公开(公告)号：US12061502B2

公开(公告)日：2024-08-13

申请号：US17368851

申请日：2021-07-07

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tin Poay Chuah ,  Howe Yin Loo ,  Chin Kung Goh ,  Yew San Lim ,  Cora Shih Wei Nien

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/203 ,  G06F1/1616

Abstract: According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.

公开(公告)号：US12284793B2

公开(公告)日：2025-04-22

申请号：US17754429

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Ritu Bawa ,  Ruander Cardenas ,  Kathiravan D ,  Jia Yan Go ,  Chin Kung Goh ,  Jeff Ku ,  Prakash Kurma Raju ,  Baomin Liu ,  Twan Sing Loo ,  Mikko Makinen ,  Columbia Mishra ,  Juha Paavola ,  Prasanna Pichumani ,  Daniel Ragland ,  Kannan Raja ,  Khal Ern See ,  Javed Shaikh ,  Gokul Subramaniam ,  George Baoci Sun ,  Xiyong Tian ,  Hua Yang ,  Mark Carbone ,  Vivek Paranjape ,  Nehakausar Pinjari ,  Hari Shanker Thakur ,  Christopher Moore ,  Gustavo Fricke ,  Justin Huttula ,  Gavin Sung ,  Sammi Wy Liu ,  Arnab Sen ,  Chun-Ting Liu ,  Jason Y. Jiang ,  Gerry Juan ,  Shih Wei Nien ,  Lance Lin ,  Evan Kuklinski

IPC: H05K7/20 ,  G06F1/20 ,  H01L23/34

Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.

公开(公告)号：US20210120699A1

公开(公告)日：2021-04-22

申请号：US17132846

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Chee How Lim ,  Khai Ern See ,  Chin Kung Goh ,  Twan Sing Loo

IPC: H05K7/20 ,  G06F1/20

Abstract: Fan module interconnect apparatus are disclosed. An example fan module includes a fan and a fan housing to carry the fan. The fan is to rotate in the fan housing. A flange extends from the fan housing and including signal paths to provide an interconnect to electrically couple at least portions of a first electrical circuit and a second electrical circuit of an electronic device.