公开(公告)号：US20240113081A1

公开(公告)日：2024-04-04

申请号：US18344347

申请日：2023-06-29

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H01L25/07 ,  B60L50/60 ,  H01L23/00 ,  H01L23/373 ,  H02M7/00

CPC classification number: H01L25/072 ,  B60L50/60 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/33 ,  H02M7/003 ,  B60L2210/40 ,  H01L2224/32245 ,  H01L2224/33181

Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the second substrate to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

公开(公告)号：US20240107721A1

公开(公告)日：2024-03-28

申请号：US18162430

申请日：2023-01-31

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/20927

Abstract: A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.

公开(公告)号：US20240107720A1

公开(公告)日：2024-03-28

申请号：US18160390

申请日：2023-01-27

Applicant: Delphi Technologies IP Limited

Inventor： Bryan Rohl ,  Chris Fruth

IPC: H05K7/20 ,  H05K5/02

CPC classification number: H05K7/209 ,  H05K5/0247 ,  H05K7/20154

Abstract: A base for an electrical component includes: a body, the body defining: a rim, pin slots, and first engagement slots; contact terminals; and electrical connectors, each of the electrical connectors being positioned within a respective pin slot and including a pin terminal positioned on a first surface of the body; wherein the base is configured to provide an electrical connection between one or more power modules and a substrate.

公开(公告)号：US20240107719A1

公开(公告)日：2024-03-28

申请号：US18160378

申请日：2023-01-27

Applicant: Delphi Technologies IP Limited

Inventor： Bryan Rohl ,  Chris Fruth ,  Edward Choi ,  Todd Nakanishi

IPC: H05K7/20

CPC classification number: H05K7/209 ,  H05K7/2049 ,  H05K7/20854 ,  H05K7/20927

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

公开(公告)号：US20240106354A1

公开(公告)日：2024-03-28

申请号：US18344379

申请日：2023-06-29

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H02M7/5395 ,  H01L23/373 ,  H02P27/08

CPC classification number: H02M7/5395 ,  H01L23/3735 ,  H02P27/08

Abstract: A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

公开(公告)号：US20240105684A1

公开(公告)日：2024-03-28

申请号：US18344422

申请日：2023-06-29

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H01L25/07 ,  B60L50/60 ,  H01L23/00 ,  H02M7/00 ,  H02P27/08

CPC classification number: H01L25/072 ,  B60L50/60 ,  H01L24/32 ,  H02M7/003 ,  H02P27/08 ,  H01L23/3735 ,  H01L2224/32245

Abstract: A system includes: an inverter configured to convert DC power to AC power, wherein the inverter includes: a power module including: a flex layer including a gate trace providing an electrical connection to a gate input connection of the power module, a first substrate, a second substrate including a source plane, the source plane including a step trench, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate trace, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery configured to supply the DC power to the inverter; and a motor configured to receive the AC power from the inverter.

公开(公告)号：US20240105553A1

公开(公告)日：2024-03-28

申请号：US18162468

申请日：2023-01-31

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H01L23/473 ,  H01L21/48 ,  H01L23/00 ,  H01L23/367 ,  H01L23/467 ,  H01L25/00 ,  H01L25/07

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L23/3672 ,  H01L23/467 ,  H01L24/32 ,  H01L24/33 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/33181

Abstract: A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

公开(公告)号：US20240105552A1

公开(公告)日：2024-03-28

申请号：US18162451

申请日：2023-01-31

Applicant: Delphi Technologies IP Limited

Inventor： Kevin M. Gertiser ,  Chris Fruth

IPC: H01L23/473 ,  H01L23/467 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L23/467 ,  H05K7/209 ,  H05K7/20927

Abstract: A power module includes: a fin housing including a fluid passage; a power switch having an exterior surface; and a fin system comprising a plurality of fins attached to a base plate, the plurality of fins extending from the base plate and away from the exterior surface of the power switch, the fin system being in thermal connection with the exterior surface of the power switch and disposed within the fluid passage.