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    APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS
    12.
    发明申请
    APPARATUS, SYSTEMS, AND METHODS FOR TEMPERATURE CONTROL OF SUBSTRATES USING EMBEDDED FIBER OPTICS AND EPOXY OPTICAL DIFFUSERS 审中-公开
    使用嵌入式光纤和环氧光学扩散器的基板温度控制的装置，系统和方法

    公开(公告)号：US20160007412A1

    公开(公告)日：2016-01-07

    申请号：US14738448

    申请日：2015-06-12

    Applicant: Applied Materials, Inc.

    Inventor： Matthew Busche ,  Wendell Boyd, JR. ,  Todd J. Egan ,  Gregory L. Kirk ,  Vijay D. Parkhe ,  Michael R. Rice ,  Leon Volfovski

    IPC: H05B3/00 ,  H05B3/26 ,  H05B3/14 ,  H01L21/67 ,  H05B3/06

    Abstract: Substrate temperature control apparatus and electronic device manufacturing systems provide pixelated light-based heating to a substrate in a process chamber. A substrate holder in the process chamber may include a baseplate. The baseplate has a top surface that may have a plurality of cavities and a plurality of grooves connected to the cavities. Optical fibers may be received in the grooves such that each cavity has a respective optical fiber terminating therein to transfer light thereto. Some or all of the cavities may have an epoxy optical diffuser disposed therein to diffuse light provided by the optical fiber. A ceramic plate upon which a substrate may be placed may be bonded to the baseplate. A thermal spreader plate may optionally be provided between the baseplate and the ceramic plate. Methods of controlling temperature across a substrate holder in an electronic device manufacturing system are also provided, as are other aspects.

    Abstract translation: 基板温度控制装置和电子装置制造系统向处理室中的基板提供像素化的基于光的加热。 处理室中的衬底保持器可以包括底板。 底板具有可以具有多个空腔的顶表面和连接到空腔的多个凹槽。 光纤可以被容纳在槽中，使得每个空腔具有终止于其中的相应光纤以将光传送到其上。 一些或所有空腔可以具有设置在其中的环氧光学漫射器以漫射由光纤提供的光。 可以将衬底放置在其上的陶瓷板可以结合到基板。 可以可选地在基板和陶瓷板之间设置散热板。 还提供了在电子设备制造系统中控制衬底保持器温度的方法，以及其他方面。

    PROCESS KIT ENCLOSURE SYSTEM
    14.
    发明申请
    PROCESS KIT ENCLOSURE SYSTEM 有权

    公开(公告)号：US20250087524A1

    公开(公告)日：2025-03-13

    申请号：US18958317

    申请日：2024-11-25

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

    Abstract: A process kit enclosure system includes walls and a retention device structure. The retention device structure includes a retention device post and a retention device fin. The retention device fin in a first position is disposed above and secures a process kit ring supported in the interior volume of the process kit enclosure system. The retention device fin is rotated from the first position to be in a second position to be outside a boundary of the process kit ring. The retention device post is aligned with and inserts into a recess formed by a top cover of the process kit enclosure system responsive to the retention device post being in the first position. The retention device post is misaligned with and blocked from inserting into the recess formed by the top cover responsive to the retention device post of the retention device structure being in the second position.

    Process kit enclosure system
    15.
    发明授权
    Process kit enclosure system 有权

    公开(公告)号：US12165905B2

    公开(公告)日：2024-12-10

    申请号：US16417348

    申请日：2019-05-20

    Applicant: Applied Materials, Inc.

    Inventor： Helder Lee ,  Nicholas Michael Kopec ,  Leon Volfovski ,  Douglas R. McAllister ,  Andreas Schmid ,  Jeffrey Hudgens ,  Yogananda Sarode Vishwanath ,  Steven Babayan

    IPC: H01L21/687 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

    Abstract: A process kit enclosure system includes surfaces to enclose an interior volume, a first support structure including first fins, a second support structure including second fins, and a front interface to interface the process kit enclosure system with a load port of a wafer processing system. The first and second fins are sized and spaced to hold process kit ring carriers and process kit rings in the interior volume. Each of the process kit rings is secured to one of the process kit ring carriers. The process kit enclosure system enables first automated transfer of a first process kit ring carrier securing a first process kit ring from the process kit enclosure system into the wafer processing system and second automated transfer of a second process kit ring carrier securing a second process kit ring from the wafer processing system into the process kit enclosure system.

    Substrate support with feedthrough structure
    19.
    发明授权
    Substrate support with feedthrough structure 有权

    公开(公告)号：US09706605B2

    公开(公告)日：2017-07-11

    申请号：US13845492

    申请日：2013-03-18

    Applicant: APPLIED MATERIALS, INC.

    Inventor： Leon Volfovski ,  Mayur G. Kulkarni

    IPC: H05B3/26 ,  H01L21/67 ,  H01L21/687

    CPC classification number: H05B3/26 ,  H01L21/67103 ,  H01L21/68792

    Abstract: Apparatus for providing electrical currents and substrate supports utilizing the same are provided. In some embodiments, a feedthrough structure may include a body having a wall defining one or more openings disposed through the body from a first end to a second end; one or more first conductors and one or more second conductors each disposed in the wall from the first end to the second end; and a plurality of conductive mesh disposed in the wall, at least one conductive mesh surrounding a first region of the wall including the one or more first conductors and at least one conductive mesh surrounding a second region of the wall including the one or more second conductors, wherein the plurality of conductive mesh substantially electrically insulates the first and second regions from respective first and second external electromagnetic fields respectively disposed outside the first and second regions.

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