公开(公告)号：US20180190600A1

公开(公告)日：2018-07-05

申请号：US15396107

申请日：2016-12-30

Applicant: Analog Devices, Inc.

Inventor： Youn-Jae Kook ,  Yeonsung Kim ,  Dipak Sengupta

IPC: H01L23/66 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/66 ,  H01L23/04 ,  H01L23/3107 ,  H01L23/49534 ,  H01L23/49555 ,  H01L23/49827 ,  H01L23/552 ,  H01L25/105 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/15192 ,  H01L2924/181 ,  H01Q1/2283 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.

公开(公告)号：US09142470B2

公开(公告)日：2015-09-22

申请号：US14274531

申请日：2014-05-09

Applicant: ANALOG DEVICES, INC.

Inventor： Jicheng Yang ,  Asif Chowdhury ,  Manolo Mena ,  Jia Gao ,  Richard Sullivan ,  Thomas Goida ,  Carlo Tiongson ,  Dipak Sengupta

IPC: H04B1/06 ,  H01L23/053 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/053 ,  B81B7/0064 ,  B81C1/00269 ,  H01L23/04 ,  H01L23/06 ,  H01L23/10 ,  H01L23/552 ,  H01L23/564 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.

Abstract translation: 提供封装的集成器件及其形成方法。 在一个实施例中，封装集成器件包括封装衬底，封装盖以及集成电路或微机电系统（MEMS）器件。 封装盖使用环氧树脂安装到封装基板的第一表面上，封装盖和封装基板限定封装内部。 包装盖包括适合于与环氧树脂的良好粘附性的内部涂层，以及适用于RF屏蔽的外部涂层，其中内部和外部涂层的材料不同。 在一个实例中，内盖涂层是镍，而外盖涂层是锡。

公开(公告)号：US20130129136A1

公开(公告)日：2013-05-23

申请号：US13661401

申请日：2012-10-26

Applicant: Analog Devices, Inc.

Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

IPC: H04R1/04

CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。