公开(公告)号：US10566680B2

公开(公告)日：2020-02-18

申请号：US15911082

申请日：2018-03-03

Applicant: Amkor Technology, Inc.

Inventor： Marc Alan Mangrum

IPC: H01Q1/22 ,  H01Q9/04

Abstract: A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

公开(公告)号：US10211128B2

公开(公告)日：2019-02-19

申请号：US15615769

申请日：2017-06-06

Applicant: Amkor Technology, Inc.

Inventor： Marc Alan Mangrum

IPC: H01L23/495 ,  H01L23/40 ,  H01L21/02

Abstract: An electronic device structure includes a leadframe with a die pad and a lead. A semiconductor die is mounted adjacent to the die pad. A clip having a clip tail section is attached to the lead. The clip further has a clip top section attached to the clip tail section, and the clip top section is attached to a die top side of the semiconductor die with a conductive material. The clip further has an opening disposed to extend through the clip top section. In one embodiment, after a reflow step the conductive material forms a conductive fillet at least partially covering sidewall surfaces of the opening, and has a height within the opening with respect to a bottom surface of the clip top section. The opening and the conductive fillet provide an improved approach to monitoring coverage of the conductive material between the clip top section and the die top side of the semiconductor die.

公开(公告)号：US09917039B2

公开(公告)日：2018-03-13

申请号：US15134330

申请日：2016-04-20

Applicant: Amkor Technology Inc.

Inventor： Marc Alan Mangrum ,  Thinh Van Pham

IPC: H01L21/00 ,  H01L23/495 ,  H01L21/48 ,  H01L27/092

CPC classification number: H01L23/49562 ,  H01L21/4825 ,  H01L21/4828 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L23/49551 ,  H01L24/73 ,  H01L27/0922 ,  H01L2224/05553 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of forming a packaged semiconductor device includes providing a conductive frame structure. The conductive frame structure includes a first frame having leadfingers configured for directly attaching to a semiconductor device, such as an integrated power semiconductor device that includes both power devices and logic type devices. The leadfingers are further configured to provide high current capacity and a high thermal dissipation capacity for the power device portion of the semiconductor device. In one embodiment, the conductive frame structure further includes a second frame joined to the first frame. The second frame includes a plurality of leads configured to electrically connect to low power device portions of the semiconductor device. A package body is formed to encapsulate the semiconductor device and at least portions of the leadfingers and leads.

公开(公告)号：US20190043789A1

公开(公告)日：2019-02-07

申请号：US16042566

申请日：2018-07-23

Applicant: Amkor Technology, Inc.

Inventor： Marc Alan Mangrum

IPC: H01L23/495 ,  H01L21/48

Abstract: Methods and system for flip chip alignment for substrate and leadframe applications are disclosed and may include placing a semiconductor die on bond fingers of a metal leadframe, wherein at least two of the bond fingers comprise one or more recessed self-alignment features. A reflow process may be performed on the semiconductor die and leadframe, thereby melting solder bumps on the semiconductor die such that a solder bump may be pulled into each of the recessed self-alignment features and aligning the solder bumps on the semiconductor die to the bond fingers. The recessed self-alignment features may be formed utilizing a chemical etch process or a stamping process. A surface of the recessed self-alignment features or the bond fingers of the metal leadframe may be roughened. A solder paste may be formed in the recessed self-alignment features prior to placing the semiconductor die on the bond fingers of the metal leadframe.

公开(公告)号：US20180374800A1

公开(公告)日：2018-12-27

申请号：US16043645

申请日：2018-07-24

Applicant: Amkor Technology, Inc.

Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

IPC: H01L23/00 ,  H01L23/495 ,  B81B1/00 ,  H01L23/16 ,  H01L23/31

Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

公开(公告)号：US10032699B1

公开(公告)日：2018-07-24

申请号：US14264027

申请日：2014-04-28

Applicant: Amkor Technology, Inc.

Inventor： Marc Alan Mangrum

IPC: H01L23/495 ,  H01L21/48

Abstract: Methods and system for flip chip alignment for substrate and leadframe applications are disclosed and may include placing a semiconductor die on bond fingers of a metal leadframe, wherein at least two of the bond fingers comprise one or more recessed self-alignment features. A reflow process may be performed on the semiconductor die and leadframe, thereby melting solder bumps on the semiconductor die such that a solder bump may be pulled into each of the recessed self-alignment features and aligning the solder bumps on the semiconductor die to the bond fingers. The recessed self-alignment features may be formed utilizing a chemical etch process or a stamping process. A surface of the recessed self-alignment features or the bond fingers of the metal leadframe may be roughened. A solder paste may be formed in the recessed self-alignment features prior to placing the semiconductor die on the bond fingers of the metal leadframe.