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公开(公告)号：US20190170810A1
公开(公告)日：2019-06-06
申请号：US15832650
申请日：2017-12-05
Applicant: Intel Corporation
Inventor： Pooya Tadayon , Justin Huttula
Abstract: A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.
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公开(公告)号：US20210136956A1
公开(公告)日：2021-05-06
申请号：US17127355
申请日：2020-12-18
Applicant: Intel Corporation
Inventor： Juha Paavola , Columbia Mishra , Justin Huttula , Mark Carbone
Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
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公开(公告)号：US20250142778A1
公开(公告)日：2025-05-01
申请号：US19001914
申请日：2024-12-26
Applicant: Intel Corporation
Inventor： Juha Paavola , Columbia Mishra , Justin Huttula , Mark Carbone
Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
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公开(公告)号：US11061068B2
公开(公告)日：2021-07-13
申请号：US15832650
申请日：2017-12-05
Applicant: Intel Corporation
Inventor： Pooya Tadayon , Justin Huttula
Abstract: A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.
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Patent Agency Ranking
公开(公告)号：US12262508B2
公开(公告)日：2025-03-25
申请号：US17127355
申请日：2020-12-18
Applicant: Intel Corporation
Inventor： Juha Paavola , Columbia Mishra , Justin Huttula , Mark Carbone
Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.
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公开(公告)号：US11774489B2
公开(公告)日：2023-10-03
申请号：US17343648
申请日：2021-06-09
Applicant: Intel Corporation
Inventor： Pooya Tadayon , Justin Huttula
CPC classification number: G01R31/2853 , G01R1/06738 , G01R3/00 , G01R31/2889
Abstract: A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.
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公开(公告)号：US12284793B2
公开(公告)日：2025-04-22
申请号：US17754429
申请日：2020-12-23
Applicant: Intel Corporation
Inventor： Ritu Bawa , Ruander Cardenas , Kathiravan D , Jia Yan Go , Chin Kung Goh , Jeff Ku , Prakash Kurma Raju , Baomin Liu , Twan Sing Loo , Mikko Makinen , Columbia Mishra , Juha Paavola , Prasanna Pichumani , Daniel Ragland , Kannan Raja , Khal Ern See , Javed Shaikh , Gokul Subramaniam , George Baoci Sun , Xiyong Tian , Hua Yang , Mark Carbone , Vivek Paranjape , Nehakausar Pinjari , Hari Shanker Thakur , Christopher Moore , Gustavo Fricke , Justin Huttula , Gavin Sung , Sammi Wy Liu , Arnab Sen , Chun-Ting Liu , Jason Y. Jiang , Gerry Juan , Shih Wei Nien , Lance Lin , Evan Kuklinski
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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公开(公告)号：US20210302489A1
公开(公告)日：2021-09-30
申请号：US17343648
申请日：2021-06-09
Applicant: Intel Corporation
Inventor： Pooya Tadayon , Justin Huttula
Abstract: A testing arrangement for testing Integrated Circuit (IC) interconnects is provided. In an example, the testing arrangement includes a substrate, and a first interconnect structure. The first interconnect structure may include a first member having a first end to attach to the substrate and a second end opposite the first end, and a second member having a first end to attach to the substrate and a second end opposite the first end. In some examples, the second end of the first member and the second end of the second member are to contact a second interconnect structure of a IC device under test, and the first end of the first member and the first end of the second member are coupled such that the first member and the second member are to transmit, in parallel, current to the second interconnect structure of the IC device under test.
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公开(公告)号：US20190212363A1
公开(公告)日：2019-07-11
申请号：US15863606
申请日：2018-01-05
Applicant: Intel Corporation
Inventor： Pooya Tadayon , Justin Huttula
CPC classification number: G01R1/06755 , G01R1/06727 , H05K1/09 , H05K1/118 , H05K3/188 , H05K2203/0723
Abstract: An interconnect structure is provided which includes: a member having a first end coupled to a test card, and a second end opposite the first end; and a contact tip at the second end of the member, the contact tip to removably attach to another interconnect structure of a device under test, where a modulus of elasticity of the member varies along a length of the member.
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