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    Pressure sensor construction and method for its fabrication
    11.
    发明授权
    Pressure sensor construction and method for its fabrication 失效
    压力传感器结构及其制造方法

    公开(公告)号：US4875134A

    公开(公告)日：1989-10-17

    申请号：US294799

    申请日：1989-01-09

    Applicant: Heikki Kuisma

    Inventor： Heikki Kuisma

    IPC: G01L9/12 ,  G01L9/00

    CPC classification number: G01L9/0073 ,  Y10T29/435

    Abstract: This invention concerns a capacitive pressure sensor construction and method for fabricating said sensor. The pressure sensor construction comprises a base part (1, 2, 4), comprising an electrically conductive silicon layer (1, 2) and a thereupon permanently bonded planar intermediate layer (4) of an insulating material with an essentially smaller thickness than that of the silicon layer (1, 2); a fixed planar capacitor electrode (9) fabricated on the base part (1, 2, 4); and a deflecting membranous capacitor electrode (6) fabricated of silicon and integral with a surrounding, essentially thicker base element (5), and gappedly spaced from and aligned at least approximately coincident with the fixed capacitor electrode (9), so that a hermetically sealed chamber (25) remains between the fixed electrode (9) and the membranous electrode (6). According to the invention, the base part (1, 2, 4) is perpendicularly divided into areas (1, 2) galvanically isolated from each other, namely to a contact area (2), which is coincident with the fixed capacitor electrode (9), galvanically connected to said electrode and designed with an area maximally equal to that of said electrode, and to at least one bonding area (1), which is isolated from the contact area (2) by an insulating layer (3) and to which a bonding voltage can be applied during the anodic bonding process in order to bond the base part to the base element (5) of the membranous capacitor electrode. The construction avoids stray capacitances at bonding area.

    Abstract translation: 本发明涉及用于制造所述传感器的电容式压力传感器结构和方法。 压力传感器结构包括基部（1,2,4），其包括绝缘材料的导电硅层（1,2）和其永久接合的平面中间层（4），该绝缘材料的厚度基本上小于 硅层（1,2）; 固定的平面电容器电极（9），其制造在所述基底部分（1,2）上。 以及由硅制成的偏转膜电容器电极（6），并与周围的基本上较厚的基底元件（5）成一体，并且与固定电容器电极（9）间隔开并至少与其重合，使得密封 室（25）保持在固定电极（9）和膜电极（6）之间。 根据本发明，基部（1，2，4）被垂直地划分成彼此电隔离的区域（1,2），即与固定电容器电极（9）重合的接触区域（2） ），电连接到所述电极并且被设计为具有最大等于所述电极的面积，以及至少一个通过绝缘层（3）与接触区域（2）隔离的接合区域（1），并且至少一个接合区域 在阳极接合工艺期间可以施加接合电压，以便将基底部分粘合到膜电容器电极的基底元件（5）上。 该结构避免了接合区域的杂散电容。

    Capacitive pressure transducer
    12.
    发明授权
    Capacitive pressure transducer 失效
    电容式压力传感器

    公开(公告)号：US4862317A

    公开(公告)日：1989-08-29

    申请号：US190112

    申请日：1988-05-04

    Applicant: Heikki Kuisma

    Inventor： Heikki Kuisma

    IPC: G01L9/12 ,  G01L9/00

    CPC classification number: G01L9/0073

    Abstract: A capacitive pressure transducer includes a capacitive sensor structure, a case into which the capacitive sensor structure is adapted, channels formed in the case for introducing a measured medium into the capacitive sensor structure, and electrical conductors to make the pressure-related capacitive sensor information externally available. According to the invention, the capacitive sensor structure is fixed to the case by means of elastic structures, which elastic structures provide a floating support for the capacitive sensor structure adapted between the elastic structures. The construction in accordance with the invention cancels errors caused by temperature variations.

    Abstract translation: 电容式压力传感器包括电容传感器结构，电容式传感器结构适用的壳体，用于将测量介质引入电容传感器结构的壳体中形成的通道，以及用于将压力相关的电容式传感器信息外部产生的电导体 可用。 根据本发明，电容式传感器结构通过弹性结构固定在壳体上，弹性结构为适应于弹性结构之间的电容传感器结构提供浮动支撑。 根据本发明的结构消除由温度变化引起的误差。

    Energy harvesting/tire pressure, temperature and tire data transmitter
    14.
    发明授权
    Energy harvesting/tire pressure, temperature and tire data transmitter 有权
    能量收集/轮胎压力，温度和轮胎数据发射器

    公开(公告)号：US08878421B2

    公开(公告)日：2014-11-04

    申请号：US13167193

    申请日：2011-06-23

    Applicant: Heikki Kuisma ,  Katsutoshi Narita

    Inventor： Heikki Kuisma ,  Katsutoshi Narita

    IPC: H02N2/18 ,  B60C23/04

    CPC classification number: H02N2/18 ,  B60C23/041 ,  B60C23/0411 ,  H01L41/1136

    Abstract: The invention embodies a harvester (12) to convert energy from mechanical domain to electrical domain. The harvester comprises at least one inertial body (6), at least one beam (7, 9), a support (8) to said at least one beam (7, 9) and transducer means (10, 16), wherein said at least one beam (7, 9) configures the inertial body (6) into a pendulum structure being suspended from said support (8) so that the beam (7, 9) is allowed to bend according to the kinetic state changes of the inertial body (6), and is configured to interact with at least one transducer means (10) that is/are configured to produce change in the electrical state of said transducer means (10, 16) responsively to the kinetic state of the beam (7, 9). The invention also shows harvester module, matrix and a harvester system comprising at least one embodied harvester. The invention also shows a tire and a foot wear that comprises at least one harvester embodied.

    Abstract translation: 本发明体现了将能量从机械域转换到电域的收割机（12）。 收割机包括至少一个惯性体（6），至少一个梁（7,9），到所述至少一个梁（7,9）的支撑件（8）和换能器装置（10,16）），其中所述 至少一个梁（7,9）将惯性体（6）构造成从所述支撑件（8）悬挂的摆动结构，使得梁（7,9）根据惯性体的动态变化被允许弯曲 （6），并且被配置为与至少一个换能器装置（10）相互作用，所述换能器装置（10）被配置为响应于所述梁（7,6）的动力状态而产生所述换能器装置（10,16）的电气状态的变化， 9）。 本发明还示出了包括至少一个具体收割机的收割机模块，矩阵和收割机系统。 本发明还示出了包括至少一个采集器的轮胎和脚部磨损。

    Encapsulation module method for production and use thereof
    15.
    发明授权
    Encapsulation module method for production and use thereof 有权
    封装模块的生产和使用方法

    公开(公告)号：US08279615B2

    公开(公告)日：2012-10-02

    申请号：US12519288

    申请日：2007-12-14

    Applicant: Bernhard Schmid ,  Roland Hilser ,  Heikki Kuisma ,  Altti Torkkeli

    Inventor： Bernhard Schmid ,  Roland Hilser ,  Heikki Kuisma ,  Altti Torkkeli

    IPC: H05K5/00

    CPC classification number: H01L23/055 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A method for producing an encapsulation module and/or for encapsulating a micromechanical arrangement, wherein electronic connection provisions are formed from a blank of electrically conductive semiconductor material, by one or more structuring processes and/or etching processes, wherein, in the course of forming the electronic connection provisions, a pedestal of the semiconductor material arises, on which the electronic connection provisions are arranged, wherein the latter are subsequently embedded with an embedding material and the embedding material and/or the semiconductor pedestal are removed after the embedding to an extent such that a defined number of the electronic connection provisions have electrical contacts on at least one of the outer surfaces of the encapsulation module thus produced, wherein upon forming the electronic connection provisions, on the pedestal of the semiconductor material, an insular material hump is formed, on which a plated-through hole is arranged in each case, and which embodies a semiconductor electrode.

    Abstract translation: 一种用于制造封装模块和/或用于封装微机械装置的方法，其中电子连接装置由导电半导体材料的坯件通过一个或多个结构化工艺和/或蚀刻工艺形成，其中，在成型过程中 电子连接装置出现了半导体材料的基座，其上布置有电子连接装置，其中后者嵌入嵌入材料，并且嵌入材料和/或半导体基座在嵌入之后被移除到一定程度 使得限定数量的电子连接装置在如此制造的封装模块的至少一个外表面上具有电触头，其中在形成电子连接装置时，在半导体材料的基座上形成岛状材料隆起 ，其上布置有电镀通孔， 在每种情况下，并且其包含半导体电极。

    Encapsulation Module Method for Production and Use Thereof
    17.
    发明申请
    Encapsulation Module Method for Production and Use Thereof 有权
    封装模块的生产和使用方法

    公开(公告)号：US20100290199A1

    公开(公告)日：2010-11-18

    申请号：US12519288

    申请日：2007-12-14

    Applicant: Bernhard Schmid ,  Roland Hilser ,  Heikki Kuisma ,  Altti Torkkeli

    Inventor： Bernhard Schmid ,  Roland Hilser ,  Heikki Kuisma ,  Altti Torkkeli

    IPC: H05K5/00 ,  H01L21/70 ,  H01L21/56

    CPC classification number: H01L23/055 ,  B81B2207/012 ,  B81B2207/095 ,  B81B2207/096 ,  B81B2207/097 ,  B81C1/0023 ,  B81C1/00301 ,  H01L2224/73204 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A method for producing an encapsulation module and/or for encapsulating a micromechanical arrangement, wherein electronic connection provisions are formed from a blank of electrically conductive semiconductor material, by one or more structuring processes and/or etching processes, wherein, in the course of forming the electronic connection provisions, a pedestal of the semiconductor material arises, on which the electronic connection provisions are arranged, wherein the latter are subsequently embedded with an embedding material and the embedding material and/or the semiconductor pedestal are removed after the embedding to an extent such that a defined number of the electronic connection provisions have electrical contacts on at least one of the outer surfaces of the encapsulation module thus produced, whereinupon forming the electronic connection provisions, on the pedestal of the semiconductor material, an insular material hump is formed, on which a plated-through hole is arranged in each case, and which embodies a semiconductor electrode.

    Abstract translation: 一种用于制造封装模块和/或用于封装微机械装置的方法，其中电子连接装置由导电半导体材料的坯件通过一个或多个结构化工艺和/或蚀刻工艺形成，其中，在成型过程中 电子连接装置出现了半导体材料的基座，其上布置有电子连接装置，其中后者嵌入嵌入材料，并且嵌入材料和/或半导体基座在嵌入之后被移除到一定程度 使得限定数量的电子连接装置在如此制造的封装模块的至少一个外表面上具有电触头，其中在形成电子连接装置时，在半导体材料的基座上形成岛状材料隆起 ，其上布置有电镀通孔， 在每种情况下，并且其包含半导体电极。

    Method of manufacturing a capacitive acceleration sensor, and a capacitive acceleration sensor
    18.
    发明申请
    Method of manufacturing a capacitive acceleration sensor, and a capacitive acceleration sensor 有权
    电容式加速度传感器的制造方法以及电容式加速度传感器

    公开(公告)号：US20070000323A1

    公开(公告)日：2007-01-04

    申请号：US11453912

    申请日：2006-06-16

    Applicant: Heikki Kuisma

    Inventor： Heikki Kuisma

    IPC: G01P15/125 ,  G01R3/00

    CPC classification number: G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/0831 ,  Y10T29/49007

    Abstract: The present invention relates to measuring devices used in measuring acceleration and, more precisely, to capacitive acceleration sensors. The object of the invention is to provide an improved method of manufacturing a capacitive acceleration sensor, and to provide a capacitive acceleration sensor, which is applicable for use in small capacitive acceleration sensor solutions, and which, in particular, is applicable for use in small and extremely thin capacitive acceleration sensor solutions measuring acceleration in relation to several axes.

    Abstract translation: 本发明涉及用于测量加速度的测量装置，更准确地说，涉及电容式加速度传感器。 本发明的目的是提供一种制造电容式加速度传感器的改进方法，并提供一种适用于小型电容式加速度传感器解决方案的电容式加速度传感器，其特别适用于小型 和极薄的电容式加速度传感器解决方案，可以测量与几个轴相关的加速度。

    Absolute pressure transducer
    19.
    发明授权
    Absolute pressure transducer 失效
    绝对压力传感器

    公开(公告)号：US4609966A

    公开(公告)日：1986-09-02

    申请号：US784198

    申请日：1985-10-04

    Applicant: Heikki Kuisma

    Inventor： Heikki Kuisma

    IPC: H01L27/04 ,  G01L9/00 ,  G01L9/12 ,  H01G5/16 ,  H01L21/822 ,  H01G7/00

    CPC classification number: G01L9/0073 ,  H01G5/16

    Abstract: Described herein is a capacitive absolute pressure transducer including a flat base plate (9) of insulating material, e.g., of glass, with a fixed capacitor electrode (10), aligned on the base plate. A silicon-material moving diaphragm electrode (5) of the capacitor is at least partly aligned with the fixed electrode (10), properly spaced to implement a hermetically sealed vacuum chamber (7) between the fixed electrode (10) and moving diaphragm electrode (5). Electrical contacts (12) are attached to the fixed electrode (10) and the moving diaphragm electrode (5). According to the invention, the flat base plate (9) is bonded to an electrically conductive wafer (8) to implement a laminated substrate (2), the diaphragm electrode (5) fabricated integral with a surrounding and essentially thicker collar part (18), and the electrical contact to the fixed capacitor plate (10) in the area of the vacuum chamber (7) is a well (11, 12) extending through the base plate (9) to the wafer (8).

    Abstract translation: 这里描述的是一种电容式绝对压力传感器，其包括具有固定电容器电极（10）的绝缘材料（例如玻璃）的平坦基板（9），其在基板上对准。 电容器的硅材料移动隔膜电极（5）至少部分地与固定电极（10）对齐，适当地隔开以在固定电极（10）和活动隔膜电极（10）之间实现密封的真空室（7） 5）。 电触头（12）附接到固定电极（10）和活动隔膜电极（5）。 根据本发明，平板式基板（9）与导电晶片（8）接合以实现叠层基板（2），隔膜电极（5）与周围的和基本上较厚的凸缘部分（18）整体制成， ，并且在真空室（7）的区域中与固定电容器板（10）的电接触是穿过基板（9）延伸到晶片（8）的阱（11,12）。

    Method and device for energy harvesting
    20.
    发明授权
    Method and device for energy harvesting 有权
    能量收集的方法和装置

    公开(公告)号：US08922098B2

    公开(公告)日：2014-12-30

    申请号：US13501001

    申请日：2010-10-08

    Applicant: Anna-Maija Karkkainen ,  Jukka Kyynarainen ,  Leif Roschier ,  Heikki Kuisma

    Inventor： Anna-Maija Karkkainen ,  Jukka Kyynarainen ,  Leif Roschier ,  Heikki Kuisma

    IPC: H02N2/18 ,  B60C23/04

    CPC classification number: H02N2/186 ,  B60C23/0411 ,  H01L41/1134 ,  Y10T29/42

    Abstract: A device (100) harvests energy from vibration and/or strain and utilizes both capacitive (102a, 102b) and piezoelectric elements (105). The principle of operation is out-of-plane capacitive harvester, where the bias voltage for the capacitive element is generated with a piezoelectric element (105). The device utilizes a thin dielectric film (104) between the capacitor plates (102a, 102b) maximizing the harvested energy and enabling the harvester operation in semi-contact mode so that short circuits are prevented. For example when utilized in a wheel or the like, the capacitor is closed and opened at every strike or every turn of a wheel being thus independent of the harvester's mechanical resonance frequency.

    Abstract translation: 装置（100）从振动和/或应变中收获能量并利用电容（102a，102b）和压电元件（105）。 操作原理是平面外电容式收集器，其中用压电元件（105）产生电容元件的偏置电压。 该装置利用电容器板（102a，102b）之间的薄电介质膜（104）使收获的能量最大化，并使收割机能够以半接触方式工作，从而防止短路。 例如，当在车轮等中使用时，电容器在每次罢工或轮的每一匝处闭合并打开，因此独立于收割机的机械共振频率。

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