公开(公告)号：US20240063082A1

公开(公告)日：2024-02-22

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T.D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  H05K7/20509 ,  H05K7/1422 ,  G11C5/06

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20240029539A1

公开(公告)日：2024-01-25

申请号：US18476069

申请日：2023-09-27

Applicant: Intel Corporation

Inventor： Prabhakar Subrahmanyam ,  Viktor Polyanko ,  Vishnu Prasadh Sugumar ,  Ying-Feng Pang ,  Mark Lawrence Bianco ,  Sandeep Ahuja ,  Tejas Shah

IPC: G08B21/18 ,  H05K7/20

CPC classification number: G08B21/182 ,  H05K7/20263 ,  H05K7/20763 ,  H05K7/20236

Abstract: Methods, systems, apparatus, and articles of manufacture to monitor heat exchangers and associated reservoirs are disclosed. An example apparatus includes programmable circuitry to detect, based on outputs of a sensor associated with a first reservoir, a coolant level of the first reservoir, the first reservoir removably coupled to a second reservoir, the first reservoir to supply coolant to the second reservoir, predict, based on the coolant level, a characteristic associated with operation of a cooling device fluidly coupled to the second reservoir, and cause an output to be presented at a user device based on the predicted characteristic.

公开(公告)号：US20210193558A1

公开(公告)日：2021-06-24

申请号：US17187470

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Ralph V. Miele ,  Phil Geng ,  Mengqi Liu ,  David Shia ,  Sandeep Ahuja ,  Eric W. Buddrius ,  Jeffory L. Smalley

IPC: H01L23/40

Abstract: Techniques for processor loading mechanisms are disclosed. In the illustrative embodiment, a heat sink is in contact with a top surface of a processor, applying a downward force on the processor. A load plate is also in contact with the processor, applying a downward force to the processor as well. The combination of the downward force from the load plate and the heat sink keep the processor in good physical contact with pins of the processor socket. The heat sink has enough force applied to the processor to be in good thermal contact with the processor without applying higher stress to the heat sink. The load plate can apply force to the processor without regard to the thermal characteristics of the load plate. Other embodiments are envisioned and described.

公开(公告)号：US20210185850A1

公开(公告)日：2021-06-17

申请号：US17185681

申请日：2021-02-25

Applicant: Intel Corporation

Inventor： Devdatta Prakash Kulkarni ,  Nishi Ahuja ,  Sandeep Ahuja ,  Timothy M. Gates ,  Casey Robert Winkel

IPC: H05K7/20

Abstract: Two liquid cooling mechanisms are provided for cooling integrated circuit components immersed in an open bath immersion tank. In the first mechanism, heat generated by high-thermal design power (TDP) components is absorbed by a working fluid passing through cold plates coupled to the high-TDP components. The cold plates are part of direct liquid cooling loops attached to supply and return manifolds fluidly connected to a cooling distribution unit. In the second mechanism, integrated circuit components not coupled to any of the direct liquid cooling loops dissipate heat directly to the immersion fluid. In some embodiments, the tank is a closed bath immersion tank and heat captured by the working fluid is reclaimed and converted to electricity. Working fluid flow rate can be adjusted based on integrated circuit component power consumption levels to achieve a desired working fluid temperature as it enters an energy reclamation unit.

公开(公告)号：US20180252483A1

公开(公告)日：2018-09-06

申请号：US15446791

申请日：2017-03-01

Applicant: Intel Corporation

Inventor： Phil Geng ,  Tejinder Pal S. Aulakh ,  Sandeep Ahuja

IPC: F28F19/00 ,  F28F3/12 ,  F28F3/06 ,  G06F1/20 ,  H05K7/20

CPC classification number: G06F1/20 ,  F28D15/0275 ,  F28D2021/0029 ,  F28F2225/04 ,  G06F1/203 ,  H01L23/3672 ,  H01L23/427 ,  H05K7/20336

Abstract: Apparatus and method to increase structural integrity of heatsinks are described herein. In embodiments, an apparatus may include a plurality of thermal dissipation fins; and a base disposed below the plurality of thermal dissipation fins, wherein the base is to include an evacuated space in which one or more thermal transport pipes and one or more stiffener structures are disposed, the evacuated space is to include a first side proximate to the plurality of thermal dissipation fins and a second side opposite the first side, and wherein a stiffener structure of the one or more stiffener structures attaches to the first or second side.

公开(公告)号：US09494996B2

公开(公告)日：2016-11-15

申请号：US13843855

申请日：2013-03-15

Applicant: Intel Corporation

Inventor： Ankush Varma ,  Robin A. Steinbrecher ,  Susan F. Smith ,  Sandeep Ahuja ,  Vivek Garg ,  Tessil Thomas ,  Krishnakanth V. Sistla ,  Chris Poirier ,  Martin Mark T. Rowland

IPC: G06F1/32 ,  G06F1/00 ,  G06F1/20

CPC classification number: G06F1/3234 ,  G06F1/20 ,  G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3287 ,  Y02D10/126 ,  Y02D10/16

Abstract: A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.

Abstract translation: 描述了具有具有非易失性存储电路的半导体芯片的处理器。 非易失性存储电路具有识别处理器的最大工作频率的信息，在该处理器处理器的操作被保证对应于极端热事件的环境温度。

公开(公告)号：US20160267269A1

公开(公告)日：2016-09-15

申请号：US15164084

申请日：2016-05-25

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Robin Steinbrecher ,  David Richardson

IPC: G06F21/55 ,  G06F1/20

CPC classification number: G06F21/554 ,  G06F1/206 ,  G06F21/00 ,  G06F21/572 ,  G06F2221/034 ,  Y02D10/16

Abstract: Methods and systems may provide for identifying a thermal management setting in a computing system, and comparing the thermal management setting to valid configuration information. In addition, the thermal management setting may be modified if it does not comply with the valid configuration information, wherein the modification can cause the thermal management setting to comply with the valid configuration information. Additionally, a threat risk notification can be initiated in order to notify users of the non-compliance.

Abstract translation: 方法和系统可以提供用于识别计算系统中的热管理设置，并将热管理设置与有效配置信息进行比较。 此外，如果热管理设置不符合有效配置信息，则可以修改热管理设置，其中修改可以使得热管理设置符合有效配置信息。 此外，可以启动威胁风险通知，以通知用户不遵守规定。

公开(公告)号：US20240172393A1

公开(公告)日：2024-05-23

申请号：US18428991

申请日：2024-01-31

Applicant: Intel Corporation

Inventor： Sandeep Ahuja ,  Yang Yao ,  Ming Zhang ,  Yuehong Fan ,  Xiang Que ,  Mark MacDonald ,  Casey Jamesen Carte ,  Yue Yang ,  Eric D. McAfee ,  Satyam Saini ,  Suchismita Sarangi ,  Drew Damm ,  Jessica Gullbrand

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/20772

Abstract: Methods and apparatus for immersion cooling systems are disclosed herein. An example apparatus includes a base plate, fins extending from the base plate, a tube extending along an axis through the fins, the tube including an inlet, and a slot extending along the axis, the inlet, the slot, and the fins sequentially defining a flow pathway.

公开(公告)号：US20230031457A1

公开(公告)日：2023-02-02

申请号：US17957436

申请日：2022-09-30

Applicant: Intel Corporation

Inventor： Phil Geng ,  Ralph Miele ,  Christopher Gonzalez ,  Timothy Gates ,  Sanjoy Saha ,  Ashish Gupta ,  Sandeep Ahuja

IPC: B21C37/16

Abstract: Methods, systems, apparatus, and articles of manufacture to crimp a tube are disclosed. An example crimp disclosed herein includes a first crimp section extending between a first end of the crimp and a point along the crimp between the first end and a second end, a first inner diameter of the first crimp section constant between the first end and the point, and a second crimp section adjacent the first crimp section, the second crimp section extending between the point and the second end, a second inner diameter of the second crimp section to increase from the point to the second end.

公开(公告)号：US11543868B2

公开(公告)日：2023-01-03

申请号：US16898603

申请日：2020-06-11

Applicant: Intel Corporation

Inventor： Tessil Thomas ,  Robin A. Steinbrecher ,  Sandeep Ahuja ,  Michael Berktold ,  Timothy Y. Kam ,  Howard Chin ,  Phani Kumar Kandula ,  Krishnakanth V. Sistla

IPC: G06F1/20 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/324 ,  G06F3/041 ,  G06F11/30 ,  G06F1/32 ,  G06F1/26

Abstract: In an embodiment, a processor includes at least one core and power management logic. The power management logic is to receive temperature data from a plurality of dies within a package that includes the processor, and determine a smallest temperature control margin of a plurality of temperature control margins. Each temperature control margin is to be determined based on a respective thermal control temperature associated with the die and also based on respective temperature data associated with the die. The power management logic is also to generate a thermal report that is to include the smallest temperature control margin, and to store the thermal report. Other embodiments are described and claimed.