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    Semiconductor package using a polymer substrate
    1.
    发明授权
    Semiconductor package using a polymer substrate 有权

    公开(公告)号：US10822226B2

    公开(公告)日：2020-11-03

    申请号：US16255292

    申请日：2019-01-23

    Applicant: Amkor Technology, Inc.

    Inventor： Yung Woo Lee ,  Byung Jun Kim ,  Dong Hyun Bang ,  EunNaRa Cho ,  Adrian Arcedera ,  Jae Ung Lee

    IPC: B81B7/00

    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

    SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE 审中-公开

    公开(公告)号：US20190152770A1

    公开(公告)日：2019-05-23

    申请号：US16255292

    申请日：2019-01-23

    Applicant: Amkor Technology, Inc.

    Inventor： YungWoo Lee ,  ByungJun Kim ,  DongHyun Bang ,  EunNaRa Cho ,  Adrian Arcedera ,  JaeUng Lee

    IPC: B81B7/00

    CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/15151

    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

    Embedded vibration management system having an array of vibration absorbing structures
    3.
    发明授权
    Embedded vibration management system having an array of vibration absorbing structures 有权

    公开(公告)号：US10861798B2

    公开(公告)日：2020-12-08

    申请号：US16043645

    申请日：2018-07-24

    Applicant: Amkor Technology, Inc.

    Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

    IPC: H01L23/16 ,  H01L23/00 ,  H01L23/495 ,  B81B7/00 ,  B81B1/00 ,  H01L23/31

    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

    Embedded vibration management system
    4.
    发明授权
    Embedded vibration management system 有权

    公开(公告)号：US10032726B1

    公开(公告)日：2018-07-24

    申请号：US14069814

    申请日：2013-11-01

    Applicant: Amkor Technology, Inc.

    Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

    IPC: H01L23/495 ,  H01L23/00

    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

    SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE
    6.
    发明申请
    SEMICONDUCTOR PACKAGE USING A POLYMER SUBSTRATE 审中-公开
    使用聚合物基板的半导体封装

    公开(公告)号：US20160221820A1

    公开(公告)日：2016-08-04

    申请号：US15009012

    申请日：2016-01-28

    Applicant: Amkor Technology, Inc.

    Inventor： YungWoo Lee ,  ByungJun Kim ,  DongHyun Bang ,  EunNaRa Cho ,  Adrian Arcedera ,  JaeUng Lee

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  H01L2224/48137 ,  H01L2224/73265 ,  H01L2924/15151

    Abstract: A semiconductor package using a polymer substrate is disclosed and may include a polymer cavity structure comprising first metal traces, a micro-electro mechanical systems (MEMS) device and a semiconductor die bonded to a first surface within a cavity of the cavity structure, and a substrate coupled to the cavity structure and comprising second metal traces coupled to the first metal traces. The substrate may enclose the MEMS device and the semiconductor die. Ground traces may be on external surfaces of the polymer cavity structure. Ball lands may be on a surface of the substrate opposite to a surface with the second metal traces. The first metal traces may extend from the first surface of the polymer cavity structure up a sidewall of the cavity and to conductive patterns on a top surface of the polymer cavity structure.

    Abstract translation: 公开了使用聚合物基板的半导体封装，并且可以包括聚合物腔结构，其包括第一金属迹线，微机电系统（MEMS）器件和结合到腔结构的空腔内的第一表面的半导体管芯，以及 衬底，其耦合到腔结构并且包括耦合到第一金属迹线的第二金属迹线。 衬底可以封装MEMS器件和半导体管芯。 接地迹线可能在聚合物腔结构的外表面上。 球场可以在与第二金属迹线的表面相对的基板的表面上。 第一金属迹线可以从聚合物空腔结构的第一表面向上延伸到空腔的侧壁和在聚合物腔结构的顶表面上的导电图案。

    SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS
    7.
    发明申请
    SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPARTMENTS 审中-公开

    公开(公告)号：US20190276306A1

    公开(公告)日：2019-09-12

    申请号：US16291215

    申请日：2019-03-04

    Applicant: Amkor Technology, Inc.

    Inventor： Lawrence Prestousa Natan ,  Adrian Arcedera ,  Roveluz Lledo-Reyes ,  Sarah Christine-Sanchez Torrefranca

    IPC: B81B7/00 ,  B81C1/00 ,  G01P1/02

    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

    Semiconductor package with multiple compartments
    8.
    发明授权
    Semiconductor package with multiple compartments 有权

    公开(公告)号：US10221064B2

    公开(公告)日：2019-03-05

    申请号：US15934267

    申请日：2018-03-23

    Applicant: Amkor Technology, Inc.

    Inventor： Lawrence Prestousa Natan ,  Adrian Arcedera ,  Roveluz Lledo-Reyes ,  Sarah Christine-Sanchez Torrefranca

    IPC: B81B7/00 ,  B81C1/00

    Abstract: A semiconductor device may include a first substrate, a first electrical component, a lid, a second substrate, and a second electrical component. The first substrate may include an upper surface, a lower surface, and an upper cavity in the upper surface. The first electrical component may reside in the upper cavity of the first substrate. The lid may cover the upper cavity and may include a port that permits fluid to flow between an environment external to the semiconductor device and the upper cavity. The second substrate may include the second electrical component mounted to an upper surface of the second substrate. The lower surface of the first substrate and the upper surface of the second substrate may fluidically seal the second electrical component from the upper cavity.

    EMBEDDED VIBRATION MANAGEMENT SYSTEM
    9.
    发明申请
    EMBEDDED VIBRATION MANAGEMENT SYSTEM 审中-公开

    公开(公告)号：US20180374800A1

    公开(公告)日：2018-12-27

    申请号：US16043645

    申请日：2018-07-24

    Applicant: Amkor Technology, Inc.

    Inventor： Bora Baloglu ,  Adrian Arcedera ,  Marc Alan Mangrum ,  Russell Shumway

    IPC: H01L23/00 ,  H01L23/495 ,  B81B1/00 ,  H01L23/16 ,  H01L23/31

    Abstract: Methods for an embedded vibration management system are disclosed and may include fabricating a semiconductor package that supports vibration management by forming an array of vibration absorbing structures, placing the array proximate to a leadframe comprising two-legged supported leads, placing a semiconductor device above the leadframe, and encapsulating the semiconductor device and the leadframe. Each vibration absorbing structure may comprise a mass element formed on a material with lower density than that of the mass element. The array may be placed on a top, a bottom, or both surfaces of the leadframe. Sections of the array may be placed symmetrically with respect to the semiconductor device. The vibration absorbing structures may be cubic in shape and may be enclosed in an encapsulating material. The two-legged supported leads may be formed by bending metal strips with holes. The vibration absorbing structures may be exposed to the exterior of the semiconductor package.

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