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公开(公告)号：US20240053677A1
公开(公告)日：2024-02-15
申请号：US18259122
申请日：2021-12-28
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ashley R. Sonnier , James Zhu , Lucas J. Hunt , Edwin L. Kusilek , Paul B. Armstrong
IPC: G03F7/00
CPC classification number: G03F7/0002 , G03F7/0017
Abstract: Methods of forming an array of patterns on a substrate are provided. A replication medium is coated onto a relief structure of a patterned template and solidified. Patterned templates with the replication medium are transferred to an array of sub-regions of a tiling region of a substrate, where heat and/or radiation can be applied to the replication medium. The patterned templates are then removed from the substrate to form a patterned surface structure on the substrate.
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公开(公告)号：US20210161018A1
公开(公告)日：2021-05-27
申请号：US17252826
申请日：2019-06-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Matthew S. Stay , Caleb T. Nelson , David J. Tarnowski , David J. Rowe , Edwin L. Kusilek
Abstract: Methods of making metal patterns on flexible substrates are provided. Releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. Metal patterns on the flexible substrate can be formed by removing the releasable solid layer after metallization. In some cases, the releasable solid layer can be transferred from the patterned surface to a transfer layer where the metal patterns are formed.
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Patent Agency Ranking
公开(公告)号：US11950372B2
公开(公告)日：2024-04-02
申请号：US17252826
申请日：2019-06-27
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Matthew S. Stay , Caleb T. Nelson , David J. Tarnowski , David J. Rowe , Edwin L. Kusilek
CPC classification number: H05K3/048 , H05K1/028 , H05K3/0014 , H05K2201/09036 , H05K2203/0769
Abstract: Methods of making metal patterns on flexible substrates are provided. Releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. Metal patterns on the flexible substrate can be formed by removing the releasable solid layer after metallization. In some cases, the releasable solid layer can be transferred from the patterned surface to a transfer layer where the metal patterns are formed.
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公开(公告)号：US20210347135A1
公开(公告)日：2021-11-11
申请号：US17250995
申请日：2019-11-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Karl K. Stensvad , Edwin L. Kusilek , Mathew S. Stay , Caleb T. Nelson , Christopher S. Lyons , Moses M. David , Jeffrey L. Solomon , Martin B. Wolk , Nicholas C. Erickson , James Zhu , James M. Nelson
Abstract: Materials and methods useful in forming nano-scale features on substrates, and articles such as optical films incorporating such nano-scale patterned substrates.
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公开(公告)号：US12235577B2
公开(公告)日：2025-02-25
申请号：US18257241
申请日：2021-12-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Lucas J. Hunt , Ashley R. Sonnier , James Zhu , Edwin L. Kusilek , Paul B. Armstrong , William B. Kolb , Caleb T. Nelson , Jeffrey L. Solomon , James M. Nelson , Samuel R. Hei , David J. Tarnowski , Henrik B. van Lengerich
IPC: G03F7/00 , B29C59/00 , H01L21/027
Abstract: Methods of forming an array of patterns on a substrate are provided. An array of protective tiles formed from a protectant resin is provided to cover an array of sub-regions on the substrate. An array of patterns is formed on the substrate by sequentially repeating steps (i) and (ii) for each sub-region: (i) removing the protective tile from one of the sub-regions to expose the first major surface underneath; and (ii) forming a pattern on the exposed first major surface within the one of the sub-regions.
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公开(公告)号：US20240206076A1
公开(公告)日：2024-06-20
申请号：US18591060
申请日：2024-02-29
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Henrik B. van Lengerich , Matthew S. Stay , Caleb T. Nelson , David J. Tarnowski , David J. Rowe , Edwin L. Kusilek
CPC classification number: H05K3/048 , H05K1/028 , H05K3/0014 , H05K2201/09036 , H05K2203/0769
Abstract: Methods of making metal patterns on flexible substrates are provided. A releasable solid layer is selectively formed on a patterned surface of the flexible substrate by applying a liquid solution thereon. The releasable solid layer is transferred from the patterned surface to a transfer layer where the metal patterns are formed.
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公开(公告)号：US20240045324A1
公开(公告)日：2024-02-08
申请号：US18257241
申请日：2021-12-08
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Lucas J. Hunt , Ashley R. Sonnier , James Zhu , Edwin L. Kusilek , Paul B. Armstrong , William B. Kolb , Caleb T. Nelson , Jeffrey L. Solomon , James M. Nelson , Samuel R. Hei , David J. Tarnowski , Henrik B. van Lengerich
IPC: G03F7/00
CPC classification number: G03F7/0002
Abstract: Methods of forming an array of patterns on a substrate are provided. An array of protective tiles formed from a protectant resin is provided to cover an array of sub-regions on the substrate. An array of patterns is formed on the substrate by sequentially repeating steps (i) and (ii) for each sub-region: (i) removing the protective tile from one of the sub-regions to expose the first major surface underneath; and (ii) forming a pattern on the exposed first major surface within the one of the sub-regions.
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