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    Chassis embedded heat pipe
    11.
    发明授权
    Chassis embedded heat pipe 有权

    公开(公告)号：US10921869B2

    公开(公告)日：2021-02-16

    申请号：US16455323

    申请日：2019-06-27

    Applicant: Intel Corporation

    Inventor： Mark Carbone ,  Juha Tapani Paavola ,  Nicholas R. Weber

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

    HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE
    12.
    发明申请
    HEAT PIPE FOR IMPROVED THERMAL PERFORMANCE AT COLD PLATE INTERFACE 有权

    公开(公告)号：US20250142778A1

    公开(公告)日：2025-05-01

    申请号：US19001914

    申请日：2024-12-26

    Applicant: Intel Corporation

    Inventor： Juha Paavola ,  Columbia Mishra ,  Justin Huttula ,  Mark Carbone

    IPC: H05K7/20 ,  B23P15/26 ,  G06F1/20

    Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

    PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM
    14.
    发明申请
    PER CHIPLET THERMAL CONTROL IN A DISAGGREGATED MULTI-CHIPLET SYSTEM 审中-公开

    公开(公告)号：US20190384367A1

    公开(公告)日：2019-12-19

    申请号：US16551523

    申请日：2019-08-26

    Applicant: Intel Corporation

    Inventor： Amit Kumar Jain ,  Sameer Shekhar ,  Mark Carbone ,  Merwin M. Brown

    IPC: G06F1/20 ,  G06F1/3206 ,  G06F1/324 ,  G06F1/3296

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a plurality of chiplets, a plurality of resources, a system thermal engine, and at least one processor. The at least one processor is configured to cause the system thermal engine to monitor the plurality of chiplets, where the plurality of chiplets are part of a multi-chip module, determine that a first chiplet from the plurality of chiplets has reached a threshold temperature, and reduce power to the first chiplet without reducing power to the other chiplets in the plurality of chiplets.

    CHASSIS EMBEDDED HEAT PIPE
    15.
    发明申请
    CHASSIS EMBEDDED HEAT PIPE 审中-公开

    公开(公告)号：US20190324507A1

    公开(公告)日：2019-10-24

    申请号：US16455323

    申请日：2019-06-27

    Applicant: Intel Corporation

    Inventor： Mark Carbone ,  Juha Tapani Paavola ,  Nicholas R. Weber

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include one or more heat sources, a heat pipe embedded in a chassis of the electronic device, where the heat pipe is thermally coupled to the one or more heat sources to collect heat from the one or more heat sources, and a thermal cooling device, where the thermal cooling device is thermally coupled to the heat pipe and can dissipate heat collected from the heat pipe using air from outside the chassis. In an example, the heat pipe is an oscillating heat pipe and has a thickness between about two (2) millimeters to about twelve (12) millimeters.

    VAPOR CHAMBER WITH IONIZED FLUID
    19.
    发明申请
    VAPOR CHAMBER WITH IONIZED FLUID 有权

    公开(公告)号：US20220095484A1

    公开(公告)日：2022-03-24

    申请号：US17541663

    申请日：2021-12-03

    Applicant: Intel Corporation

    Inventor： Twan Sing Loo ,  Jeff Ku ,  Min Suet Lim ,  Khai Ern Ke See ,  Mark Carbone

    IPC: H05K7/20 ,  F28F13/18 ,  G06F1/20

    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber that includes ionized fluid and an adjustable polarization layer coupled to the vapor chamber. The adjustable polarization layer can be used to direct a flow of the ionized fluid in the vapor chamber towards one or more heat sources. In some examples, the ionized fluid is ionized water and the adjustable polarization layer is polyester (PET) film that includes a plurality of electrode stripes.

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