined by masking techniques to provide an interconnect pitch suitable for a particular application. In yet another aspect, etching rates may be controlled to provide height to width aspect ratios of the columnar interconnects which are suitable for various applications.

Abstract translation: 在一个实施例中，组装包装堆叠包括第一集成电路封装和第二集成电路封装，其使用中介层机械和电连接。 在一个实施例中，插入器106包括可以通过例如蚀刻诸如铜箔的导电构件来制造的柱状互连。 在一个应用中，柱状互连的间距或中心到中心间隔可以通过掩模技术来定义，以提供适合于特定应用的互连间距。 在另一方面，可以控制蚀刻速率以提供适合于各种应用的柱状互连的高宽比长宽比。

公开(公告)号：US20060252354A1

公开(公告)日：2006-11-09

申请号：US11125605

申请日：2005-05-09

Applicant: Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

Inventor： Leonel Arana ,  Terry Sterrett ,  Devendra Natekar

IPC: B24B1/00

CPC classification number: B24B7/228 ,  B24B41/068 ,  Y10T29/49998

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract translation: 描述电子设备支持和处理方法。 一个实施例包括处理包括从其延伸的焊锡凸块的电子器件的方法。 该方法包括在支撑结构上提供至少一种选自电流变流体和流变流体的流体。 从电子设备延伸的焊料凸块位于流体中。 通过将从电场和磁场组成的组中选出的场施加到流体来激活流体。 活化流体将电子设备机械地保持在适当位置。 电子设备的表面被抛光，同时电子设备被活化的流体保持就位。 通过从流体中除去所施加的场，使流体失活，并且电子装置与去活化流体分离。 描述和要求保护其他实施例。