公开(公告)号：US11224132B2

公开(公告)日：2022-01-11

申请号：US16563713

申请日：2019-09-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I. Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H05K3/28 ,  H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K1/14

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US10217649B2

公开(公告)日：2019-02-26

申请号：US15619415

申请日：2017-06-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jin-Yuan Lai ,  Tang-Yuan Chen ,  Ying-Xu Lu ,  Dao-Long Chen ,  Kwang-Lung Lin ,  Chih-Pin Hung ,  Tse-Chuan Chou ,  Ming-Hung Chen ,  Chi-Hung Pan

IPC: H01L23/49 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48 ,  H01L23/498

Abstract: A semiconductor device package includes a substrate, a semiconductor device, and an underfill. The substrate includes a top surface defining a mounting area, and a barrier section on the top surface and adjacent to the mounting area. The semiconductor device is mounted on the mounting area of the substrate. The underfill is disposed between the semiconductor device and the mounting area and the barrier section of the substrate. A contact angle between a surface of the underfill and the barrier section is greater than or equal to about 90 degrees.

公开(公告)号：US09589871B2

公开(公告)日：2017-03-07

申请号：US14685529

申请日：2015-04-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tang-Yuan Chen ,  Chin-Li Kao ,  Kuo-Hua Chen ,  Ming-Hung Chen ,  Dao-Long Chen

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49548 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/562 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/20 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32245 ,  H01L2224/32502 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/83801 ,  H01L2224/83805 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00014

Abstract: The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.

Abstract translation: 本公开涉及一种半导体封装结构及其制造方法。 半导体封装结构包括引线框和半导体管芯。 引线框架包括主体部分和突出部分。 半导体管芯结合到主要部分的第一表面。 突出部分从主体部分的第二表面突出。 突起部分的位置对应于半导体管芯的位置。

公开(公告)号：US12300630B2

公开(公告)日：2025-05-13

申请号：US18212162

申请日：2023-06-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Zheng Wei Wu

IPC: H01L23/552 ,  H01L21/50 ,  H01L21/768 ,  H01L21/78 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

公开(公告)号：US11942385B2

公开(公告)日：2024-03-26

申请号：US17707803

申请日：2022-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Sheng-Yu Chen ,  Chang-Lin Yeh ,  Ming-Hung Chen

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L23/538 ,  H01L25/065

CPC classification number: H01L23/3135 ,  H01L21/565 ,  H01L23/291 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L2224/16227 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/351

Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.

公开(公告)号：US11744024B2

公开(公告)日：2023-08-29

申请号：US17573595

申请日：2022-01-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H01L23/00 ,  H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K9/00 ,  H05K3/28 ,  H05K1/14

CPC classification number: H05K5/0017 ,  H05K1/142 ,  H05K1/144 ,  H05K1/181 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H05K2201/041 ,  H05K2201/10037 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11437415B2

公开(公告)日：2022-09-06

申请号：US16557990

申请日：2019-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Yung I. Yeh ,  Chang-Lin Yeh ,  Sheng-Yu Chen

IPC: H01L33/24 ,  H01L27/12 ,  H01L33/62 ,  H01L25/075 ,  H01L33/54

Abstract: A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to the first surface. The thin film transistor (TFT) module is disposed adjacent to and electrically connected to the first surface of the main substrate. The first electronic component is disposed adjacent to and electrically connected to the first surface of the main substrate. The encapsulant covers the at least one thin film transistor (TFT) module and the at least one first electronic component. The light emitting devices are electrically connected to the at least one thin film transistor (TFT) module.

公开(公告)号：US11081473B2

公开(公告)日：2021-08-03

申请号：US16550111

申请日：2019-08-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Hung Chen ,  Sheng-Yu Chen ,  Chang-Lin Yeh ,  Yung-I Yeh

IPC: H01L25/16 ,  H01L23/00 ,  H01L33/56 ,  H01L23/48 ,  H01L23/528 ,  H01L27/12 ,  H01L33/62 ,  H01L23/522 ,  H01L21/285

Abstract: A semiconductor device package includes a first substrate, a dielectric layer, a thin film transistor (TFT) and an electronic component. The first substrate has a first surface and a second surface opposite to the first surface. The dielectric layer is disposed on the first surface of the first substrate. The dielectric layer has a first surface facing away from the first substrate and a second surface opposite to the first surface. The TFT layer is disposed on the dielectric layer. The electronic component is disposed on the second surface of the first substrate. A roughness of the first surface of the dielectric layer is less than a roughness of the first surface of the first substrate.