公开(公告)号：US20170199083A1

公开(公告)日：2017-07-13

申请号：US15331036

申请日：2016-10-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Yasunori IGASAKI ,  Yasunaga NARA

IPC: G01J9/02

CPC classification number: G01J9/0215 ,  G01J2009/0223 ,  G01J2009/0234

Abstract: A collimation evaluation device includes a first reflection member, a second reflection member, a screen, and a housing. A first reflection surface of the first reflection member and a first reflection surface of the second reflection member face each other and are parallel to each other. Further, interference fringes are formed on the screen by light L12 reflected on the first reflection surface of the first reflection member and a second reflection surface of the second reflection member and light L21 reflected on a second reflection surface of the first reflection member and the first reflection surface of the second reflection member, and collimation of incident light is evaluated on the basis of a direction of the interference fringes.

公开(公告)号：US20230256535A1

公开(公告)日：2023-08-17

申请号：US18138955

申请日：2023-04-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/064 ,  B23K26/042 ,  B23K26/359 ,  B23K26/70 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08

CPC classification number: B23K26/064 ,  B23K26/042 ,  B23K26/359 ,  B23K26/702 ,  B23K26/705 ,  B23K26/032 ,  B23K26/0665 ,  B23K26/0853 ,  B23K2103/56

Abstract: A laser processing device includes a support unit, a laser light source, a reflecting spatial light modulator, a light collection optical system, an imaging optical system, a mirror, a first sensor configured to acquire displacement data on a laser light entry surface, and a second sensor configured to acquire displacement data on the laser light entry surface. An optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction. An optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction. The first sensor is disposed on one side of the light collection optical system in a third direction.

公开(公告)号：US20210268607A1

公开(公告)日：2021-09-02

申请号：US17257606

申请日：2019-07-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/08 ,  B23K26/03 ,  B23K26/073

Abstract: Disclosed is a laser processing device including a laser light source configured to output laser light, a converging unit configured to converge the laser light toward a first surface to form a converging point, a camera configured to image reflected light of the laser light from the first surface, a spatial light modulator for modulating the laser light according to a modulation pattern, and a controller configured to execute acquisition processing of applying the laser light to the first surface by controlling the laser light source and imaging the reflected light by controlling the camera to acquire a reflectance of the first surface for the first wavelength.

公开(公告)号：US20200061740A1

公开(公告)日：2020-02-27

申请号：US16343034

申请日：2017-10-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/064 ,  H01L21/67 ,  B23K26/067 ,  B23K26/352

Abstract: There is provided a laser light irradiating device that includes a spatial light modulator configured to modulate laser light output from a laser light source according to a phase pattern and emit the modulated laser light, an objective lens configured to converge the laser light emitted from the spatial light modulator onto the object, a focusing lens arranged between the spatial light modulator and the objective lens in an optical path of the laser light and configured to focus the laser light, and a slit member arranged at a focal position on a rear side of the focusing lens in the optical path of the laser light and configured to block a part of the laser light.

公开(公告)号：US20190047084A1

公开(公告)日：2019-02-14

申请号：US16078220

申请日：2017-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/06 ,  B23K26/53

Abstract: A laser light irradiation device includes: a laser light source; a spatial light modulator including a display unit, the spatial light modulator modulating the laser light in accordance with a phase pattern displayed on the display unit; a beam diameter conversion mechanism arranged on an optical path of the laser light between the laser light source and the spatial light modulator, the beam diameter conversion mechanism enlarging or reducing the beam diameter of the laser light; a lens insertion and removal mechanism including a lens configured to vary the beam diameter of the laser light, the lens insertion and removal mechanism being enabled to insert/remove the lens in/from the optical path; and a controller configured to control the phase pattern to be displayed. The controller displays the phase pattern configured to correct a wavefront aberration caused by insertion or removal of the lens.

公开(公告)号：US20190039174A1

公开(公告)日：2019-02-07

申请号：US16073478

申请日：2017-01-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/064 ,  B23K26/53

Abstract: A laser light irradiation device includes a laser light source, a spatial light modulator, a controller, an objective lens, and an intensity distribution acquisition unit. The laser light source generates laser light. The spatial light modulator includes a display unit configured to display a phase pattern, allows the laser light to enter the display unit, and modulates the laser light in accordance with the phase pattern to emit the laser light. The controller controls the phase pattern to be displayed. The objective lens converges the laser light emitted from the spatial light modulator at the object. The intensity distribution acquisition unit acquires an intensity distribution of the laser light emitted from the spatial light modulator and entering the objective lens. The controller displays, on the display unit, the phase pattern including a marking configured to modulate part, in the laser light, not entering a pupil plane of the objective lens.

公开(公告)号：US20200298345A1

公开(公告)日：2020-09-24

申请号：US16087789

申请日：2017-03-28

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Mitsuhiro NAGAO ,  Norihiro FUKUCHI ,  Yasunori IGASAKI

IPC: B23K26/53 ,  B23K26/064 ,  B23K26/06 ,  B23K26/08 ,  G02F1/1335

Abstract: A laser processing device configured to emit laser light on an object to perform laser processing of the object, the laser processing device including: a laser output unit configured to output the laser light; a spatial light modulator configured to reflect the laser light output from the laser output unit while modulating the laser light in accordance with a phase pattern; and an objective lens configured to converge the laser light from the spatial light modulator toward the object, in which the spatial light modulator includes an entrance surface, a reflective surface, and a modulation layer configured to display the phase pattern to modulate the laser light, and a dielectric multilayer film having a high reflectance region in a plurality of wavelength bands non-contiguous with each other is formed on the reflective surface.

公开(公告)号：US20180245984A1

公开(公告)日：2018-08-30

申请号：US15754377

申请日：2016-08-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Haruyasu ITO ,  Yasunori IGASAKI ,  Junji OKUMA

IPC: G01J11/00 ,  G02F1/37

CPC classification number: G01J11/00 ,  G02F1/37 ,  G02F2202/20

Abstract: An autocorrelation measurement device includes a first reflection member, a second reflection member, a focusing unit, a nonlinear optical crystal, a detection unit, a filter, an aperture, a delay adjusting unit, and an analysis unit. Incident pulsed light is transmitted through the second reflection member and incident on the first reflection member. First pulsed light reflected on a first reflection surface of the first reflection member and a second reflection surface of the second reflection member and second pulsed light reflected on a second reflection surface of the first reflection member and a first reflection surface of the second reflection member are incident on the nonlinear optical crystal via the focusing unit. Second harmonic light generated in the nonlinear optical crystal is detected by the detection unit.

公开(公告)号：US20180236608A1

公开(公告)日：2018-08-23

申请号：US15753311

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Yo SUGIMOTO

IPC: B23K26/53 ,  B23K26/364 ,  B23K26/00 ,  B23K26/06

CPC classification number: B23K26/53 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/06 ,  B23K26/0622 ,  B23K26/083 ,  B23K26/364

Abstract: A laser processing device includes: a support table configured to support an object to be processed; a laser light source configured to emit laser light; a converging optical system configured to converge the laser light at the object; an imaging unit configured to image a front surface of the object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the substrate along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the substrate on the basis of an image of the crack.

公开(公告)号：US20180236597A1

公开(公告)日：2018-08-23

申请号：US15752685

申请日：2016-08-08

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA ,  Yo SUGIMOTO

IPC: B23K26/00 ,  B23K26/53 ,  B23K26/03

Abstract: The object to be processed cutting method includes: a crystal orientation identifying step of identifying a crystal orientation of the substrate; a line to cut setting step of setting, for the object to be processed, a line to cut passing through a street region formed between adjacent functional devices, after the crystal orientation identifying step; and a cutting step of cutting the object to be processed along the line to cut, after the line to cut setting step. In the line to cut setting step, in a case where an extending direction of the street region does not match the crystal orientation, the line to cut parallel to the crystal orientation and inclined with respect to the extending direction of the street region, is set for the object to be processed.