-
11.发明公开公开(公告)号：US20240106368A1
公开(公告)日：2024-03-28
申请号：US18065721
申请日：2022-12-14
Applicant: Delphi Technologies IP Limited
Inventor： Jack Lavern Glenn , Mark Russell Keyse , Marc R. Engelhardt , Kevin M. Gertiser
CPC classification number: H02P27/08 , B60L50/51 , B60L50/60 , H02J7/0063 , H02M1/08 , B60L15/20 , H02J2207/20
Abstract: A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic isolator separating a high voltage area from a low voltage area; a low voltage phase controller in the low voltage area, the low voltage phase controller configured to receive a pulse width modulation (PWM) signal from an inverter controller and adjust the received PWM signal based on a feedback signal; and a high voltage phase controller in the high voltage area, the high voltage phase controller configured to receive the adjusted PWM signal from the low voltage phase controller, provide the adjusted PWM signal to a phase switch, and provide the feedback signal based on an on-time measurement of the phase switch.
-
公开(公告)号：US20240106346A1
公开(公告)日：2024-03-28
申请号：US18161974
申请日：2023-01-31
Applicant: Delphi Technologies IP Limited
Inventor： Mark Wendell Gose , Seyed R. Zarabadi , David Paul Buehler , Kevin M. Gertiser
CPC classification number: H02M7/537 , B60L50/51 , H02M1/08 , B60L2210/30
Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module including: a first connection; a second connection; a first power switch including a first gate terminal, the first power switch configured to control a first flow of current between the first connection and the second connection based on a first signal to the first gate terminal; and a first point-of-use controller configured to provide the first signal to the first gate terminal to control the first power switch.
-
公开(公告)号：US11293808B1
公开(公告)日：2022-04-05
申请号：US17363739
申请日：2021-06-30
Applicant: DELPHI TECHNOLOGIES IP LIMITED
Inventor： Soumyajit Routh , Kevin M. Gertiser , Jack L. Glenn , John Mark Dikeman , Daniel C. Penrod
IPC: G01K3/00 , G01R31/3177 , G01R31/317 , G01K7/00
Abstract: A method includes, responsive to an application of power to an IC, self-initializing the IC by asserting a reset signal for a reset period. Self-initializing the IC also includes, in response to an expiration of the reset period, deasserting the reset signal. Self-initializing the IC also includes, responsive to deasserting the reset signal, automatically obtaining first temperature data from at least one thermal sensing device associated with a die of the IC, and storing the first temperature data in a storage component of the IC.
-
公开(公告)号：US20240113081A1
公开(公告)日：2024-04-04
申请号：US18344347
申请日：2023-06-29
Applicant: Delphi Technologies IP Limited
Inventor： Kevin M. Gertiser , Chris Fruth
IPC: H01L25/07 , B60L50/60 , H01L23/00 , H01L23/373 , H02M7/00
CPC classification number: H01L25/072 , B60L50/60 , H01L23/3735 , H01L24/32 , H01L24/33 , H02M7/003 , B60L2210/40 , H01L2224/32245 , H01L2224/33181
Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.
-
公开(公告)号：US20240107721A1
公开(公告)日：2024-03-28
申请号：US18162430
申请日：2023-01-31
Applicant: Delphi Technologies IP Limited
Inventor： Kevin M. Gertiser , Chris Fruth
IPC: H05K7/20
CPC classification number: H05K7/209 , H05K7/20927
Abstract: A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.
-
Patent Agency Ranking
公开(公告)号：US20240106354A1
公开(公告)日：2024-03-28
申请号：US18344379
申请日：2023-06-29
Applicant: Delphi Technologies IP Limited
Inventor： Kevin M. Gertiser , Chris Fruth
IPC: H02M7/5395 , H01L23/373 , H02P27/08
CPC classification number: H02M7/5395 , H01L23/3735 , H02P27/08
Abstract: A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.
-
公开(公告)号：US20240106339A1
公开(公告)日：2024-03-28
申请号：US18175295
申请日：2023-02-27
Applicant: Delphi Technologies IP Limited
Inventor： David Paul Buehler , Kevin M. Gertiser , David W. Ihms , Mark Wendell Gose
CPC classification number: H02M7/003 , H05K1/145 , H05K1/181 , H05K2201/042 , H05K2201/10166
Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.
-
公开(公告)号：US20240106323A1
公开(公告)日：2024-03-28
申请号：US18310049
申请日：2023-05-01
Applicant: Delphi Technologies IP Limited
Inventor： Helena Cristobal Losada , Kevin M. Gertiser
CPC classification number: H02M1/322 , B60L53/22 , H02J7/0063 , H02M1/08 , H02P27/08 , H02P29/68 , B60L2210/40
Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a bulk capacitor; one or more phase switches; and one or more controllers configured to control a gate voltage to the one or more phase switches to discharge the bulk capacitor, wherein the one or more controllers is configured to control the gate voltage based on one or more of a measured temperature of the one or more phase switches or an estimated temperature of the one or more phase switches.
-
公开(公告)号：US20240105684A1
公开(公告)日：2024-03-28
申请号：US18344422
申请日：2023-06-29
Applicant: Delphi Technologies IP Limited
Inventor： Kevin M. Gertiser , Chris Fruth
CPC classification number: H01L25/072 , B60L50/60 , H01L24/32 , H02M7/003 , H02P27/08 , H01L23/3735 , H01L2224/32245
Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a flex layer including a gate trace providing an electrical connection to a gate input connection of the power module, a first substrate, a second substrate including a source plane, the source plane including a step trench, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate trace, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery configured to supply the DC power to the inverter; and a motor configured to receive the AC power from the inverter.
-
公开(公告)号：US20240105553A1
公开(公告)日：2024-03-28
申请号：US18162468
申请日：2023-01-31
Applicant: Delphi Technologies IP Limited
Inventor： Kevin M. Gertiser , Chris Fruth
IPC: H01L23/473 , H01L21/48 , H01L23/00 , H01L23/367 , H01L23/467 , H01L25/00 , H01L25/07
CPC classification number: H01L23/473 , H01L21/4882 , H01L23/3672 , H01L23/467 , H01L24/32 , H01L24/33 , H01L25/072 , H01L25/50 , H01L2224/32225 , H01L2224/33181
Abstract: A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.
-
-
-
-
-
-
-
-
-
Search Results
23
records
(took 0.019 seconds)
