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    SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS
    1.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS 审中-公开

    公开(公告)号：US20190122964A1

    公开(公告)日：2019-04-25

    申请号：US16229319

    申请日：2018-12-21

    Applicant: Amkor Technology, Inc.

    Inventor： Marc Alan Mangrum

    IPC: H01L23/495 ,  H01L21/02 ,  H01L23/40

    Abstract: An electronic device structure includes a leadframe with a die pad and a lead. A semiconductor die is mounted adjacent to the die pad. A clip having a clip tail section is attached to the lead. The clip further has a clip top section attached to the clip tail section, and the clip top section is attached to a die top side of the semiconductor die with a conductive material. The clip further has an opening disposed to extend through the clip top section. In one embodiment, after a reflow step the conductive material forms a conductive fillet at least partially covering sidewall surfaces of the opening, and has a height within the opening with respect to a bottom surface of the clip top section. The opening and the conductive fillet provide an improved approach to monitoring coverage of the conductive material between the clip top section and the die top side of the semiconductor die.

    SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS
    2.
    发明申请
    SEMICONDUCTOR PACKAGE HAVING INSPECTION STRUCTURE AND RELATED METHODS 审中-公开

    公开(公告)号：US20180350726A1

    公开(公告)日：2018-12-06

    申请号：US15615769

    申请日：2017-06-06

    Applicant: Amkor Technology, Inc.

    Inventor： Marc Alan Mangrum

    IPC: H01L23/495 ,  H01L23/40 ,  H01L21/02

    CPC classification number: H01L23/49503 ,  H01L21/02 ,  H01L21/02491 ,  H01L23/4093

    Abstract: An electronic device structure includes a leadframe with a die pad and a lead. A semiconductor die is mounted adjacent to the die pad. A clip having a clip tail section is attached to the lead. The clip further has a clip top section attached to the clip tail section, and the clip top section is attached to a die top side of the semiconductor die with a conductive material. The clip further has an opening disposed to extend through the clip top section. In one embodiment, after a reflow step the conductive material forms a conductive fillet at least partially covering sidewall surfaces of the opening, and has a height within the opening with respect to a bottom surface of the clip top section. The opening and the conductive fillet provide an improved approach to monitoring coverage of the conductive material between the clip top section and the die top side of the semiconductor die.

    Packaged electronic device having integrated antenna and locking structure
    8.
    发明授权
    Packaged electronic device having integrated antenna and locking structure 有权

    公开(公告)号：US10923800B2

    公开(公告)日：2021-02-16

    申请号：US16740452

    申请日：2020-01-12

    Applicant: Amkor Technology, Inc.

    Inventor： Marc Alan Mangrum

    IPC: H01Q1/22 ,  H01Q9/04 ,  H01L23/66

    Abstract: A packaged electronic device includes an integrated antenna as part of a conductive leadframe. The conductive leadframe includes a die paddle have an elongated conductive beam structure configured as a transmission line, and a ground plane structure disposed surrounding the die paddle. The ground plane includes a gap where the transmission line extends to an edge of the packaged electronic device. In one embodiment, selected leads within the leadframe are configured with conductive connective structures as ground pins, source pins, and/or wave guides. In an alternate embodiment, a portion of the integrated antenna is embedded and partially exposed within the body of the packaged electronic device.

    Embedded vibration management system having an array of vibration absorbing structures
    9.
    发明授权
    Embedded vibration management system having an array of vibration absorbing structures 有权

    公开(公告)号：US10861798B2

    公开(公告)日：2020-12-08

    申请号：US16043645

    申请日：2018-07-24

    Applicant: Amkor Technology, Inc.

    Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

    IPC: H01L23/16 ,  H01L23/00 ,  H01L23/495 ,  B81B7/00 ,  B81B1/00 ,  H01L23/31

    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

    Embedded vibration management system
    10.
    发明授权
    Embedded vibration management system 有权

    公开(公告)号：US10032726B1

    公开(公告)日：2018-07-24

    申请号：US14069814

    申请日：2013-11-01

    Applicant: Amkor Technology, Inc.

    Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

    IPC: H01L23/495 ,  H01L23/00

    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

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