-
公开(公告)号：US10582306B2
公开(公告)日：2020-03-03
申请号：US15446643
申请日：2017-03-01
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
Abstract: A capacitive MEMS device, a capacitive MEMS sound transducer, a method for forming a capacitive MEMS device and a method for operating a capacitive MEMS device are disclosed. In an embodiment the capacitive MEMS device includes a first electrode structure comprising a first conductive layer and a second electrode structure comprising a second conductive layer, wherein the second conductive layer at least partially opposes the first conductive layer, and wherein the second conductive layer includes a multiple segmentation which provides an electrical isolation between at least three portions of the second conductive layer.
-
公开(公告)号：US10575101B2
公开(公告)日：2020-02-25
申请号：US15897946
申请日：2018-02-15
Applicant: Infineon Technologies AG
Inventor： Arnaud Walther , Alfons Dehe , Gerhard Metzger-Brueckl , Johann Strasser , Carsten Ahrens
Abstract: A microelectromechanical microphone includes a reference electrode, a first membrane arranged on a first side of the reference electrode and displaceable by sound to be detected, and a second membrane arranged on a second side of the reference electrode, said second side being situated opposite the first side of the reference electrode, and displaceable by sound to be detected. A region of one from the first and second membranes that is displaceable by sound relative to the reference electrode, independently of said region's position relative to the reference electrode, can comprise a planar section and also an undulatory section adjoining the planar section and arranged in a region of overlap one of the first membrane or the second membrane with the other one of the first membrane and or the second membrane.
-
公开(公告)号：US20200051824A1
公开(公告)日：2020-02-13
申请号：US16654165
申请日：2019-10-16
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Daniel Lugauer , Dominic Maier , Alfons Dehe
IPC: H01L21/306 , H01L23/31 , H01L21/762 , H01L21/02 , H01L21/302 , H01L21/20 , H01L21/18 , H01L33/00 , H01L23/057 , H01L23/053 , G01N27/12 , H01L23/29 , H01L23/00 , G01N27/02 , G01N33/00 , H01L21/56 , H01L23/538 , H05K1/18
Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
-
公开(公告)号：US10433070B2
公开(公告)日：2019-10-01
申请号：US15910390
申请日：2018-03-02
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Abidin Güçlü Onaran
Abstract: A MEMS device includes a membrane and a counter electrode structure spaced apart from the membrane. The counter electrode structure includes a non-planar conductive layer. The MEMS device includes an air gap between the membrane and the counter electrode structure. The air gap has a non-uniform thickness.
-
公开(公告)号：US20190256351A1
公开(公告)日：2019-08-22
申请号：US16402632
申请日：2019-05-03
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe
Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.
-
Patent Agency Ranking
公开(公告)号：US20190255669A1
公开(公告)日：2019-08-22
申请号：US16402248
申请日：2019-05-03
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Reinhard Gabl , Ulrich Krumbein
Abstract: A structure for fixing a membrane to a carrier including a carrier; a suspended structure; and a holding structure with a rounded concave shape which is configured to fix the suspended structure to the carrier and where a tapered side of the holding structure physically connects to the suspended structure is disclosed. A method of forming the holding structure on a carrier to support a suspended structure is further disclosed. The method may include: forming a holding structure on a carrier; forming a suspended structure on the holding structure; shaping the holding structure such that it has a concave shape; and arranging the holding structure such that a tapered side of the holding structure physically connects to the suspended structure.
-
公开(公告)号：US10367430B2
公开(公告)日：2019-07-30
申请号：US14992615
申请日：2016-01-11
Applicant: Infineon Technologies AG
Inventor： David Tumpold , Alfons Dehe , Christoph Glacer
Abstract: According to an embodiment, a microelectromechanical systems MEMS transducer includes a deflectable membrane attached to a support structure, an acoustic valve structure configured to cause the deflectable membrane to be acoustically transparent in a first mode and acoustically visible in a second mode, and an actuating mechanism coupled to the deflectable membrane. Other embodiments include corresponding systems and apparatus, each configured to perform various embodiment methods.
-
公开(公告)号：US10365208B2
公开(公告)日：2019-07-30
申请号：US15079840
申请日：2016-03-24
Applicant: Infineon Technologies AG , Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V.
Inventor： Stefan Kolb , Alfons Dehe , Jochen Huber , Franz Jost , Horst Theuss , Wilhelm Wiedmeier , Juergen Woellenstein
Abstract: Shown is a gas sensor including a sensor element, a measurement chamber and an emitter element. The sensor element has a MEMS membrane which is arranged in a first substrate region. Furthermore, the measurement chamber is embodied to receive a measurement gas.
-
公开(公告)号：US20190181776A1
公开(公告)日：2019-06-13
申请号：US16274720
申请日：2019-02-13
Applicant: Infineon Technologies AG
Inventor： David Tumpold , Alfons Dehe , Christoph Glacer
Abstract: According to an embodiment, a microelectromechanical systems MEMS device includes a first membrane attached to a support structure that a first plurality of acoustic vents; a second membrane attached to the support structure that includes a second plurality of acoustic vents, where the first plurality of acoustic vents and the second plurality of acoustic vents do not overlap; and a closing mechanism coupled to the first membrane and the second membrane.
-
公开(公告)号：US10302554B2
公开(公告)日：2019-05-28
申请号：US15172178
申请日：2016-06-03
Applicant: Infineon Technologies AG
Inventor： David Tumpold , Alfons Dehe , Christoph Glacer
IPC: G01N21/17
Abstract: An acoustic wave detector may include: an exterior housing with an exterior housing wall, a gas chamber located within the exterior housing and configured to receive a gas therein. The exterior housing wall may include an aperture providing a gas passage between the gas chamber and the exterior of the acoustic wave detector. The acoustic wave detector may further include an excitation element configured to selectively excite gas molecules of a specific type in the gas received in the gas chamber in a time-varying fashion, thereby generating acoustic waves in the gas, and an acoustic wave sensor configured to detect the acoustic waves generated in the gas and acoustic waves generated outside of the acoustic wave detector. The acoustic wave sensor may have an acoustic port overlapping with the aperture in the exterior housing wall.
-
-
-
-
-
-
-
-
-
Search Results
238
records
(took 0.026 seconds)
