公开(公告)号：US09955569B2

公开(公告)日：2018-04-24

申请号：US15363556

申请日：2016-11-29

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Ya-Wen Kuo ,  Li-Chih Yu ,  Ching-Hsin Ho

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/46 ,  H05K1/09 ,  H05K1/03

CPC classification number: H05K1/0271 ,  H05K1/0366 ,  H05K1/09 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/029 ,  H05K2201/0355 ,  H05K2201/068

Abstract: A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers.

公开(公告)号：US20180086870A1

公开(公告)日：2018-03-29

申请号：US15373834

申请日：2016-12-09

Applicant: Elite Material Co., Ltd.

Inventor： Chen Yu HSIEH

IPC: C08F230/02 ,  C08K7/18

CPC classification number: C08F230/02 ,  C08F2810/20 ,  C08K7/18

Abstract: The disclosure relates to a phosphorus-containing vinyl polyphenylene ether obtained by reacting a phosphorus-containing vinyl compound with a vinyl polyphenylene ether, a resin composition including the phosphorus-containing vinyl polyphenylene ether and a product thereof. Various products can be made from the resin composition, such as resin films, prepregs, resin-coated coppers, laminates or printed circuit boards, and they have one, multiple or all of the following properties: lower coefficient of thermal expansion, lower thermal expansion, higher thermal resistance, better flame retardancy, lower dielectric constant, lower dielectric loss and so forth.

公开(公告)号：US09926435B2

公开(公告)日：2018-03-27

申请号：US15067144

申请日：2016-03-10

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh

IPC: C08K5/53 ,  C08J5/18 ,  H05K1/09 ,  H05K1/03

CPC classification number: C08K5/53 ,  C08J5/18 ,  C08J5/24 ,  C08J2371/00 ,  C08J2371/12 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2203/122 ,  C08L71/02

Abstract: A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

公开(公告)号：US20170260364A1

公开(公告)日：2017-09-14

申请号：US15067144

申请日：2016-03-10

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu Hsieh

IPC: C08K5/53 ,  H05K1/09 ,  H05K1/03 ,  C08J5/18

CPC classification number: C08K5/53 ,  C08J5/18 ,  C08J5/24 ,  C08J2371/00 ,  C08J2371/12 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/012 ,  H05K2203/122 ,  C08L71/02

Abstract: A resin composition, a copper-clad laminate using the same, and a printed circuit board using the same are introduced. The resin composition comprises a specific phosphorus-containing salt and a prepolymer of vinyl-containing polyphenylene ether. The resin composition features specific ingredients and proportion to thereby achieve satisfactory properties of prepreg made from the resin composition, and attain satisfactory laminate properties, such as high degree of heat resistance and satisfactory dielectric properties, and thus is suitable for producing a prepreg or a resin film to thereby be applicable to copper-clad laminates and printed circuit boards.

公开(公告)号：US20170088669A1

公开(公告)日：2017-03-30

申请号：US15224773

申请日：2016-08-01

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH ,  Tse-An LEE ,  Hui-Ting SHIH

IPC: C08G65/48 ,  C08K5/5399 ,  C08K5/3415 ,  H05K1/03 ,  C08K5/14 ,  C08J5/24 ,  C09D179/00 ,  C08L73/00 ,  C08K3/36

CPC classification number: C08G65/485 ,  C08J5/24 ,  C08J2371/12 ,  C08J2379/00 ,  C08J2471/12 ,  C08K3/36 ,  C08K5/14 ,  C08K5/3415 ,  C08K5/5399 ,  C08L73/00 ,  C09D179/00 ,  H05K1/0373 ,  H05K2201/012

Abstract: The present invention relates to a phosphorus-containing polyphenylene oxide resin, its preparation method, a method for preparing the prepolymer of the phosphorus-containing polyphenylene oxide, a resin composition and an article thereof, wherein the phosphorus-containing polyphenylene oxide resin has a chemical structure represented by the following formula (I): wherein R′ is R″ is R′″ is hydrogen, Through the use of the above phosphorus-containing polyphenylene oxide resin, an article made from the resin composition can has good flame retardance, good thermal resistance and a lower percent of thermal expansion while dielectric properties can be maintained, such that the present invention is suitable for use in products such as copper clad laminate and printed circuit board.

公开(公告)号：US20160297779A1

公开(公告)日：2016-10-13

申请号：US15072416

申请日：2016-03-17

Applicant: Elite Material Co., Ltd.

Inventor： Chen-Yu HSIEH ,  Hui-Ting SHIH

IPC: C07D265/12 ,  C08F222/08 ,  C08G73/06 ,  H05K1/03 ,  C08K5/5399 ,  C08K5/03 ,  C08K5/5313 ,  C08J5/24 ,  C07D265/16 ,  C08K3/36

CPC classification number: C07D265/12 ,  C07D265/16 ,  C08F222/08 ,  C08G73/06 ,  C08J5/24 ,  C08J2379/04 ,  C08L35/06 ,  H05K1/0373

Abstract: The present disclosure is to provide a modified oxazine compound and use of a composition comprising the same.

Abstract translation: 本公开内容旨在提供修饰的恶嗪化合物和包含其的组合物的用途。

公开(公告)号：US09428646B2

公开(公告)日：2016-08-30

申请号：US13948399

申请日：2013-07-23

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Chen-Yu Hsieh

IPC: C08G79/02 ,  B32B15/14 ,  C08L63/00 ,  C08L71/02 ,  H05K1/03

CPC classification number: C08L71/02 ,  C08K5/5399 ,  C08L21/00 ,  C08L71/12 ,  C08L79/08 ,  H05K1/0353 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10T428/24917 ,  Y10T428/31681

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of polyphenylene oxide resin; (B) 10 to 50 parts by weight of maleimide resin; (C) 5 to 100 parts by weight of polybutadiene copolymer; (D) 5 to 30 parts by weight of cyanate ester resin; and (E) 15 to 150 parts by weight of phosphazene. The halogen-free resin composition is characterized by specific ingredients and proportions thereof to achieve circuit board laminate properties, such as a high glass transition temperature, low coefficient of thermal expansion, low dielectric properties, heat resistance, flame retardation, and being halogen-free, and thus is applicable to the manufacturing of a prepreg or resin film, thereby being applicable to the manufacturing of metal laminates and printed circuit boards.

Abstract translation: 无卤素树脂组合物包含（A）100重量份聚苯醚树脂; （B）10〜50重量份马来酰亚胺树脂; （C）5〜100重量份的聚丁二烯共聚物; （D）5〜30重量份的氰酸酯树脂; 和（E）15〜150重量份的磷腈。 无卤素树脂组合物的特征在于其特定成分和比例，以实现电路板层压性能，例如高玻璃化转变温度，低热膨胀系数，低介电性能，耐热性，阻燃性和无卤素 ，因此可以应用于预浸料或树脂膜的制造，从而适用于金属层叠体和印刷电路板的制造。

公开(公告)号：US09392683B2

公开(公告)日：2016-07-12

申请号：US14554923

申请日：2014-11-26

Applicant: Elite Material Co., Ltd.

Inventor： Ming-Chuan Chang ,  Li-Chih Yu ,  Yu-Te Lin

IPC: H05K1/02 ,  H01P3/08 ,  H05K1/03

CPC classification number: H05K1/024 ,  H01P3/082 ,  H05K1/0242 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/0353 ,  H05K1/0366 ,  H05K2201/029

Abstract: A multi-layer printed circuit board comprises: at least two insulation layers, respectively having glass fiber cloth and cured resin covering thereon, the insulation layers being stacked on each other; an internal trace layer formed between two neighboring insulation layers; and an external trace layer formed on an outer surface of the outermost insulation layer; wherein the insulation layers have a dielectric constant of 3.4 or less, and the internal and external trace layers have a trace width between 40 and 75 micrometers, such that the multi-layer printed circuit board has a characteristic impedance between 45 and 55Ω in single-ended signaling and between 90 and 110Ω in differential signaling.

Abstract translation: 多层印刷电路板包括：分别具有玻璃纤维布和覆盖在其上的固化树脂的至少两个绝缘层，所述绝缘层彼此堆叠; 在两个相邻绝缘层之间形成的内部迹线层; 以及形成在最外绝缘层的外表面上的外部迹线层; 其中所述绝缘层具有3.4或更小的介电常数，并且所述内部和外部迹线层具有介于40和75微米之间的迹线宽度，使得所述多层印刷电路板具有在45和55之间的特征阻抗; 在单端信令和90和110之间和OHgr; 差分信号。

公开(公告)号：US09279051B2

公开(公告)日：2016-03-08

申请号：US13680568

申请日：2012-11-19

Applicant: ELITE MATERIAL CO., LTD.

Inventor： Li-Chih Yu ,  Tse-An Lee

IPC: C08G73/06 ,  C08K3/00 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  H05K1/03 ,  H05K3/22 ,  B32B15/08 ,  C08L65/00 ,  C08L79/04 ,  C08L35/06 ,  H05K3/02

CPC classification number: C08L65/00 ,  B32B15/08 ,  C08G73/0655 ,  C08K3/013 ,  C08K3/26 ,  C08K3/36 ,  C08K5/09 ,  C08K5/5399 ,  C08L35/06 ,  C08L71/12 ,  C08L79/04 ,  H05K1/0353 ,  H05K3/022 ,  H05K2201/012 ,  Y10T428/31699 ,  C08K3/0033

Abstract: The halogen-free resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 50 parts by weight of styrene-maleic anhydride; (C) 5 to 100 parts by weight of polyphenylene oxide resin; (D) 10 to 150 parts by weight of phosphazene; and (E) 10 to 1000 parts by weight of inorganic filler. By using specific components at specific proportions, the halogen-free resin composition offers the features of low dielectric constant, low dissipation factor, high heat resistance and high flame retardancy, and can be made into prepreg or resin film, and thereby used in copper clad laminate or printed circuit board.

Abstract translation: 无卤树脂组合物包含（A）100重量份氰酸酯树脂; （B）5〜50重量份苯乙烯 - 马来酸酐; （C）5〜100重量份聚苯醚树脂; （D）10〜150重量份的磷腈; 和（E）10〜1000重量份的无机填料。 通过使用特定比例的特定成分，无卤树脂组合物具有低介电常数，低耗散因数，高耐热性和高阻燃性的特点，可制成预浸料或树脂膜，从而用于铜包覆 层压板或印刷电路板。

公开(公告)号：US20240352251A1

公开(公告)日：2024-10-24

申请号：US18210869

申请日：2023-06-16

Applicant: Elite Material Co., Ltd.

Inventor： Yu-Te LIN ,  Jun-Yan YU ,  Chien-Cheng WANG

IPC: C08L71/12 ,  C08K5/00

CPC classification number: C08L71/12 ,  C08K5/0066 ,  C08L2201/02 ,  C08L2203/16 ,  C08L2203/20

Abstract: A resin composition is provided, which comprises: 75 parts by weight of vinyl group-containing polyphenylene ether resin; 35 parts by weight to 60 parts by weight of an insoluble flame retardant; and 0.4 parts by weight to 5 parts by weight of a compound represented by the following formula (1):




wherein R1, R2, R3 and n are defined in the specification. The present invention also provides an article manufactured using the aforesaid resin composition.