公开(公告)号：US20220128623A1

公开(公告)日：2022-04-28

申请号：US17224196

申请日：2021-04-07

Applicant: Powertech Technology Inc.

Inventor： Fu-Hsiang CHANG ,  Ming-Hsiu HSIEH ,  Yuan-Jung LU ,  Shin-Kung CHEN

IPC: G01R31/28

Abstract: A device for Over-the-Air testing includes a carrier unit, an automatic positioning member and a housing unit. The automatic positioning member is adapted to convey an object under test to an electrical connection zone of the carrier. The housing unit includes a housing shell, a pressing plate and a receiver. The housing shell defines a testing space that has an open end where the pressing plate is disposed. The housing unit and the carrier unit are movable relative to each other. When the carrier unit abuts the housing unit, the object under test is exposed to the testing space and is pressed against the electrical connection zone by the pressing plate so that electromagnetic waves from the object under test are received by the receiver.

公开(公告)号：US20220122860A1

公开(公告)日：2022-04-21

申请号：US17216209

申请日：2021-03-29

Applicant: Powertech Technology Inc.

Inventor： Po-Hung WU ,  Zun-Huan HUANG

IPC: H01L21/67 ,  B29C43/58 ,  B29C43/34 ,  H01L21/56

Abstract: A powder spraying device has a first powder spraying tube and a second powder spraying tube arranged parallelly. The first powder spraying tube has a first opening formed on a bottom thereof. A first gate is mounted moveably on the first opening to selectively cover the first opening. The second powder spraying tube has a second opening formed on a bottom thereof. A second gate is mounted moveably on the second opening to selectively cover the second opening. When the first powder spraying tube and the second powder spraying tube are filled with different plastic particles, the first opening and the second opening are opened and closed at different times to spray different plastic particles so that the specific molding method requirements are met.

公开(公告)号：US11296041B2

公开(公告)日：2022-04-05

申请号：US16698869

申请日：2019-11-27

Applicant: Powertech Technology Inc.

Inventor： Shang-Yu Chang Chien ,  Hung-Hsin Hsu ,  Nan-Chun Lin

IPC: H01L23/66 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01Q1/22 ,  H01L23/31 ,  H01L25/10 ,  H01L25/00 ,  H01L21/78 ,  H01L23/552

Abstract: An integrated antenna package structure including a chip package and an antenna device is provided. The antenna device is disposed on the chip package. The chip package includes a chip, an encapsulant, a circuit layer, and a conductive connector. The encapsulant at least directly covers the back side of the chip. The circuit layer is disposed under the encapsulant and electrically connected to the chip. The conductive connector penetrates the encapsulant and is electrically connected to the circuit layer. The antenna device includes a dielectric body, a coupling layer, and an antenna layer. The dielectric body has a first dielectric surface and a second dielectric surface opposite to the first dielectric surface. The coupling layer is disposed on the second dielectric surface of the dielectric body. The antenna layer is disposed on the first dielectric surface of the dielectric body. The antenna layer is electrically connected to the conductive connector. A manufacturing method of an integrated antenna package structure is also provided.

公开(公告)号：US20220102232A1

公开(公告)日：2022-03-31

申请号：US17318066

申请日：2021-05-12

Applicant: Powertech Technology Inc.

Inventor： Shun-Ming YU ,  Han-Ming CHU

IPC: H01L23/31 ,  H01L21/56

Abstract: A semiconductor packaging structure includes a substrate, a wiring layer, a mask layer, and a sealing layer. The substrate has an effective region and a dummy region surrounding the effective region. The wiring layer is disposed on the effective and dummy regions, and is formed with a predetermined pattern including spaced-apart protrusions to define at least one cavity partially exposing the dummy region. The mask layer covers the wiring layer, and is formed with a through hole to communicate in space with the cavity. The through hole is smaller in size than the cavity, and cooperates with the cavity to form an accommodating space. The sealing layer covers the mask layer, and includes an engaging element filling the accommodating space and adhering to the substrate.

公开(公告)号：US20220002020A1

公开(公告)日：2022-01-06

申请号：US17071384

申请日：2020-10-15

Applicant: Powertech Technology Inc.

Inventor： Ching-Chia YANG ,  Shin-Kung CHEN ,  Yuan-Jung LU ,  Yen-Yu CHEN ,  Hsing-Fu PENG ,  Pao-Chen LIN

IPC: B65C9/28 ,  B65C7/00

Abstract: A head of a tag device having a body, at least one row of negative-pressure through holes and at least one row of positive-pressure through holes. The body has a first surface and a second surface. The rows of negative and positive-pressure through holes are formed through the first and second surfaces of the body and arranged along a long-axis direction. Two negative and positive-pressure through holes at both ends of the corresponding row of negative and positive-pressure through holes are respectively close to the short sides of the body. Therefore, an effective labeling area is distributed between two short sides. The head of the tag device of the present invention provides a stable labeling operation for different products where different components are mounted and increases units per hour (UPH).

公开(公告)号：US11211350B2

公开(公告)日：2021-12-28

申请号：US16521596

申请日：2019-07-25

Applicant: Powertech Technology Inc.

Inventor： Hung-Hsin Hsu ,  Shang-Yu Chang Chien ,  Nan-Chun Lin

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L21/768 ,  H01L23/522 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes first dies, an insulating encapsulation laterally encapsulating the first dies, a second die disposed over the portion of the insulating encapsulation and at least partially overlapping the first dies, and a redistribution structure disposed on the insulating encapsulation and electrically connected to the first dies and the second die. A second active surface of the second die faces toward first active surfaces of the first dies. The redistribution structure includes a first conductive via disposed proximal to the first dies, and a second conductive via disposed proximal to the second die. The first and second conductive vias are electrically coupled and disposed in a region of the redistribution structure between the second die and one of the first dies. The first conductive via is staggered from the second conductive via by a lateral offset.

公开(公告)号：US20210373089A1

公开(公告)日：2021-12-02

申请号：US17080908

申请日：2020-10-27

Applicant: Powertech Technology Inc.

Inventor： Jian-Yu CIOU

IPC: G01R31/68 ,  G01R31/30

Abstract: A testing device includes a measuring unit, a testing board supporting the measuring unit and connected to the measuring unit, and a connecting interface coupled to the testing board. The connecting interface includes connecting terminals protruding in a direction away from the testing board, and is connected to a device under test (DUT) via the connecting terminals. When the DUT is connected to the connecting interface, the measuring unit supplies a constant electric current via the testing board and the connecting interface to the DUT for a preset duration to result in a voltage, measures the voltage, and determines, based on a result of measurement of the voltage, an electrical connection status of the DUT.

公开(公告)号：US20210327745A1

公开(公告)日：2021-10-21

申请号：US16921962

申请日：2020-07-07

Applicant: Powertech Technology Inc.

Inventor： Yi Chi Wang ,  Yu Kai Chuang

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67

Abstract: A pickup and contact device is adapted to be connected to a moving device to move a picked-up electronic element to an electrical testing zone. The moving device pressurizes the electronic element through the pickup and contact device, so that a contact point of the electronic element stably contacts a contact pad of the electrical testing zone. The pickup and contact device includes a main body including a base and a contact portion and a plurality of heat dissipation fins disposed at two opposite sides of the base. The contact portion is adapted to pick up the electronic element and to move the electronic element to the electrical testing zone along with the moving device. When the electronic element is tested in the electrical testing zone, heat emitted from the electronic element is adapted to be transmitted out through the heat dissipation fins of the main body.

公开(公告)号：US20210272907A1

公开(公告)日：2021-09-02

申请号：US16879028

申请日：2020-05-20

Applicant: Powertech Technology Inc.

Inventor： Ming-Yi WANG ,  Yu-Ping WANG

IPC: H01L23/538 ,  H01L21/48

Abstract: A redistribution layer of fan-out package and manufacturing method thereof is disclosed. Before forming a pattern wiring layer on each dielectric insulation layer, a thin metal ion layer is formed firstly. A connection between the metal ion layer and the corresponding dielectric insulation layer is weaker than that between the patterned wiring layer and the corresponding dielectric insulation layer. When the redistribution layer is placed in a high temperature and high humidity environment, the stress generated by the patterned circuit layer causes that multiple gaps to form between the metal ion layers and the corresponding dielectric insulating layer. Therefore, a distance between the adjacent dielectric insulating layer and the patterned wiring layer is increased to reduce the capacitive effect and the power consumption of the thinner redistribution layer.

公开(公告)号：US20210202390A1

公开(公告)日：2021-07-01

申请号：US17080853

申请日：2020-10-27

Applicant: Powertech Technology Inc.

Inventor： Hung-Hsin Hsu ,  Nan-Chun Lin

IPC: H01L23/538 ,  H01L23/24 ,  H01L21/48 ,  H01L23/498

Abstract: A package structure including a redistribution circuit structure, a first chip, a second chip, a first circuit board, a second circuit board, and a plurality of conductive terminals is provided. The redistribution circuit structure has a first connection surface and a second connection surface opposite to the first connection surface. The first chip and the second chip are disposed on the first connection surface and are electrically connected to the redistribution circuit structure. The first circuit board and the second circuit board are disposed on the second connection surface and are electrically connected to the redistribution circuit structure. The conductive terminals are disposed on the first circuit board or the second circuit board. The conductive terminals are electrically connected to the first circuit board or the second circuit board. A manufacturing method of a package structure is also provided.