公开(公告)号：US20160098016A1

公开(公告)日：2016-04-07

申请号：US14966719

申请日：2015-12-11

Applicant: Apple Inc.

Inventor： Colin M. Ely ,  Fletcher Rothkopf ,  Christopher Matthew Werner ,  John B. Morrell ,  Camille Moussette ,  Duncan Kerr ,  Anna-Katrina Shedletsky

IPC: G04G21/00 ,  G04C3/00 ,  G04G21/08

CPC classification number: G04G21/00 ,  G04B3/04 ,  G04C3/00 ,  G04C3/004 ,  G04C3/04 ,  G04G21/08 ,  G06F3/0362 ,  H01H35/00

Abstract: One embodiment of the present disclosure is directed to a wearable electronic device. The wearable electronic device includes an enclosure having a sidewall with a button aperture defined therethrough, a display connected to the enclosure, a processing element in communication with the display. The device also includes a sensing element in communication with the processing element and an input button at least partially received within the button aperture and in communication with the sensing element, the input button configured to receive two types of user inputs. During operation, the sensing element tracks movement of the input button to determine the two types of user inputs.

公开(公告)号：US09155188B2

公开(公告)日：2015-10-06

申请号：US13631156

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。