公开(公告)号：US09460376B2

公开(公告)日：2016-10-04

申请号：US12688072

申请日：2010-01-15

Applicant: Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

Inventor： Noboru Kato ,  Satoshi Ishino ,  Takeshi Kataya ,  Ikuhei Kimura ,  Nobuo Ikemoto ,  Yuya Dokai

IPC: H01Q1/22 ,  H01Q1/24 ,  G06K19/06 ,  G06K19/077 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/14 ,  H05K1/02 ,  H05K1/16

CPC classification number: G06K19/07749 ,  G06K19/06187 ,  G06K19/0723 ,  G06K19/07756 ,  G06K19/07773 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01L23/49838 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6655 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/42 ,  H01Q1/44 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q9/30 ,  H01Q13/10 ,  H05K1/0216 ,  H05K1/0237 ,  H05K1/0239 ,  H05K1/141 ,  H05K1/16 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

Abstract translation: 无线IC器件包括：电磁耦合模块，包括布置成处理发送和接收信号的无线IC芯片和包括电感元件的馈电电路板。 馈电电路板包括电磁耦合到馈电电路的外部电极，并且外部电极电连接到屏蔽壳体或布线电缆。 屏蔽壳或接线电缆用作辐射板。 无线IC芯片由屏蔽壳或布线接收到的信号进行操作，来自无线IC芯片的应答信号从屏蔽壳或布线电缆向外部辐射。 金属部件用作辐射板，并且金属部件可以是布置在印刷线路板上的接地电极。

公开(公告)号：US09024837B2

公开(公告)日：2015-05-05

申请号：US13613021

申请日：2012-09-13

Applicant: Yuya Dokai ,  Noboru Kato

Inventor： Yuya Dokai ,  Noboru Kato

IPC: H01Q21/00 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q21/30 ,  H01Q9/16

CPC classification number: H01Q1/2208 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/16 ,  H01Q21/30

Abstract: An antenna and a wireless communication device which are suitable for an RFID system and in which radiation characteristics are prevented from being changed as a result of impedance adjustment are configured such that the antenna includes a first loop electrode that has an external shape of a regular polygon or circle and that includes a pair of open ends, feeding portions arranged inside the first loop electrode, a second loop electrode connected to the feeding portions, and a coupling electrode that couples the first loop electrode and the second loop electrode to each other. The wireless communication device is obtained by coupling the wireless communication element which processes a high-frequency signal to the feeding portions.

Abstract translation: 适用于RFID系统并且其中防止辐射特性作为阻抗调整的结果的天线和无线通信设备被配置为使得天线包括具有正多边形的外部形状的第一环形电极 或圆形，并且包括一对开口端，布置在第一环形电极内部的馈电部分，连接到馈电部分的第二环形电极，以及将第一环形电极和第二环形电极彼此耦合的耦合电极。 通过将处理高频信号的无线通信元件耦合到馈送部分来获得无线通信设备。

公开(公告)号：US08941552B2

公开(公告)日：2015-01-27

申请号：US13572722

申请日：2012-08-13

Applicant: Makoto Takeoka ,  Koji Shiroki ,  Nobuo Ikemoto ,  Yuya Dokai

Inventor： Makoto Takeoka ,  Koji Shiroki ,  Nobuo Ikemoto ,  Yuya Dokai

IPC: H01Q7/00 ,  G06K19/077 ,  H05K1/14 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q23/00 ,  H05K3/34

CPC classification number: G06K19/07749 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q23/00 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/09481 ,  H05K2201/10098

Abstract: A composite printed wiring board includes a parent board and a child board that is mounted on the parent board. A wireless IC element that processes a high-frequency signal, a loop-shaped electrode that is coupled to the wireless IC element, and a first radiator that is coupled to the loop-shaped electrode are provided on the child board. A second radiator that is coupled to the loop-shaped electrode via an electromagnetic field is provided on the parent board.

Abstract translation: 复合印刷电路板包括母板和安装在母板上的子板。 处理高频信号的无线IC元件，耦合到无线IC元件的环形电极和耦合到环形电极的第一散热器设置在子板上。 在母板上提供通过电磁场耦合到环形电极的第二辐射器。

公开(公告)号：US08725071B2

公开(公告)日：2014-05-13

申请号：US13567109

申请日：2012-08-06

Applicant: Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

Inventor： Yuya Dokai ,  Noboru Kato ,  Satoshi Ishino

IPC: H04B5/00

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US08400307B2

公开(公告)日：2013-03-19

申请号：US12959454

申请日：2010-12-03

Applicant: Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Yuya Dokai

Inventor： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura ,  Yuya Dokai

IPC: G08B13/14 ,  H04Q5/22 ,  H01L27/08 ,  H01Q1/38 ,  H01Q21/00

CPC classification number: G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H04Q2213/13095 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/10098

Abstract: A radio frequency IC device includes a radio frequency IC chip arranged to process a transmitted/received signal, a printed circuit board on which the radio frequency IC chip is mounted, an electrode arrange on the circuit board, and a loop electrode that is arranged on the circuit board so that the loop electrode is electrically connected to the radio frequency IC chip and is coupled to the electrode by electromagnetic coupling. The electrode is coupled to the radio frequency IC chip via the loop electrode so as to transmit or receive a high-frequency signal. A power supply circuit board including a resonance circuit and/or a matching circuit may be disposed between the radio frequency IC chip and the loop electrode.

Abstract translation: 射频IC器件包括布置成处理发送/接收信号的射频IC芯片，安装射频IC芯片的印刷电路板，布置在电路板上的电极和布置在电路板上的环形电极 电路板，使得环形电极电连接到射频IC芯片，并通过电磁耦合耦合到电极。 电极通过环形电极耦合到射频IC芯片，以便发送或接收高频信号。 包括谐振电路和/或匹配电路的电源电路板可以设置在射频IC芯片和环形电极之间。

公开(公告)号：US20120292396A1

公开(公告)日：2012-11-22

申请号：US13567108

申请日：2012-08-06

Applicant: Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

Inventor： Yuya DOKAI ,  Noboru KATO ,  Satoshi ISHINO

IPC: G06K19/073

CPC classification number: H05K1/0243 ,  G06K19/07749 ,  H01L23/49822 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L2223/665 ,  H01L2223/6677 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K1/0239 ,  H05K1/16 ,  H05K1/162 ,  H05K1/165 ,  H05K2201/10098 ,  H05K2201/10727 ,  Y02D70/10

Abstract: A wireless IC device includes a wireless IC chip, a power supply circuit board upon which the wireless IC chip is mounted, and in which a power supply circuit is provided, the power supply circuit includes a resonant circuit having a predetermined resonant frequency, and a radiation pattern, which is adhered to the underside of the power supply circuit board, for radiating a transmission signal supplied from the power supply circuit, and for receiving a reception signal to supply this to the power supply circuit. The resonant circuit is an LC resonant circuit including an inductance device and capacitance devices. The power supply circuit board is a multilayer rigid board or a single-layer rigid board, and between the wireless IC chip and the radiation pattern is connected by DC connection, magnetic coupling, or capacitive coupling.

Abstract translation: 无线IC器件包括无线IC芯片，安装有无线IC芯片的电源电路板，并且其中设置有电源电路，电源电路包括具有预定谐振频率的谐振电路，以及 辐射图案，其粘附到电源电路板的下侧，用于辐射从电源电路提供的传输信号，并且用于接收接收信号以将其提供给电源电路。 谐振电路是包括电感器件和电容器件的LC谐振电路。 电源电路板是多层刚性板或单层刚性板，无线IC芯片和辐射图之间通过直流连接，磁耦合或电容耦合连接。

公开(公告)号：US08228765B2

公开(公告)日：2012-07-24

申请号：US13295153

申请日：2011-11-14

Applicant: Yuya Dokai ,  Noboru Kato ,  Ikuhei Kimura

Inventor： Yuya Dokai ,  Noboru Kato ,  Ikuhei Kimura

IPC: G11B11/00

CPC classification number: G11B23/286 ,  G11B20/00086 ,  G11B20/00094 ,  G11B20/00173 ,  G11B20/0021 ,  G11B20/00253 ,  G11B20/00275 ,  G11B20/00492 ,  G11B20/00695 ,  G11B20/00876 ,  G11B23/30 ,  G11B2220/2537

Abstract: An optical disc includes an electromagnetic coupling module mounted therein. The electromagnetic coupling module includes a wireless IC chip and a feeder circuit substrate in which a feeder circuit including a resonant circuit having a predetermined resonant frequency is disposed. The electromagnetic coupling module is electromagnetically coupled to a reflective film defining a metal thin film of the optical disc, and the reflective film defines an antenna or radiation pattern of the electromagnetic coupling module.

Abstract translation: 光盘包括安装在其中的电磁耦合模块。 电磁耦合模块包括无线IC芯片和馈电电路基板，其中设置包括具有预定谐振频率的谐振电路的馈电电路。 电磁耦合模块电磁耦合到限定光盘的金属薄膜的反射膜，反射膜限定电磁耦合模块的天线或辐射图。

公开(公告)号：US08081125B2

公开(公告)日：2011-12-20

申请号：US12350307

申请日：2009-01-08

Applicant: Yuya Dokai ,  Noboru Kato

Inventor： Yuya Dokai ,  Noboru Kato

IPC: H01Q1/24

CPC classification number: H01Q1/2225 ,  G06K7/10178 ,  G06K19/07749 ,  G06K19/07756 ,  G06K19/07779 ,  G06K19/07783 ,  G06K19/07784 ,  G06K19/07786 ,  H01Q21/28

Abstract: An antenna includes a feeder terminal and a resonance circuit. The resonance circuit is defined by a capacitance element and an inductance element and includes first and second radiation plates. The capacitance element is electromagnetically coupled to the first radiation plate, and the inductance element is electromagnetically coupled to the second radiation plate. A radio IC device includes an electromagnetic coupling module including a feeder circuit substrate on which a radio IC chip is mounted, and radiation plates. The feeder circuit substrate includes an inductance element and a capacitance element. One of the radiation plates faces and is magnetically coupled to the inductance element. The other radiation plate faces and is electrically coupled to the capacitance element. The radio IC chip is operated by signals received by the radiation plates, and a response signal from the radio IC chip is radiated from the radiation plates.

Abstract translation: 天线包括馈线端子和谐振电路。 谐振电路由电容元件和电感元件限定，并且包括第一和第二辐射板。 电容元件与第一辐射板电磁耦合，电感元件与第二辐射板电磁耦合。 无线IC设备包括电磁耦合模块，其包括安装无线IC芯片的馈电电路基板和辐射板。 馈电电路基板包括电感元件和电容元件。 辐射板之一面向磁耦合到电感元件。 另一个辐射板面并且电耦合到电容元件。 无线电IC芯片由辐射板接收的信号操作，并且来自无线IC芯片的响应信号从辐射板辐射。

公开(公告)号：US08081121B2

公开(公告)日：2011-12-20

申请号：US12401767

申请日：2009-03-11

Applicant: Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

Inventor： Noboru Kato ,  Yuya Dokai ,  Nobuo Ikemoto

IPC: H01Q1/38

CPC classification number: H04B5/0012 ,  G06K7/10178 ,  G06K19/04 ,  G06K19/07749

Abstract: An article having an electromagnetic coupling module attached thereto includes an electromagnetic coupling module and a PET bottle having the electromagnetic coupling module bonded thereto. The electromagnetic coupling module includes a wireless IC chip arranged to process transmission and reception signals and the feed circuit board having the wireless IC chip mounted thereon. The feed circuit board includes a feed circuit including a resonant circuit having a predetermined resonant frequency. The feed circuit performs characteristic impedance matching between the PET bottle and the wireless IC chip. The PET bottle functions as a radiator arranged to radiate a transmission signal supplied from the feed circuit using electromagnetic field coupling and to supply a received reception signal to the feed circuit using electromagnetic field coupling.

Abstract translation: 具有附接有电磁耦合模块的物品包括电磁耦合模块和具有与其结合的电磁耦合模块的PET瓶。 电磁耦合模块包括布置成处理发送和接收信号的无线IC芯片以及安装有无线IC芯片的馈电电路板。 馈电电路板包括具有预定谐振频率的谐振电路的馈电电路。 馈电电路执行PET瓶和无线IC芯片之间的特征阻抗匹配。 PET瓶用作散热器，其布置成使用电磁场耦合辐射从馈电电路提供的传输信号，并使用电磁场耦合将接收到的接收信号提供给馈电电路。

公开(公告)号：US20110279326A1

公开(公告)日：2011-11-17

申请号：US13088480

申请日：2011-04-18

Applicant: Yuya DOKAI ,  Nihei KAISHITA ,  Hiroshi NONOGAKI ,  Ryohei GOTO ,  Takahiro YAMAGUCHI ,  Kazuyuki IKEDA

Inventor： Yuya DOKAI ,  Nihei KAISHITA ,  Hiroshi NONOGAKI ,  Ryohei GOTO ,  Takahiro YAMAGUCHI ,  Kazuyuki IKEDA

IPC: H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/2225 ,  H01Q7/00

Abstract: A wireless IC device includes a substantially rectangular parallelepiped dielectric body, a metal pattern that is provided on the surface of the dielectric body via a film and functions as a radiator, and a wireless IC element coupled to feeding portions of the metal pattern. The dielectric body has a laminated structure including a folded flexible dielectric layer. Surfaces of the dielectric layer which face each other after the dielectric layer has been folded are non-bonded surfaces.

Abstract translation: 无线IC器件包括基本上为长方体的电介体，金属图案，其通过膜设置在电介质体的表面上并用作散热器，以及耦合到金属图案的馈电部分的无线IC元件。 电介质体具有包括折叠的柔性介电层的叠层结构。 在电介质层折叠之后彼此面对的电介质层的表面是非接合表面。