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    Liquid-cooling heat dissipation device
    3.
    发明授权
    Liquid-cooling heat dissipation device 有权

    公开(公告)号：US11523537B2

    公开(公告)日：2022-12-06

    申请号：US17114814

    申请日：2020-12-08

    Applicant: Auras Technology Co., Ltd.

    Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin ,  Chien-An Chen

    IPC: H05K7/20

    Abstract: A liquid-cooling heat dissipation device includes a water-cooling module, a water-tank module, a power module, a first and a second water-cooling radiators. The water-cooling module includes a base, a plate, an isolating structure and a heat-conducting unit. The isolating structure connects between the base and the plate. The plate, the isolating structure and the base define a first chamber. The isolating structure and the plate define a second and a third chambers. The first, the second and the third chambers are isolated from each other. The heat-conducting unit is partially located within the first chamber and partially exposed from the base. The first and the second water-cooling radiators connect to the plate and communicate between the water-cooling module and the water-tank module. The power module drives a medium to flow between the water-cooling module and the water-tank module through the first and the second water-cooling radiators.

    Liquid cooling module and its liquid cooling head
    6.
    发明授权
    Liquid cooling module and its liquid cooling head 有权

    公开(公告)号：US11832418B2

    公开(公告)日：2023-11-28

    申请号：US17213605

    申请日：2021-03-26

    Applicant: Auras Technology Co., Ltd.

    Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Yu Chen ,  Jen-Hao Lin ,  Chien-An Chen ,  Yun-Kuei Lin

    IPC: H01L23/473 ,  H05K7/20

    CPC classification number: H05K7/20272 ,  H05K7/20254 ,  H05K7/20263 ,  H05K7/20281

    Abstract: A liquid cooling head includes a chassis, an inlet channel, a thermally-conducting structure, a liquid gathering structure, a drain channel and a pump set. The chassis includes a lower chamber and an upper chamber communicated with the lower chamber through a connection opening. The inlet channel is disposed on one side of the chassis, and communicated with the upper chamber for radiating the heat of the working fluid away. The thermally-conducting structure is disposed in the lower chamber for gathering the working fluid passed through the thermally-conducting structure. The drain channel is disposed on one side of the chassis to be communicated with the lower chamber. The pump set for pushing the working fluid in the lower chamber to discharge the working fluid outwards from the drain channel.

    Liquid cooling head device
    8.
    发明授权
    Liquid cooling head device 有权

    公开(公告)号：US11363739B2

    公开(公告)日：2022-06-14

    申请号：US17197727

    申请日：2021-03-10

    Applicant: Auras Technology Co., Ltd.

    Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin ,  Chien-An Chen

    IPC: H05K7/20 ,  H02K7/14

    Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.

    COLD PLATE
    9.
    发明申请
    COLD PLATE 有权

    公开(公告)号：US20210392779A1

    公开(公告)日：2021-12-16

    申请号：US17132207

    申请日：2020-12-23

    Applicant: AURAS TECHNOLOGY CO., LTD.

    Inventor： Chien-An Chen ,  Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin ,  Wei-Shen Lee

    IPC: H05K7/20 ,  F28D9/00 ,  F28F3/12

    Abstract: A cold plate is provided and includes: a housing disposed with a chamber; a base combined with the housing to form a working space separated from the chamber but connected with the chamber through an interconnecting structure to allow a working medium to flow within the chamber and the working space; a heat transfer structure disposed on the inner side of the base; and a pump disposed within the working space to drive the working medium in the working space. As such, the cold plate can provide better heat dissipation performance.

    LEAKAGE DETECTION SYSTEM
    10.
    发明申请
    LEAKAGE DETECTION SYSTEM 有权

    公开(公告)号：US20210389205A1

    公开(公告)日：2021-12-16

    申请号：US17118855

    申请日：2020-12-11

    Applicant: AURAS TECHNOLOGY CO., LTD.

    Inventor： Chien-Yu Chen ,  Tian-Li Ye ,  Jen-Hao Lin ,  Wei-Shen Lee

    IPC: G01M3/16 ,  G06F1/20 ,  H05K7/20

    Abstract: A leakage detection system is provided and includes a substrate provided between a first element and a second element, and at least one sensing unit provided on the substrate to generate an electrical signal when coming into contact with a leakage liquid. As such, warnings can be provided when coming into contact with the leakage liquid to avoid significant loss of assets.

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