公开(公告)号：US20230069997A1

公开(公告)日：2023-03-09

申请号：US18049413

申请日：2022-10-25

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto ,  Naoki Matsuda

IPC: B62D5/04 ,  H03K19/20 ,  H02P27/06

Abstract: An electric driver device provides a partial redundancy system that is at least partially redundant, or a full redundancy system. The electric driver device has a plurality of circuit systems. The electric driver device includes, in at least a part of the electric circuit, a common circuit extending over at least two of a plurality of circuit systems. The common circuit includes a power supply and/or a connection line that complements signals. At least one of the power supply circuit, an interface circuit, a power supply cutoff circuit, and a connector is not separated and independent from each other for each redundant circuit system.

公开(公告)号：US09756716B2

公开(公告)日：2017-09-05

申请号：US14336346

申请日：2014-07-21

Applicant: DENSO CORPORATION

Inventor： Yuta Kadoike ,  Hideki Kabune ,  Toshihisa Yamamoto

IPC: H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  B62D5/04 ,  H05K3/28

CPC classification number: H05K1/0203 ,  B62D5/0406 ,  H01L2224/40245 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K1/181 ,  H05K3/284 ,  H05K7/20454 ,  H01L2924/00012

Abstract: An electronic element surface-mounted on a substrate has a leg part that protrudes from a back surface of the electronic element toward a heat sink along a peripheral portion of a back electrode. As such, if the substrate warps, the protruding leg part abuts a heat reception surface of the heat sink, thereby preserving an insulation gap between the back electrode and the heat sink. As a result, short-circuiting is prevented.

公开(公告)号：US09327759B2

公开(公告)日：2016-05-03

申请号：US14632541

申请日：2015-02-26

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto

IPC: H02H7/08 ,  B62D5/04 ,  H02P6/00 ,  H02P6/24

CPC classification number: B62D5/046 ,  B62D5/0484 ,  B62D5/0487 ,  H02P6/24 ,  H02P29/0241

Abstract: In a control unit, a control part is operated by electric power from an ignition power supply, and controls operations of relays and inverters. A first end of a boosting part is electrically connected between at least one relay and a corresponding inverter. A second end of the boosting part is electrically connected to the control part. The boosting part boosts a voltage at the first end, and outputs the voltage boosted from the second end. An abnormality detecting portion detects an abnormality of the boosting part. When the abnormality detecting portion detects an abnormality of the boosting part, the control part controls the at least one relay to which the first end of the boosting part is connected to shut off a flow of electric power from a main power supply to the boosting part and to the inverter corresponding to the at least one relay.

Abstract translation: 在控制单元中，通过来自点火电源的电力对控制部进行动作，控制继电器和逆变器的动作。 升压部的第一端电连接在至少一个继电器和相应的逆变器之间。 升压部的第二端电连接到控制部。 升压部分提高第一端的电压，并输出从第二端提升的电压。 异常检测部检测升压部的异常。 当异常检测部分检测到升压部分的异常时，控制部分控制升压部分的第一端连接到的至少一个继电器，以切断从主电源到升压部分的电力流 以及对应于所述至少一个继电器的逆变器。

公开(公告)号：US10374490B2

公开(公告)日：2019-08-06

申请号：US14811601

申请日：2015-07-28

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto ,  Hideki Kabune ,  Yuuta Kadoike

IPC: H02K9/22 ,  H02K11/00 ,  H05K7/20 ,  H02K11/33

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

公开(公告)号：US09622383B2

公开(公告)日：2017-04-11

申请号：US14167007

申请日：2014-01-29

Applicant: DENSO CORPORATION

Inventor： Takahiro Yamanaka ,  Yoshimichi Hara ,  Toshihisa Yamamoto ,  Kouji Kameyama ,  Yuuji Kobayashi

IPC: H05K7/20 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/30 ,  H02M7/00 ,  H05K1/02 ,  H01L23/367 ,  H01L23/373 ,  H05K3/46 ,  H01L23/538 ,  H05K1/18

CPC classification number: H05K7/2039 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/5389 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/0265 ,  H05K1/185 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/22 ,  H05K3/303 ,  H05K3/4614 ,  H05K7/209 ,  H05K2201/10166 ,  Y10T29/49126 ,  Y10T29/49139 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A heat radiation structure for an electric device includes: at least one multi-layer substrate including a plurality of base parts made of insulation material and a conductor pattern, which are stacked in a multi-layer structure so that the conductor pattern is electrically coupled with an interlayer connection portion in the base parts; the electric device having at least one of a first electric element built in the at least one multi-layer substrate and a second electric element, which is not built in the multi-layer substrate; and a low heat resistance element opposed to the electric device. The low heat resistance element has a heat resistance lower than the insulation material.

公开(公告)号：US20160295681A1

公开(公告)日：2016-10-06

申请号：US15090195

申请日：2016-04-04

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto

IPC: H05K1/02

CPC classification number: H05K3/0061 ,  B62D5/0406 ,  B62D5/0496 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0207 ,  H05K2201/062 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10409

Abstract: An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.

Abstract translation: 电子单元包括散热器，基板，加热部件，温度传感器，第一互连和第二互连。 散热片包括支柱。 基板固定在散热片的支柱上。 加热部件安装在基板上，以在加热部件通电时产生热量。 温度传感器安装在基板上以检测温度。 第一互连设置在其中加热部件安装在基板上的高温区域中，并且连接到散热器的支柱。 第二互连设置在温度传感器安装在基板上的检测区域中，并且与第一互连分开设置。 第二个互连连接到散热器的支柱和温度传感器。

公开(公告)号：US20160036298A1

公开(公告)日：2016-02-04

申请号：US14811601

申请日：2015-07-28

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto ,  Hideki Kabune ,  Yuuta Kadoike

IPC: H02K9/22 ,  H02K11/00 ,  H05K7/20

CPC classification number: H02K9/22 ,  H02K11/33 ,  H05K7/20454 ,  H05K7/20463 ,  H05K7/205 ,  H05K7/209

Abstract: An electronic device includes a heat sink, where heat dissipating gel is interposed between the heat sink and a side of an electronic component, which is mounted on a substrate, opposite from the substrate. The electronic component includes an electrical conductor electrically connected to a chip, and an insulator portion that molds the chip with the electrical conductor. The heat sink includes a non-abutting surface that faces the electrical conductor of the electronic component, the heat dissipating gel interposed between the non-abutting surface and the electrical conductor, and an abutting surface that is positioned closer toward the substrate than the non-abutting surface is and abuttable with the insulator portion. Accordingly, when the abutting surface of the heat sink abuts the insulator portion of the electronic component, the non-abutting surface of the heat sink is prevented from abutting the electrical conductor of the electronic component.

Abstract translation: 电子设备包括散热器，其中散热凝胶介于散热器和安装在与基板相对的基板上的电子部件的一侧。 电子部件包括电连接到芯片的电导体和将芯片与电导体模制的绝缘体部分。 散热器包括面对电子部件的电导体的非接触表面，插入在非接触表面和电导体之间的散热凝胶以及比非接触表面更靠近基板的抵接表面， 邻接表面可与绝缘体部分邻接。 因此，当散热器的抵接面与电子部件的绝缘体部分抵接时，防止散热片的非抵接面与电子部件的导电体抵接。

公开(公告)号：US09184146B2

公开(公告)日：2015-11-10

申请号：US14521609

申请日：2014-10-23

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto

IPC: H05K1/11 ,  H01L23/00 ,  H01L23/04 ,  H05K1/18 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L24/14 ,  H01L23/04 ,  H01L23/498 ,  H01L23/49816 ,  H01L23/49838 ,  H01L25/065 ,  H01L2224/13014 ,  H01L2224/14131 ,  H01L2224/16227 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H05K1/113 ,  H05K1/114 ,  H05K1/181 ,  H05K2201/09227 ,  H05K2201/10166 ,  H05K2201/10734 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor package includes a chip, a sealing body covering the chip, and a plurality of external connection terminals connected to the chip. The external connection terminals expose from a surface of the sealing body and are arranged in a grid on the surface of the sealing body. In the grid on the surface of the sealing body, each external connection terminal is adjacent to an area vacant of an other external connection terminal in at least one direction of eight directions from each external connection terminal, the eight directions including first linear directions along a row of the grid, second linear directions along a row of the grid perpendicular to the first linear directions, and four diagonal directions defined between the first linear directions and the second linear directions.

Abstract translation: 半导体封装包括芯片，覆盖芯片的密封体以及连接到芯片的多个外部连接端子。 外部连接端子从密封体的表面露出并且在密封体的表面上布置成格栅。 在密封体的表面上的格栅中，每个外部连接端子与来自每个外部连接端子的八个方向的至少一个方向上的另一个外部连接端子的空闲区域相邻，八个方向包括沿着第一线性方向 栅格行，垂直于第一线性方向的栅格行的第二线性方向以及在第一线性方向和第二线性方向之间限定的四个对角线方向。

公开(公告)号：US09130490B2

公开(公告)日：2015-09-08

申请号：US13894044

申请日：2013-05-14

Applicant: DENSO CORPORATION

Inventor： Toshihisa Yamamoto

IPC: H02P6/08 ,  H02P6/14 ,  B62D5/04

CPC classification number: H02P6/14 ,  B62D5/0403 ,  B62D5/0406 ,  B62D5/046

Abstract: Synthesized signal generation circuits are provided to correspond to a U-coil, a V-coil, a W-coil, respectively, and generate synthesized signals by synthesizing a first command signal and a second command signal generated by a command signal generation circuit. CPU output terminals output the synthesized signals. Signal wires are provided with one ends being connected electrically to the CPU output terminals, respectively, and other ends being connected electrically to IC input terminals of a driver IC, respectively. Gate signal generation circuits separate the synthesized signals applied to the IC input terminals to generate first gate signals as gate signals for high-side FETs and second gate signals as gate signals for low-side FETs.

Abstract translation: 提供合成信号生成电路以对应于U线圈，V线圈，W线圈，并通过合成由命令信号产生电路产生的第一命令信号和第二命令信号来产生合成信号。 CPU输出端输出合成信号。 信号线的一端分别与CPU输出端子电连接，另一端分别与驱动器IC的IC输入端子电连接。 门信号发生电路分离施加到IC输入端的合成信号，以产生作为高侧FET和第二栅极信号的栅极信号的第一栅极信号，作为低端FET的栅极信号。

公开(公告)号：US09030140B2

公开(公告)日：2015-05-12

申请号：US13796478

申请日：2013-03-12

Applicant: Denso Corporation

Inventor： Takahiro Yamanaka ,  Toshihisa Yamamoto

IPC: H02P27/00 ,  B60R16/03

CPC classification number: B60R16/03

Abstract: An in-vehicle power supply system includes a DC power source, a steering power converter, a steering drive control unit, a plurality of voltage-reducing devices, and a voltage-reducing control unit. The steering power converter converts electric power supplied from the DC power source, and provides the electric power converted to a steering assist motor. The steering drive control unit is supplied with electric power from the DC power source, and controls the steering power converter. The voltage-reducing devices are coupled in parallel to each other between the DC power source and the steering power converter. Each of the voltage-reducing devices reduces a power source voltage of the DC power source and generates a reduced voltage when being operated. The voltage-reducing control unit determines operation state or non-operation state of each of the voltage-reducing devices such that at least one of the voltage-reducing devices is in operation at a time.

Abstract translation: 车载电源系统包括直流电源，转向功率转换器，转向驱动控制单元，多个降压装置和降压控制单元。 转向功率转换器转换从直流电源提供的电力，并且提供转换为转向辅助电动机的电力。 转向驱动控制单元由直流电源供电，并控制转向功率转换器。 降压装置在直流电源和转向功率转换器之间彼此并联耦合。 每个降压装置降低直流电源的电源电压，并且在操作时产生降低的电压。 降压控制单元确定每个降压装置的操作状态或非操作状态，使得至少一个降压装置一次运行。