公开(公告)号：US09485852B2

公开(公告)日：2016-11-01

申请号：US14143465

申请日：2013-12-30

Applicant: ABB AG

Inventor： Stefan Gutermuth

IPC: H05K1/02

CPC classification number: H05K1/021 ,  H05K1/0201 ,  H05K1/0203 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972

Abstract: An arrangement for cooling subassemblies of an automation or control system is disclosed, wherein the subassemblies each comprise at least one printed circuit board (LP) having electronic components of different temperature sensitivity arranged thereon. The printed circuit board (LP) has at least one first portion for temperature-sensitive components and at least one second portion for temperature-insensitive components that generate waste heat. Interspaces are arranged between the first portion and the second portion, the interspaces each forming a thermally insulated trench. Means can be provided which keep away the heat over the temperature-sensitive components in a suitable manner and dissipate the waste heat from the printed circuit board (LP) before the heat reaches the temperature-sensitive components.

Abstract translation: 公开了一种用于冷却自动化或控制系统的子组件的装置，其中每个子组件包括至少一个布置有不同温度敏感度的电子部件的印刷电路板（LP）。 印刷电路板（LP）具有用于温度敏感部件的至少一个第一部分和用于产生废热的不敏感温度部件的至少一个第二部分。 间隙布置在第一部分和第二部分之间，间隙各自形成绝热沟槽。 可以提供能够以合适的方式将热量超过温度敏感部件的装置，并且在热到达温度敏感部件之前散发来自印刷电路板（LP）的废热。