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公开(公告)号：US11137213B2
公开(公告)日：2021-10-05
申请号：US16506215
申请日：2019-07-09
Applicant: AURAS Technology Co., Ltd.
Inventor： Chien-An Chen , Mu-Shu Fan , Chien-Yu Chen
Abstract: A water cooling head includes water cooling head includes a casing, a base and a pump. The casing includes an inlet and an outlet. An outer side of the base has a heat-absorbing surface. A thermal conduction structure is disposed on an inner side of the base. An active space is defined by the base and the casing collaboratively. The pump includes a first magnetic element, a second magnetic element, an impeller and a pivotal part. The first magnetic element is located outside the active space. The first magnetic element is arranged between the impeller and the base along a direction perpendicular to the base. The pivotal part, the second magnetic element and the impeller are disposed within the active space. The pivotal part is connected with the impeller and arranged between the impeller and the base. The second magnetic element is installed on the pivotal part.
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公开(公告)号：US11019750B2
公开(公告)日：2021-05-25
申请号：US16124867
申请日：2018-09-07
Applicant: AURAS Technology Co., Ltd.
Inventor： Chien-An Chen , Mu-Shu Fan , Chien-Yu Chen
Abstract: A water-cooling head includes a casing, a base, a thermal conduction structure and a pump. An active space is defined by the base and the casing collaboratively. A working medium is filled in the active space. The pump includes a fixing element, a shaft and an impeller. After the fixing element is fixed, the fixing element is contacted with the base or contacted with the thermal conduction structure, and the shaft is fixed on the fixing element. Consequently, the impeller is stably rotated about the shaft, and the performance and the reliability of the water-cooling head are enhanced.
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公开(公告)号：US10856439B2
公开(公告)日：2020-12-01
申请号：US16279205
申请日：2019-02-19
Applicant: AURAS Technology Co., Ltd.
Inventor： Chien-An Chen , Chien-Yu Chen , Yu-Jie Liu , Kuan Cheng Lu , Tai-Wen Chen
Abstract: A rotatable water-cooling tube and an electronic device with the water-cooling tube are provided. The water-cooling tube includes a first tube body, a second tube body, a third tube body, a first connector and a second connector. The first tube body is in communication with the second tube body and the third tube body through the first connector and the second connector. The first tube body is rotatable with the first connector and the second connector. Consequently, the first tube body can be freely rotated to a proper position. The technology of the present invention is helpful to assemble and disassemble the heat generation component under the rotatable water-cooling tube.
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14.发明申请公开(公告)号：US20180255662A1
公开(公告)日：2018-09-06
申请号：US15679630
申请日：2017-08-17
Applicant: AURAS Technology Co., Ltd.
Inventor： MU-SHU FAN , Chien-Yu Chen
CPC classification number: H05K7/20272 , F04D17/025 , F04D17/16 , F04D19/002 , F04D25/0613 , F04D29/526 , F04D29/582 , G06F1/20 , H01L23/473 , H05K7/20154 , H05K7/20218 , H05K7/20263
Abstract: An electronic device with a heat-dissipating function and a liquid-cooling radiator module are provided. The electronic device includes a first circuit board, a second circuit board and a liquid-cooling radiator module. The second circuit board is mounted on the first circuit board. The liquid-cooling radiator module is attached on the second circuit board and in thermal contact with an electronic component of the second circuit board. The liquid-cooling radiator module includes plural airflow channels and a fan. The plural airflow channels are in parallel with the second circuit board. The fan produces airflow toward the plural airflow channel. After the airflow passes through the plural airflow channels, the airflow is outputted in a direction parallel with the second circuit board. Since the airflow is not obstructed by the adjacent function circuit boards, the heat-dissipating efficiency is enhanced.
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公开(公告)号：US12200903B2
公开(公告)日：2025-01-14
申请号：US17869958
申请日：2022-07-21
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor： Ming-Yuan Chiang , Mu-Shu Fan , Chien-Yu Chen
IPC: H05K7/20
Abstract: A heat dissipation device is provided and includes: a casing; a base unit combined with the casing to form a water collecting chamber, a water inlet chamber, an action space and a water outlet chamber; a heat transfer structure disposed on an inner side of the base unit; a water inlet pipeline unit communicated with the water collecting chamber; a water outlet pipeline unit communicated with the water outlet chamber; and a pump unit disposed outside the casing and the base unit, and connected with the water inlet pipeline unit and the water outlet pipeline unit, so as to drive a working medium.
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Patent Agency Ranking
公开(公告)号：US11956919B2
公开(公告)日：2024-04-09
申请号：US17132207
申请日：2020-12-23
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor： Chien-An Chen , Chien-Yu Chen , Tian-Li Ye , Jen-Hao Lin , Wei-Shen Lee
CPC classification number: H05K7/20254 , F28D9/0068 , F28F3/12 , F28D2021/0028
Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.
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公开(公告)号：US11930618B2
公开(公告)日：2024-03-12
申请号：US17462371
申请日：2021-08-31
Applicant: Auras Technology Co., Ltd.
Inventor： Chien-Yu Chen , Tian-Li Ye , Jen-Hao Lin , Chien-An Chen
IPC: H05K7/20 , B23K31/02 , F28D15/02 , F28D15/04 , F28D21/00 , F28F9/18 , H01L23/473 , B23K101/14 , G06F1/20
CPC classification number: H05K7/20272 , B23K31/02 , F28D15/0233 , F28D15/046 , F28F9/18 , H05K7/20263 , H05K7/20336 , H05K7/2039 , B23K2101/14 , F28F2230/00 , F28F2245/00 , F28F2275/062 , G06F1/20
Abstract: A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.
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公开(公告)号：US11856728B2
公开(公告)日：2023-12-26
申请号：US17514577
申请日：2021-10-29
Applicant: Auras Technology Co., Ltd.
Inventor： Chien-Yu Chen , Wei-Hao Chen , Yuh-Shiuan Liu
IPC: H05K7/20
CPC classification number: H05K7/20263
Abstract: A liquid cooling device includes a heat dissipation shell and a dual fin module. The heat dissipation shell includes a cooling cavity, and the dual fin module is fixed in the cooling cavity to separate the cooling cavity into an upper cooling space and a lower cooling space, so that a cooling fluid enters the cooling cavity and flows into the upper cooling space and the lower cooling space to cool a chip in the lower cooling space.
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公开(公告)号：US11832418B2
公开(公告)日：2023-11-28
申请号：US17213605
申请日：2021-03-26
Applicant: Auras Technology Co., Ltd.
Inventor： Chien-Yu Chen , Tian-Li Ye , Yu Chen , Jen-Hao Lin , Chien-An Chen , Yun-Kuei Lin
IPC: H01L23/473 , H05K7/20
CPC classification number: H05K7/20272 , H05K7/20254 , H05K7/20263 , H05K7/20281
Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.
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公开(公告)号：US20230111086A1
公开(公告)日：2023-04-13
申请号：US17892357
申请日：2022-08-22
Applicant: AURAS TECHNOLOGY CO., LTD.
Inventor： Yi-Wun Chen , Ming-Yuan Chiang , Chien-Yu Chen , Mu-Shu Fan
IPC: H05K7/20
Abstract: A cold plate is provided and includes: a casing formed with an accommodating groove; a base coupled to the casing to define an action space together with the casing, where the action space communicates with the accommodating groove; a heat transfer structure disposed on an inner side of the base for transferring a heat energy generated by a heat source in contact with an outer side of the base to a working medium in the action space; and a pump having a stator disposed in the accommodating groove.
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