公开(公告)号：US4964458A

公开(公告)日：1990-10-23

申请号：US161880

申请日：1988-02-29

Applicant: Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

Inventor： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC: H01L23/367 ,  H01L23/433 ,  H01L23/467

CPC classification number: H01L23/3672 ,  H01L23/4338 ,  H01L23/467 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with understanding fins for transference of heat from the chips to a coolant flowing through the fins. Pin fins may be employed with air coolant. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is thermally joined, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. For liquid coolant, the heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils. Another embodiment uses air cooling, and uses metal pin fins bonded to a metal sheet which is moderately thin and flexible. Transverse motion between the sheet and the array of chips is introduced concurrently with the application of pressure between the sheet and the chips to reduce the thickness of the layers of grease between the chips and the sheet, thereby to improve thermal conductivity between the heat exchanger and each of the chips.

Abstract translation: 用于冷却设置在共同基板上的电路芯片阵列的热交换器形成为导热材料的柔性片，其具有用于将热从芯片传递到流过翅片的冷却剂的散热片。 引脚散热片可以与空气冷却剂一起使用。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂与芯片热连接。 片材气密地密封芯片以免受冷却剂的污染。 对于液体冷却剂，热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。 另一实施例使用空气冷却，并且使用结合到中等薄度和柔性的金属片的金属销散热片。 片材与芯片阵列之间的横向运动与片材和芯片之间的压力施加同时引入，以减小芯片和片材之间的润滑脂层的厚度，从而改善热交换器和 每个芯片。

公开(公告)号：US4832255A

公开(公告)日：1989-05-23

申请号：US223818

申请日：1988-07-25

Applicant: Harry R. Bickford ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Michael J. Palmer

Inventor： Harry R. Bickford ,  Kurt R. Grebe ,  Caroline A. Kovac ,  Michael J. Palmer

IPC: B23K3/06 ,  B23K35/14 ,  B23K35/40 ,  H01L21/60 ,  H05K3/04 ,  H05K3/34 ,  H05K13/04

CPC classification number: H01L24/27 ,  B23K3/06 ,  H05K13/0465 ,  H05K3/3473 ,  H05K3/3478 ,  H01L2224/13111 ,  H01L2224/29111 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/1579 ,  H05K2203/0108 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0528 ,  H05K2203/0726 ,  H05K2203/1105 ,  H05K3/046 ,  Y10T29/49204 ,  Y10T29/4921 ,  Y10T29/49213

Abstract: This invention employs a carrier upon which a thin conductive film has been applied. The conductive film is of a metallic material which exhibits a surface energy such that it is not readily wetted by solder. A patterned mask is disposed on the conductive film, with the mask having openings which expose selected areas of the conductive film. Solder is deposited in the mask openings and is weakly adherent to the exposed areas of the conductive film. The carrier is then disposed over and in registration with conductive land areas of a circuit carrier, such that the solder in the mask openings is aligned with the land areas of the circuit carrier. Subsequently, the carrier and circuit land areas are brought into contact, heated, the solder bonded to the lands, and the carrier is lifted away for subsequent reuse.In another species of the invention, a thin film layer of solder is directly deposited on and weakly adherent to a flexible base layer. Subsequently, tool means which registers with the areas to be soldered, presses the base layer/solder combination against the areas to be coated with solder, thereby causing the solder to adhere to the underlying circuit configuration.

公开(公告)号：US4759403A

公开(公告)日：1988-07-26

申请号：US858135

申请日：1986-04-30

Applicant: Ephraim B. Flint ,  Kurt R. Grebe

Inventor： Ephraim B. Flint ,  Kurt R. Grebe

IPC: F28F9/22 ,  H01L23/433 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L23/4332 ,  H01L2924/0002

Abstract: A manifold for conducting coolant to a set of heat exchangers mounted on individual electric circuit chips of a circuit module is formed of a solid body containing fluid passages terminating in apertures, the manifold being provided with a set of hollow flexible appendages connected to the apertures for conducting coolant to ports of the heat exchangers. The body is formed of two sections, one section having channels machined therein to serve as the fluid passages, and a second section having the apertures. The second section also is bounded by sidewalls which define a cavity. The appendages are formed by a lost wax molding operation wherein the wax is stored in the cavity, and milled to form a mold for the appendages. A plastic material is deposited on the wax mold and on the second section of the body to form the set of appendages, the plastic material being of a type which can be deposited by the process of chemical vapor deposition, thereby to provide a conformal deposition which imparts a water-tight characteristic to the manifold.

Abstract translation: 用于将冷却剂引导到安装在电路模块的单个电路芯片上的一组热交换器的歧管由固体体形成，该固体包含终止于孔中的流体通道，该歧管设置有一组连接到孔的中空柔性附件，用于 将冷却剂导入热交换器的端口。 主体由两个部分形成，一个部分具有加工在其中的通道用作流体通道，以及具有孔的第二部分。 第二部分也由限定空腔的侧壁界定。 附件是通过失蜡模制操作形成的，其中蜡被存储在空腔中，并被研磨以形成用于附件的模具。 塑料材料沉积在蜡模上和主体的第二部分上以形成一组附件，该塑料材料为可通过化学气相沉积工艺沉积的类型，从而提供一种共形沉积 对歧管施加防水特性。

公开(公告)号：US4316200A

公开(公告)日：1982-02-16

申请号：US128219

申请日：1980-03-07

Applicant: Irving Ames ,  Wilhelm Anacker ,  Kurt R. Grebe ,  Charles J. Kircher

Inventor： Irving Ames ,  Wilhelm Anacker ,  Kurt R. Grebe ,  Charles J. Kircher

IPC: H01L27/18 ,  H01L23/485 ,  H01L23/532 ,  H01L39/02 ,  H01L39/22

CPC classification number: H01L24/10 ,  H01L23/53285 ,  H01L24/13 ,  H01L39/02 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12033 ,  Y10S148/089 ,  Y10S505/874

Abstract: In electrical circuitry, and particularly superconducting circuitry including Josephson tunnelling devices, it is often necessary to provide solder contacts to electrical lines, where the electical lines would be destroyed if there were interdiffusion between the lines and the solder. To avoid this problem, a laterally extending metallic layer is used as a diffusion barrier between the solder land and the electrical line which can be a superconducting line. The diffusion barrier is comprised of a refractory metal which has a first portion electrically contacting the solder land and a second, laterally displaced portion, electrically contacting the electrical line. An insulating protective layer on the diffusion barrier layer separates the solder land and the electrical line. In a specific embodiment, the superconducting electrical line is comprised of an alloy of lead while the diffusion barrier is comprised of niobium, and the solder alloy is a low melting point alloy, typically comprised of indium, bismuth, and tin.

Abstract translation: 在电路中，特别是包括约瑟夫逊隧道装置的超导电路中，通常需要向电线提供焊接触点，如果在线路和焊料之间存在相互扩散，则电线将被破坏。 为了避免这个问题，横向延伸的金属层被用作焊锡焊盘和可以是超导线的电线之间的扩散阻挡层。 扩散阻挡层由难熔金属组成，该难熔金属具有与锡焊接区电接触的第一部分和与电线电接触的第二横向移位部分。 扩散阻挡层上的绝缘保护层将焊接区和电线分开。 在一个具体实施例中，超导电线由铅的合金组成，而扩散阻挡层由铌构成，并且焊料合金是通常由铟，铋和锡组成的低熔点合金。

公开(公告)号：US5360946A

公开(公告)日：1994-11-01

申请号：US761182

申请日：1991-09-17

Applicant: Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

Inventor： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to an improved flex (or TAB) product suitable for silicon carrier or other types of chip carrier applications, wherein the flex reliability problems caused for example by Cu thermal cycling are substantially reduced or eliminated. More particularly, the invention embodies a number of coatings for use in such products and diverse methods of making and using same.

Abstract translation: 本发明涉及适用于硅载体或其它类型的芯片载体应用的改进的柔性（或TAB）产品，其中例如通过Cu热循环引起的柔性可靠性问题被显着地减少或消除。 更具体地，本发明体现了用于这种产品中的许多涂层以及制造和使用它们的各种方法。

公开(公告)号：US5305340A

公开(公告)日：1994-04-19

申请号：US991009

申请日：1992-12-16

Applicant: Arsam Antreasyan ,  Myra N. Boenke ,  Greg Costrini ,  Kurt R. Grebe ,  Christoph Harder ,  Peter D. Hoh

Inventor： Arsam Antreasyan ,  Myra N. Boenke ,  Greg Costrini ,  Kurt R. Grebe ,  Christoph Harder ,  Peter D. Hoh

IPC: H01S5/02 ,  H01S5/042 ,  H01S5/22 ,  H01S3/18

CPC classification number: H01S5/0224 ,  H01S5/02272 ,  H01S5/0425 ,  H01S5/22

Abstract: A protection configuration for a semiconductor ridge waveguide laser structure is disclosed wherein layers of protective metal in the form of walls, is applied on each side of the ridge element of the ridged layer of the laser structure. The laser structure is then bonded to a mounting plate in a junction side down orientation by solder or a junction side up orientation by wire bonding. The metal layer may be composed of gold.

Abstract translation: 公开了一种用于半导体脊形波导激光器结构的保护配置，其中以壁形式的保护金属层施加在激光结构的脊状脊的脊元件的每一侧上。 然后将激光结构通过焊料或接合面向上取向通过引线接合而以接合面向下取向粘合到安装板。 金属层可以由金构成。

公开(公告)号：US5038195A

公开(公告)日：1991-08-06

申请号：US477705

申请日：1990-02-09

Applicant: William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

Inventor： William D. Brewer ,  Kurt R. Grebe ,  Raymond R. Horton ,  Linda C. Matthew ,  Ismail C. Noyan ,  Michael J. Palmer ,  Sampath Purushothaman ,  David L. Rath

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

CPC classification number: H05K3/244 ,  H01L21/4846 ,  H01L23/49866 ,  H05K1/09 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  Y10T428/1291

Abstract: The present invention comprises the use of a copper/nickel containing alloy composition or application of a protective nickel alloy coating to copper current-carrying leads to prevent electrolytic migration between tape automated bonding (TAB) package leads.

公开(公告)号：US5546655A

公开(公告)日：1996-08-20

申请号：US329066

申请日：1994-10-25

Applicant: Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

Inventor： Claudius Feger ,  Teresita O. Graham ,  Kurt R. Grebe ,  Alphonso P. Lanzetta ,  John J. Liutkus ,  Linda C. Matthew ,  Michael J. Palmer ,  Nelson R. Tanner ,  Ho-Ming Tong ,  Charles H. Wilson ,  Helen L. Yeh

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K3/02

CPC classification number: H01L24/45 ,  H01L21/481 ,  H01L23/49572 ,  H01L23/49894 ,  H01L24/85 ,  H05K3/363 ,  H01L2224/056 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01021 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/351 ,  H05K2201/10681 ,  H05K2201/10977 ,  H05K2203/176 ,  H05K3/0017 ,  H05K3/3452 ,  Y10T29/49121 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A flex or TAB product suitable for chip carrier applications wherein the flex reliability problems caused by copper dendrite growth and lead bending during power and thermal cycling are reduced by application of special coatings to lead areas of the flex tape.

Abstract translation: 适用于芯片载体应用的柔性或TAB产品，其中在功率和热循环期间由铜枝晶生长和引线弯曲引起的柔性可靠性问题通过将特殊涂层施加到柔性带的引导区域来减少。

公开(公告)号：US4730666A

公开(公告)日：1988-03-15

申请号：US858318

申请日：1986-04-30

Applicant: Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

Inventor： Ephraim B. Flint ,  Kurt R. Grebe ,  Peter A. Gruber ,  Arthur R. Zingher

IPC: H01L23/36 ,  H01L23/433 ,  H01L23/467 ,  F28F7/00 ,  H01R13/00

CPC classification number: H01L23/467 ,  F28F19/06 ,  F28F21/085 ,  F28F3/048 ,  H01L23/4338 ,  F28F2255/02 ,  F28F2255/14 ,  H01L2924/0002

Abstract: A heat exchanger for cooling an array of electric circuit chips disposed on a common substrate is formed as a flexible sheet of thermally conducting material with upstanding fins for transference of heat from the chips to a coolant flowing through the fins. The sheet may be provided with corrugations set between sites of the chips for improved flexibility to accommodate individual orientations of the chips. The sheet is sufficiently large to cover an array of chips and is secured adheringly, as by use of a thermally conductive grease, to the chips. The sheet hermetically seals the chips from contamination by the coolant. The heat exchanger may be fabricated of copper with a nickel coating, wherein the copper provides the heat conduction and the nickel protects the copper from a corrosive coolant such as water. The finned sheet may be efficiently fabricated by processes analogous to those used to make printed circuits. In one embodiment of the heat exchanger, the fin thickness, the fin spacing and the sheet thickness are all approximately equal, a typical sheet thickness being approximately two mils.

Abstract translation: 用于冷却设置在共同基板上的电路芯片的阵列的热交换器形成为具有用于将热从芯片传递到流过翅片的冷却剂的直立翅片的导热材料的柔性片。 片材可以设置在芯片的位置之间设置的波纹，以提高柔性以适应芯片的各个取向。 片材足够大以覆盖芯片阵列，并且通过使用导热油脂将密封件固定到芯片上。 片材气密地密封芯片以免受冷却剂的污染。 热交换器可以由具有镍涂层的铜制成，其中铜提供热传导，并且镍保护铜免受诸如水的腐蚀性冷却剂的影响。 翅片可以通过与用于制造印刷电路的那些类似的工艺被有效地制造。 在热交换器的一个实施例中，翅片厚度，翅片间距和片材厚度大致相等，典型的片材厚度约为2密耳。