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    METHODS TO MAINTAIN IMAGE QUALITY IN ULTRASOUND IMAGING AT REDUCED COST, SIZE, AND POWER
    12.
    发明申请
    METHODS TO MAINTAIN IMAGE QUALITY IN ULTRASOUND IMAGING AT REDUCED COST, SIZE, AND POWER 有权

    公开(公告)号：US20210307726A1

    公开(公告)日：2021-10-07

    申请号：US17272901

    申请日：2019-12-20

    Applicant: eXo Imaging, Inc.

    Inventor： Miles Wernick ,  Sandeep Akkaraju ,  Drake Guenther ,  Kutay Ustuner ,  Yusuf Haque

    IPC: A61B8/08

    Abstract: Disclosed herein are computer-implemented medical ultrasound imaging methods, and systems for performing the methods, that comprise forming a first frame of an ultrasound image sequence with high image quality; forming at least one frame of the ultrasound image sequence with reduced image quality; forming a second frame of the ultrasound image sequence with high image quality; and improving the quality of the at least one frame of the ultrasound image sequence with reduced image quality using the first and/or the second frames of the ultrasound image sequence with high quality. In some cases, the improvement of the quality of the at least one frame of the ultrasound image sequence with reduced image quality is achieved by application of machine learning.

    Multi-transducer chip ultrasound device
    15.
    发明授权
    Multi-transducer chip ultrasound device 有权

    公开(公告)号：US12099150B2

    公开(公告)日：2024-09-24

    申请号：US17511245

    申请日：2021-10-26

    Applicant: Exo Imaging, Inc.

    Inventor： Liang Wang ,  Yusuf Haque ,  Janusz Bryzek

    IPC: B06B1/00 ,  B81B7/00 ,  G01S7/52 ,  G01S15/89

    CPC classification number: G01S7/52079 ,  B81B7/008 ,  G01S7/5205 ,  G01S15/8925 ,  B81B2201/0271

    Abstract: An ultrasound device for use with various types of imaging. In some embodiments, the ultrasound device may comprise a circuitry substrate and a plurality of transducer chips coupled to the circuitry substrate. In some embodiments, each transducer chip may comprise a microelectromechanical systems (MEMS) component that may include a plurality of ultrasound elements closely packed with one another, an Application-Specific Integrated Circuit (ASIC) that may be operatively coupled to the plurality of ultrasound elements of said MEMS component, and a control unit that may be electrically coupled to each ASIC of the plurality of transducer chips for control thereof. In some embodiments, at least two transducer chips of the plurality of transducer chips may be placed on the circuitry substrate with a separation distance that may be less than an operational wavelength of the ultrasound elements of the MEMS components of said at least two transducer chips.

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