Abstract:
The present invention claims a binary mask printing a product feature which includes a narrow space; and a phase-shifting mask having an assist feature that fits within the narrow space when both masks are properly aligned in exposing a wafer.
Abstract:
Various implementations of the invention provide methods and apparatus for calibrating models of an optical lithographic process. In various implementations, a complete model of an optical lithographic process may be formed by combining different physical ranges and components describing the optical lithographic process. With various implementations of the invention, an optical lithographic process model may be calibrated by generating and applying a set of test patterns to the optical lithographic process, identifying test patterns and associated measured results that correspond to the discrete components of the optical lithographic model, calibrating the discrete components of the optical lithographic model based on the identified test patterns and measured results, and combining the calibrated components into a complete model. In some implementations of the invention, the discrete components of the optical lithographic model represent different physical effects of the optical lithographic process. Alternately or additionally, with various implementations of the invention the generated test patterns may include test structures sensitive to proximity effects, long-range pattern density, and long-range process non-uniformity.
Abstract:
Systems and techniques for lithography. In one aspect, a method includes producing a microelectronic device by modulating an intensity and a phase of the zero diffraction order of a radiation with a device including subwavelength features having a pitch dimension smaller than one wavelength of the radiation.
Abstract:
A method of determining calibration test patterns to be utilized to calibrate a model for simulating the imaging performance of an optical imaging system. The method includes the steps of defining a model equation representing the imaging performance of the optical imaging system; transforming the model equation into a plurality of discrete functions; identifying a calibration pattern for each of the plurality of discrete functions, where each calibration pattern corresponding to one of the plurality of discrete functions being operative for manipulating the one of the plurality of discrete functions during a calibration process; and storing the calibration test patterns identified as corresponding to the plurality of discrete functions. The calibration test patterns are then utilized to calibrate the model for simulating the imaging performance of an optical imaging system.
Abstract:
A lithography system may utilize a biased sidewall chrome alternating aperture mask (SCAAM). Glass steps in the mask may be positioned at the center of the chrome sidewalls in chrome lines rather than the center of the chrome lines themselves.
Abstract:
A method of determining calibration test patterns to be utilized to calibrate a model for simulating the imaging performance of an optical imaging system. The method includes the steps of defining a model equation representing the imaging performance of the optical imaging system; transforming the model equation into a plurality of discrete functions; identifying a calibration pattern for each of the plurality of discrete functions, where each calibration pattern corresponding to one of the plurality of discrete functions being operative for manipulating the one of the plurality of discrete functions during a calibration process; and storing the calibration test patterns identified as corresponding to the plurality of discrete functions. The calibration test patterns are then utilized to calibrate the model for simulating the imaging performance of an optical imaging system.
Abstract:
A method of calibrating a simulation model of a photolithography process. The method includes the steps of defining a set of input data; defining a simulation model having model parameters which affect the simulation result produced by the simulation model; performing a first stage calibration process in which the model parameters and alignment parameters are adjusted such that the simulation result is within a first predefined error tolerance; and performing a second stage calibration process in which the alignment parameters are fixed and the model parameters are adjusted such that the simulation result is within a second predefined error tolerance.
Abstract:
The present invention claims a binary mask printing a product feature which includes a narrow space; and a phase-shifting mask having an assist feature that fits within the narrow space when both masks are properly aligned in exposing a wafer.
Abstract:
Inspecting a patterned surface using photoemission of electrons includes selecting materials of the patterned surface, selecting a light source to produce a difference in yield of photoelectrons from the materials, applying the light from the light source to the patterned surface, detecting the emission of photoelectrons from the patterned surface, and inspecting the patterned surface based on the detected photoelectron emissions.
Abstract:
A refelective mask having non-reflective and reflective regions. The reflective regions are reflective of light at an inspection wavelength and a semiconductor processing wavelength and the non-reflective regions are substantially non-reflective of light at the inspection wavelength and the semiconductor processing wavelength. The contrast of reflected light off of the non-reflective and reflective regions is greater than 0.210 at either of the two wavelengths.