公开(公告)号：US20140334060A1

公开(公告)日：2014-11-13

申请号：US14268994

申请日：2014-05-02

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, JR.

IPC: H01L21/683

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  Y10T156/10

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.

Abstract translation: 衬底支撑组件包括陶瓷盘和导热基底，其具有结合到陶瓷盘的下表面的上表面。 导热基底包括多个热区和多个热绝缘体，其从导热基底的上表面延伸到导热基底的下表面，其中多个热隔离器中的每一个提供在 在导热基体的上表面的多个热区中的两个。

公开(公告)号：US12243756B2

公开(公告)日：2025-03-04

申请号：US17483509

申请日：2021-09-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Masanori Ono ,  Zhiqiang Guo

IPC: H01L21/67 ,  H01L21/683

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heater assembly. The substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the substrate support; and a plurality of heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the heaters is an order of magnitude greater than a quantity of the main resistive heaters and the heaters are independently controllable relative to each other as well as the main resistive heater.

公开(公告)号：US11158526B2

公开(公告)日：2021-10-26

申请号：US14285606

申请日：2014-05-22

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Masanori Ono ,  Zhiqiang Guo

IPC: H01L21/67 ,  H01L21/683

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heater assembly. The substrate support assembly comprises an upper surface and a lower surface; one or more main resistive heaters disposed in the substrate support; and a plurality of heaters in column with the main resistive heaters and disposed in the substrate support. A quantity of the heaters is an order of magnitude greater than a quantity of the main resistive heaters and the heaters are independently controllable relative to each other as well as the main resistive heater.

公开(公告)号：US10304715B2

公开(公告)日：2019-05-28

申请号：US15977718

申请日：2018-05-11

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. Trenches are formed in the thermally conductive base approximately concentric around a center of the thermally conductive base. The trenches extend from the upper surface towards a lower surface of the thermally conductive base without contacting the lower surface of the thermally conductive base. The thermally conductive base includes thermal zones. The substrate support assembly further includes a thermally insulating material disposed in the trenches. The thermally insulating material in a trench of the trenches provides a degree of thermal isolation between two of the thermal zones separated by the trench at the upper surface of the thermally conductive base.

公开(公告)号：US10121688B2

公开(公告)日：2018-11-06

申请号：US15481183

申请日：2017-04-06

Applicant: APPLIED MATERIALS, INC.

Inventor： Matthew J. Busche ,  Vijay D. Parkhe ,  Wendell Boyd, Jr. ,  Senh Thach ,  Konstantin Makhratchev ,  Masanori Ono

IPC: H01L21/683 ,  H05K7/20 ,  H01L21/67

Abstract: An electrostatic chuck is described with external flow adjustments for improved temperature distribution. In one example, a method for adjusting coolant flow in an electrostatic chuck includes heating a dielectric puck, the dielectric puck being for electrostatically gripping a silicon wafer. Heat is detected at a plurality of locations on a top surface of the dielectric puck, the locations each being thermally coupled to at least one of a plurality of coolant chambers of the electrostatic chuck. A plurality of valves are adjusted to control coolant flow into the coolant chambers based on the detected heat.

公开(公告)号：US09948214B2

公开(公告)日：2018-04-17

申请号：US13793512

申请日：2013-03-11

Applicant: Applied Materials, Inc.

Inventor： Dmitry Lubomirsky ,  Jennifer Y. Sun ,  Sehn Thach ,  Xing Lin ,  Michael D. Willwerth ,  Konstantin Makhratchev

IPC: H02N13/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687 ,  B23B31/28

CPC classification number: H02N13/00 ,  B23B31/28 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831 ,  H01L21/68792

Abstract: Embodiments of the present invention provide electrostatic chucks for operating at elevated temperatures. One embodiment of the present invention provides a dielectric chuck body for an electrostatic chuck. The dielectric chuck body includes a substrate supporting plate having a top surface for receiving a substrate and a back surface opposing the top surface, an electrode embedded in the substrate supporting plate, and a shaft having a first end attached to the back surface of the substrate supporting plate and a second end opposing the first end. The second end is configured to contact a cooling base and provide temperature control to the substrate supporting plate. The shaft is hollow having a sidewall enclosing a central opening, and two or more channels formed through the sidewall and extending from the first end to the second end.

公开(公告)号：US09666466B2

公开(公告)日：2017-05-30

申请号：US14268994

申请日：2014-05-02

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  Y10T156/10

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.

公开(公告)号：US09472435B2

公开(公告)日：2016-10-18

申请号：US14717676

申请日：2015-05-20

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Steven E. Babayan ,  Konstantin Makhratchev ,  Zhiqiang Guo ,  Phillip R. Sommer ,  Dan A. Marohl

IPC: F27B5/14 ,  H01L21/683 ,  H05B3/02 ,  H01L21/67 ,  H05B1/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

Abstract translation: 本文所述的实施方案提供了一种基板支撑组件，其能够实现静电卡盘和加热组件之间的热传递的侧向和方位调节。 基板支撑组件包括具有基板支撑表面和下表面的主体，设置在主体中的一个或多个主电阻加热器，设置在主体中的多个可空调的加热器，以及耦合到多个 空间可调谐加热器，空间可调加热器控制器被配置为相对于多个空间可调谐加热器中的另一个来独立地控制多个空间可调加热器中的输出一个。

公开(公告)号：US20140177123A1

公开(公告)日：2014-06-26

申请号：US13725449

申请日：2012-12-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Senh Thach ,  Dmitry Lubomirsky ,  Jennifer Y. Sun ,  Konstantin Makhratchev

IPC: H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  Y10T29/49002

Abstract: An electrostatic chuck includes a thermally conductive base having a plurality of heating elements disposed therein. A metal layer covers at least a portion of the thermally conductive base, wherein the metal layer shields the plurality of heating elements from radio frequency (RF) coupling and functions as an electrode for the electrostatic chuck. A plasma resistant dielectric layer covers the metal layer.

Abstract translation: 静电卡盘包括其中布置有多个加热元件的导热基座。 金属层覆盖导热基体的至少一部分，其中金属层将多个加热元件与射频（RF）耦合屏蔽，并用作静电卡盘的电极。 等离子体电介质层覆盖金属层。

公开(公告)号：US10535544B2

公开(公告)日：2020-01-14

申请号：US15212946

申请日：2016-07-18

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Steven E. Babayan ,  Konstantin Makhratchev ,  Zhiqiang Guo ,  Phillip R. Sommer ,  Dan A. Marohl

IPC: H01L21/683 ,  H01L21/67 ,  H05B1/02 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.