公开(公告)号：US20230266681A1

公开(公告)日：2023-08-24

申请号：US18012799

申请日：2021-06-09

Applicant: ASML Holding N.V.

Inventor： Mohamed SWILLAM ,  Justin Lloyd KREUZER ,  Stephen ROUX

IPC: G03F9/00

CPC classification number: G03F9/7019 ,  G03F9/7065

Abstract: Systems, apparatuses, and methods are provided for determining the alignment of a substrate. An example method can include emitting a multi-wavelength radiation beam including a first wavelength and a second wavelength toward a region of a surface of a substrate. The example method can further include measuring a first diffracted radiation beam indicative of first order diffraction at the first wavelength in response to an irradiation of the region by the multi-wavelength radiation beam. The example method can further include measuring a second diffracted radiation beam indicative of first order diffraction at the second wavelength in response to the irradiation of the region by the multi-wavelength radiation beam. Subsequently, the example method can include generating, based on the measured first set of photons and the measured second set of photons, an electronic signal for use in determining an alignment position of the substrate.

公开(公告)号：US20220283516A1

公开(公告)日：2022-09-08

申请号：US17637942

申请日：2020-08-05

Applicant: ASML Holding N.V. ,  ASML Netherlands B.V.

Inventor： Mohamed SWILLAM ,  Stephen ROUX ,  Tamer Mohamed Tawfik Ah ELAZHARY ,  Arie Jeffrey DEN BOEF

IPC: G03F7/20 ,  G02B6/122 ,  G02B26/08

Abstract: A sensor apparatus includes a sensor chip, an illumination system, a first optical system, a second optical system, and a detector system. The illumination system is coupled to the sensor chip and transmits an illumination beam along an illumination path. The first optical system is coupled to the sensor chip and includes a first integrated optic to configure and transmit the illumination beam toward a diffraction target on a substrate, disposed adjacent to the sensor chip, and generate a signal beam including diffraction order sub-beams generated from the diffraction target. The second optical system is coupled to the sensor chip and includes a second integrated optic to collect and transmit the signal beam from a first side to a second side of the sensor chip. The detector system is configured to measure a characteristic of the diffraction target based on the signal beam transmitted by the second optical system.

公开(公告)号：US20210181640A1

公开(公告)日：2021-06-17

申请号：US16760357

申请日：2018-10-05

Applicant: ASML Holding N.V.

Inventor： Stephen ROUX ,  Christopher William REED

IPC: G03F7/20 ,  H01L21/033

Abstract: An optical assembly and a method of making an optical assembly in which additive manufacturing techniques are used to form a support structure either directly on an optical element or on a carrier that is subsequently bonded to an optical element.