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公开(公告)号：US11116078B2
公开(公告)日：2021-09-07
申请号：US16808068
申请日：2020-03-03
Applicant: Isola USA Corp.
Inventor： Tarun Amla , Johann R. Schumacher , Sascha Kreuer , Peggy Conn , Stanley E. Wilson
Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
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公开(公告)号：US20180251618A1
公开(公告)日：2018-09-06
申请号：US15786131
申请日：2017-10-17
Applicant: Isola USA Corp.
Inventor： David Bedner , Tarun Amla
IPC: C08J5/24 , H05K3/00 , C09D163/00 , C08G59/50 , C08L63/00 , H05K1/03 , C09J163/04 , C09J163/00 , C09D163/04 , C08L63/04
CPC classification number: C08J5/24 , C08G59/5033 , C08G59/504 , C08J2363/04 , C08J2463/00 , C08L63/00 , C08L63/04 , C09D163/00 , C09D163/04 , C09J163/00 , C09J163/04 , H05K1/0326 , H05K1/0373 , H05K3/00
Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
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公开(公告)号：US09764532B2
公开(公告)日：2017-09-19
申请号：US14838098
申请日：2015-08-27
Applicant: ISOLA USA CORP.
Inventor： Roland Schönholz
IPC: B32B15/08 , B32B27/04 , H05K1/02 , H05K1/11 , H05K3/46 , B32B5/02 , B32B5/26 , B32B15/14 , B32B15/20 , B32B37/00 , B32B37/02 , B32B37/26 , B32B37/06 , B32B38/10 , B32B37/14 , H05K1/14 , B32B37/30 , H05K3/42
CPC classification number: B32B15/08 , B32B5/024 , B32B5/26 , B32B15/14 , B32B15/20 , B32B37/0076 , B32B37/02 , B32B37/144 , B32B37/26 , B32B37/30 , B32B38/10 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/076 , B32B2305/72 , B32B2305/74 , B32B2305/77 , B32B2307/41 , B32B2307/412 , B32B2310/0831 , B32B2457/08 , H05K1/0278 , H05K1/028 , H05K1/118 , H05K1/147 , H05K3/429 , H05K3/4691 , H05K2201/0195 , H05K2201/09063 , H05K2201/09081 , H05K2201/095 , Y10T428/24314 , Y10T428/24322 , Y10T428/24331 , Y10T428/24612 , Y10T428/24802 , Y10T428/24851 , Y10T428/2486
Abstract: Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.
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公开(公告)号：US20160234948A1
公开(公告)日：2016-08-11
申请号：US15099715
申请日：2016-04-15
Applicant: Isola USA Corp.
Inventor： Johann R. Schumacher
CPC classification number: H05K3/4644 , B32B3/00 , B32B3/02 , B32B5/00 , B32B5/02 , B32B5/28 , B32B7/00 , B32B7/04 , B32B7/10 , B32B15/00 , B32B15/04 , B32B15/08 , B32B15/20 , B32B27/00 , B32B27/06 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/30 , B32B27/304 , B32B27/36 , B32B27/38 , B32B2250/40 , B32B2262/00 , B32B2264/00 , B32B2264/10 , B32B2305/07 , B32B2305/076 , B32B2307/20 , B32B2307/202 , B32B2307/30 , B32B2307/302 , B32B2457/00 , B32B2457/08 , H05K1/0353 , H05K3/0011 , H05K3/0055
Abstract: The disclosure provides an improved resin film product is comprised of a partially cured b-staged resin film that has a thickness in the range of 1 mils to about 10 mils and that is disposed between two protective layers, as well as methods for their manufacture and use in the production of layups used to manufacture printed circuit boards.
Abstract translation: 本公开提供了一种改进的树脂膜产品，其由部分固化的b阶树脂膜组成，其厚度为1密耳至约10密耳，并且设置在两个保护层之间，以及其制造方法和 用于生产用于制造印刷电路板的叠层。
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公开(公告)号：US20160014904A1
公开(公告)日：2016-01-14
申请号：US14795051
申请日：2015-07-09
Applicant: Isola USA Corp.
Inventor： Johann R. Schumacher
CPC classification number: H05K3/4644 , B32B3/00 , B32B3/02 , B32B5/00 , B32B5/02 , B32B5/28 , B32B7/00 , B32B7/04 , B32B7/10 , B32B15/00 , B32B15/04 , B32B15/08 , B32B15/20 , B32B27/00 , B32B27/06 , B32B27/08 , B32B27/20 , B32B27/26 , B32B27/28 , B32B27/30 , B32B27/304 , B32B27/36 , B32B27/38 , B32B2250/40 , B32B2262/00 , B32B2264/00 , B32B2264/10 , B32B2305/07 , B32B2305/076 , B32B2307/20 , B32B2307/202 , B32B2307/30 , B32B2307/302 , B32B2457/00 , B32B2457/08 , H05K1/0353 , H05K3/0011 , H05K3/0055
Abstract: The disclosure provides an improved resin film product is comprised of a partially cured b-staged resin film that has a thickness in the range of 1 mils to about 10 mils and that is disposed between two protective layers, as well as methods for their manufacture and use in the production of layups used to manufacture printed circuit boards.
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Patent Agency Ranking
公开(公告)号：US20150030822A1
公开(公告)日：2015-01-29
申请号：US14512815
申请日：2014-10-13
Applicant: Isola USA Corp.
Inventor： Tarun Amla , Johann R. Schumacher , Sascha Kreuer , Peggy Conn , Stanley E. Wilson
CPC classification number: H05K1/0366 , C08J5/24 , C08J2300/22 , C08J2300/24 , H01B3/40 , H05K1/024 , H05K1/0248 , H05K1/0373 , H05K2201/0195 , Y10T428/24802 , Y10T428/2481 , Y10T428/24893 , Y10T428/24917 , Y10T428/24926
Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
Abstract translation: 由具有自由树脂部分和树脂浸渍增强材料部分的树脂组合物制成的预浸料和层压材料，其中树脂包括一种或多种基础树脂和一种或多种高Dk材料，其中一种或多种高Dk材料存在于树脂组合物中 足以使树脂组合物具有与施加树脂组合物的树脂浸渍增强材料的DkWR匹配的固化DkW在±（±）±15％之内的量。
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公开(公告)号：US20140220844A1
公开(公告)日：2014-08-07
申请号：US13803698
申请日：2013-03-14
Applicant: ISOLA USA CORP.
Inventor： Tarun Amla , Johann R. Schumacher , Sascha Kreuer , Peggy Conn , Stanley E. Wilson
IPC: H01B3/02
CPC classification number: H01B3/02 , H01B3/40 , H05K1/024 , H05K1/0248 , H05K1/0373 , H05K2201/0209 , Y10T442/2992 , Y10T442/3415
Abstract: Resin compositions including one or more base resins and one or more high dielectric constant materials wherein the one or more high dielectric constant materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured Dk that matches the Dk of the reinforcing material to which the resin composition is to be applied to within plus or minus (±) 15% as well as prepregs and laminates made using the resin compositions.
Abstract translation: 包括一种或多种基础树脂和一种或多种高介电常数材料的树脂组合物，其中所述一种或多种高介电常数材料以足以使树脂组合物具有与Dk的Dk匹配的固化Dk的量存在于树脂组合物中 将树脂组合物施加到正或负（±）±15％以下的增强材料以及使用树脂组合物制成的预浸料和层压体。
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公开(公告)号：US11155687B2
公开(公告)日：2021-10-26
申请号：US16515127
申请日：2019-07-18
Applicant: Isola USA Corp.
Inventor： David Bedner , Tarun Amla
IPC: C08J5/24 , C08G59/50 , C09J163/04 , C09J163/00 , C08L63/00 , C08L63/04 , H05K1/03 , C09D163/00 , C09D163/04 , H05K3/00
Abstract: Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
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公开(公告)号：US10070518B2
公开(公告)日：2018-09-04
申请号：US14512815
申请日：2014-10-13
Applicant: Isola USA Corp.
Inventor： Tarun Amla , Johann R. Schumacher , Sascha Kreuer , Peggy Conn , Stanley E. Wilson
CPC classification number: H05K1/0366 , C08J5/24 , C08J2300/22 , C08J2300/24 , H01B3/40 , H05K1/024 , H05K1/0248 , H05K1/0373 , H05K2201/0195 , Y10T428/24802 , Y10T428/2481 , Y10T428/24893 , Y10T428/24917 , Y10T428/24926
Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.
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公开(公告)号：US09579868B2
公开(公告)日：2017-02-28
申请号：US14838092
申请日：2015-08-27
Applicant: ISOLA USA CORP.
Inventor： Roland Schönholz
CPC classification number: H05K1/186 , B32B5/024 , B32B5/26 , B32B2260/023 , B32B2260/046 , B32B2262/101 , B32B2305/77 , B32B2307/41 , B32B2307/412 , B32B2457/08 , H05K3/284 , H05K3/4611 , H05K2201/0195
Abstract: Prepregs having a UV curable resin layer located adjacent to a first thermally curable resin layer or sandwiched between first and second thermally curable resin layers wherein the UV curable resin layer is uncured or partially cured as well as methods for preparing laminates using the prepregs wherein the laminate includes at least one UV curable resin encapsulated electrical component.
Abstract translation: 具有位于第一可热固化树脂层附近或夹在第一和第二热固化树脂层之间的UV固化树脂层的预浸料，其中UV固化树脂层未固化或部分固化，以及使用预浸料制备层压材料的方法，其中层压 包括至少一种UV固化树脂封装的电组件。
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