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公开(公告)号：US20210094272A1
公开(公告)日：2021-04-01
申请号：US15733300
申请日：2018-12-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： James Zhu , Karl K. Stensvad , Daniel M. Lentz , Thomas J. Metzler , Moses M. David
Abstract: A method of applying a pattern to a nonplanar surface. A stamp has a major surface with pattern elements having a lateral dimension of greater than 0 and less than about 5 microns. The major surface of the stamp has a functionalizing molecule with a functional group selected to chemically bind to the nonplanar surface. The stamp is positioned to initiate rolling contact with the nonplanar surface, and contacts the nonplanar surface to form a self-assembled monolayer (SAM) of the functionalizing material thereon and impart the arrangement of pattern elements thereto. The major surface of the stamp is translated with respect to the nonplanar surface such that: a contact pressure is controlled at an interface between the stamping surfaces and the nonplanar surface, and a contact force at the interface is allowed to vary while the stamping surfaces and the nonplanar surface are in contact with each other.
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公开(公告)号：US20210035875A1
公开(公告)日：2021-02-04
申请号：US16976126
申请日：2019-02-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Saagar A. Shah , Thomas J. Metzler , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen
IPC: H01L23/16 , H01L23/31 , H01L23/544 , H01L23/498 , H01L21/56 , H01L21/54
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed at a registration area of a substrate. Fluid channels extend into the registration area and have a portion underneath the bottom surface of the solid circuit die. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward contact pads on the bottom surface of the circuit die to obtain the automatic registration.
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公开(公告)号：US10882068B2
公开(公告)日：2021-01-05
申请号：US16304352
申请日：2017-05-15
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Jonathan J. O'Hare , Karl K. Stensvad , Daniel H. Carlson , Glen A. Jerry , Mikhail L. Pekurovsky , Gary W. Maier , James Zhu
IPC: B05C5/02 , B05C9/06 , B05D1/26 , B29C48/25 , B29C48/255 , B29C65/52 , B29C48/465
Abstract: Coating apparatuses and methods are provided for direct coatings with various shapes. The coating apparatus includes a die body with one or more bores. One or more cams are pivotally mounted within the bores and have one or more recessed areas formed into the respective peripheral surfaces thereof. The one or more cams are rotatable within the die body to dynamically, independently vary the width or shape of the respectively dispensed one or more fluid coatings.
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公开(公告)号：US20190273061A1
公开(公告)日：2019-09-05
申请号：US16461015
申请日：2017-11-16
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ankit Mahajan , Mikhail L. Pekurovsky , Matthew S. Stay , Daniel J. Theis , Ann M. Gillman , Shawn C. Dodds , Thomas J. Metzler , Matthew R.D. Smith , Roger W. Barton , Joseph E. Hernandez , Saagar A. Shah , Kara A. Meyers , James Zhu , Teresa M. Goeddel , Lyudmila A. Pekurovsky , Jonathan W. Kemling , Jeremy K. Larsen , Jessica Chiu , Kayla C. Niccum
IPC: H01L23/00
Abstract: Processes for automatic registration between a solid circuit die and electrically conductive interconnects, and articles or devices made by the same are provided. The solid circuit die is disposed on a substrate with contact pads aligned with channels on the substrate. Electrically conductive traces are formed by flowing a conductive liquid in the channels toward the contact pads to obtain the automatic registration.
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公开(公告)号：US12263656B2
公开(公告)日：2025-04-01
申请号：US17250995
申请日：2019-11-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Karl K. Stensvad , Edwin L Kusilek , Matthew S. Stay , Caleb T. Nelson , Christopher S. Lyons , Moses M. David , Jeffrey L. Solomon , Martin B. Wolk , Nicholas C. Erickson , James Zhu , James M. Nelson
Abstract: Materials and methods useful in forming nano-scale features on substrates, and articles such as optical films incorporating such nano-scale patterned substrates.
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Patent Agency Ranking
公开(公告)号：US12235577B2
公开(公告)日：2025-02-25
申请号：US18257241
申请日：2021-12-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Lucas J. Hunt , Ashley R. Sonnier , James Zhu , Edwin L. Kusilek , Paul B. Armstrong , William B. Kolb , Caleb T. Nelson , Jeffrey L. Solomon , James M. Nelson , Samuel R. Hei , David J. Tarnowski , Henrik B. van Lengerich
IPC: G03F7/00 , B29C59/00 , H01L21/027
Abstract: Methods of forming an array of patterns on a substrate are provided. An array of protective tiles formed from a protectant resin is provided to cover an array of sub-regions on the substrate. An array of patterns is formed on the substrate by sequentially repeating steps (i) and (ii) for each sub-region: (i) removing the protective tile from one of the sub-regions to expose the first major surface underneath; and (ii) forming a pattern on the exposed first major surface within the one of the sub-regions.
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公开(公告)号：US20240045324A1
公开(公告)日：2024-02-08
申请号：US18257241
申请日：2021-12-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Lucas J. Hunt , Ashley R. Sonnier , James Zhu , Edwin L. Kusilek , Paul B. Armstrong , William B. Kolb , Caleb T. Nelson , Jeffrey L. Solomon , James M. Nelson , Samuel R. Hei , David J. Tarnowski , Henrik B. van Lengerich
IPC: G03F7/00
CPC classification number: G03F7/0002
Abstract: Methods of forming an array of patterns on a substrate are provided. An array of protective tiles formed from a protectant resin is provided to cover an array of sub-regions on the substrate. An array of patterns is formed on the substrate by sequentially repeating steps (i) and (ii) for each sub-region: (i) removing the protective tile from one of the sub-regions to expose the first major surface underneath; and (ii) forming a pattern on the exposed first major surface within the one of the sub-regions.
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公开(公告)号：US20230026261A1
公开(公告)日：2023-01-26
申请号：US17756392
申请日：2020-12-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Myungchan Kang , Daniel M. Lentz , Masayuki Nakamura , Karl K. Stensvad , James Zhu
IPC: G01N21/552
Abstract: A sensor element and sensor comprising the sensing element. The sensor includes, in order, an absorptive layer, a metallic layer and an optically transparent, dielectric substrate. The absorptive layer has a polymer of intrinsic microporosity having an average pore volume of at least 0.1 nm3. The metallic layer has a plurality of openings each extending from the first to the second major surface of the metallic layer, the openings having a pitch in a range from 50 nm to 5000 nm, wherein the openings have an opening size in a range from 5% to 95% percent of the pitch.
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公开(公告)号：US20210260901A1
公开(公告)日：2021-08-26
申请号：US17247209
申请日：2019-06-21
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： James Zhu , Karl K. Stensvad , Daniel M. Lentz , Thomas J. Metzler , Moses M. David , Jennifer A. Timm , Terrance A. Pechacek
Abstract: A method of applying a pattern to a nonplanar surface with a radius of curvature. A stamp with a major surface has a relief pattern of pattern elements extending away from a base surface. Each pattern element has a stamping surface with a lateral dimension 0 to 5 microns. An ink applied on the stamping surface includes a functionalizing molecule with a functional group that chemically binds to the nonplanar surface. The stamp is positioned to initiate rolling contact between the nonplanar surface and the major surface of the stamp. The stamping surface of the pattern elements contacts the nonplanar surface to form a self-assembled monolayer of the functionalizing material on the nonplanar surface and impart the arrangement of pattern elements. A relative position of the stamping surface is controlled with respect to the nonplanar surface while the major surface of the stamp contacts the nonplanar surface.
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公开(公告)号：US20210178622A1
公开(公告)日：2021-06-17
申请号：US16758604
申请日：2018-10-18
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Thomas J. Metzler , James Zhu , Daniel J. Theis , David D. Miller , Donald G. Peterson , Mikhail L. Pekurovsky
Abstract: Methods and apparatuses for generating fiducials via die cutting are provided. Laterally arranged die cutting members and fiducial-making members are provided onto a roller to respectively cut a first pattern and a fiducial mark on the same side of a web in a rotatory die cutting process. The fiducial mark is used to register a second pattern provided by a downstream station to the first pattern.
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