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公开(公告)号：US12176643B2
公开(公告)日：2024-12-24
申请号：US17033386
申请日：2020-09-25
Applicant: Intel Corporation
Inventor： Thomas Boyd , Feifei Cheng , Eric W. Buddrius , Mohanraj Prabhugoud
Abstract: Embodiments disclosed herein include sockets and electronic packages with socket architectures. In an embodiment, a socket comprises a housing with a first surface and a second surface. In an embodiment, a plurality of interconnect pins pass through the housing. In an embodiment, an alignment hole is provided through the housing. In an embodiment, an alignment post extending out from the first surface of the housing is also provided.
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2.发明申请INTEGRATED HEAT SPREADER THAT MAXIMIZES HEAT TRANSFER FROM A MULTI-CHIP PACKAGE 审中-公开集成散热器最大限度地从多芯片包装传输热量公开(公告)号：US20160155682A1
公开(公告)日：2016-06-02
申请号：US15019931
申请日：2016-02-09
Applicant: INTEL CORPORATION
Inventor： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
IPC: H01L23/36 , H01L25/00 , H01L25/065 , H01L23/433 , H01L21/48
CPC classification number: H01L23/36 , G06F1/20 , H01L21/4882 , H01L23/433 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H05K7/20445 , Y10T29/49002 , H01L2924/00
Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
Abstract translation: 在至少一些实施例中，使热传递最大化的电子封装包括在基板上的多个部件。 组件上安装有加强板。 加强板具有露出部件的开口。 多个单独的集成散热器安装在部件的开口内。 第一热界面材料层（TIM1）沉积在组件和多个单独的集成散热器之间。 在至少一些实施例中，对于部件，TIM1的厚度最小化。
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公开(公告)号：US20250024622A1
公开(公告)日：2025-01-16
申请号：US18897941
申请日：2024-09-26
Applicant: Intel Corporation
Inventor： Richard Canham , Eric W. Buddrius , Jeffory L. Smalley , Garrett Frans Pauwels , Emery Evon Frey , Steven Adam Klein , Daniel Neumann
IPC: H05K7/10 , H01R12/57 , H01R13/11 , H01R13/405
Abstract: Protrusions of socket bodies having metal are disclosed. An example apparatus comprises a socket body, the socket body including a plastic material, an array of contacts distributed across a surface of the socket body, and a protrusion extending away from the surface of the socket body, the protrusion to facilitate alignment of an IC package with the array of contacts, the protrusion including metal.
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公开(公告)号：US20170288330A1
公开(公告)日：2017-10-05
申请号：US15084682
申请日：2016-03-30
Applicant: Intel Corporation
Inventor： Feifei Cheng , Kuang C. Liu , Michael Garcia , Eric W. Buddrius , Kevin J. Ceurter , Anthony P. Valpiani , Jonathon Robert Carstens
Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.
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公开(公告)号：US09646910B2
公开(公告)日：2017-05-09
申请号：US15019931
申请日：2016-02-09
Applicant: INTEL CORPORATION
Inventor： Sandeep Ahuja , Eric W. Buddrius , Roger D. Flynn , Rajat Agarwal
IPC: H05K7/20 , H05K13/00 , G06F1/20 , H01L23/36 , H01L23/433 , H01L21/48 , H01L25/065 , H01L25/00
CPC classification number: H01L23/36 , G06F1/20 , H01L21/4882 , H01L23/433 , H01L25/0655 , H01L25/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H05K7/20445 , Y10T29/49002 , H01L2924/00
Abstract: In at least some embodiments, an electronic package to maximize heat transfer comprises a plurality of components on a substrate. A stiffener plate is installed over the components. The stiffener plate has openings to expose the components. A plurality of individual integrated heat spreaders are installed within the openings over the components. A first thermal interface material layer (TIM1) is deposited between the components and the plurality of individual integrated heat spreaders. In at least some embodiments, the thickness of the TIM1 is minimized for the components.
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Patent Agency Ranking
公开(公告)号：US11449111B2
公开(公告)日：2022-09-20
申请号：US15942280
申请日：2018-03-30
Applicant: INTEL CORPORATION
Inventor： Eric W. Buddrius , Ralph V. Miele , Mohanraj Prabhugoud , David Shia , Jeffory L. Smalley
Abstract: A microprocessor loading mechanism, comprising a bolster plate surrounding an aperture, wherein the opening is to receive a microprocessor socket, one or more torsion bars coupled to the bolster plate, and a stud coupled to each of the one or more torsion bars, wherein each stud is to receive a nut to secure a microprocessor package to the microprocessor socket within the aperture and wherein each stud is secured to the bolster plate by each corresponding torsion bar.
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7.发明申请公开(公告)号：US20190304870A1
公开(公告)日：2019-10-03
申请号：US15942270
申请日：2018-03-30
Applicant: Intel Corporation
Inventor： Thomas Boyd , Ming-Chen Chang , Evan A. Chenelly , Divya Swamy Bandaru , Craig J. Jahne , Andrew Larson , Eric W. Buddrius , Eric D. McAfee , Mustafa Haswarey , Ralph V. Miele , Rolf Laido
IPC: H01L23/40 , H05K7/14 , H01L23/367
Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
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公开(公告)号：US20190304869A1
公开(公告)日：2019-10-03
申请号：US15942278
申请日：2018-03-30
Applicant: Intel Corporation
Inventor： Andrew Larson , Bijoyraj Sahu , Craig J. Jahne , Eric W. Buddrius , Ralph V. Miele
Abstract: A microprocessor heat sink fastener, comprising a nut comprising a thermoplastic material and fibrous fill particles and a bore extending along an axis of the nut. The bore has internal threads. The internal threads comprise a surface. At least one of the fibrous fill particles has first and second ends extending from the surface into a sub-surface region.
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公开(公告)号：US11818832B2
公开(公告)日：2023-11-14
申请号：US16828447
申请日：2020-03-24
Applicant: Intel Corporation
Inventor： Feroz Mohammad , Ralph V. Miele , Thomas Boyd , Steven A. Klein , Gregorio R. Murtagian , Eric W. Buddrius , Daniel Neumann , Rolf Laido
CPC classification number: H05K1/0203 , H05K7/20509 , H01L2023/405 , H01L2023/4087 , H01R12/85 , H05K1/181 , H05K2201/10325
Abstract: Embodiments disclosed herein include assemblies. In an embodiment, an assembly comprises a socket and a bolster plate on a board, where the bolster plate has load studs and an opening that surrounds the socket; a shim having first and second ends; and a carrier on the bolster plate, where the carrier has an opening and cutouts. The shim may have an opening through the first end as the second end is affixed to the carrier. The opening of the shim entirely over one cutout from a corner region of the carrier. In an embodiment, the assembly comprises an electronic package in the opening of the carrier, where the electronic package is affixed to the carrier, and a heatsink over the electronic package and carrier, where the first end is directly coupled to a surface of the heatsink and a surface of one load stud of the bolster plate.
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公开(公告)号：US11291115B2
公开(公告)日：2022-03-29
申请号：US15942263
申请日：2018-03-30
Applicant: Intel Corporation
Inventor： Shelby A. Ferguson , Bijoyraj Sahu , Russell Aoki , Thomas Boyd , Eric W. Buddrius , Kevin Ceurter , Mustafa Haswarey , Rolf Laido , Daniel Neumann , Rachel Taylor , Anthony Valpiani
Abstract: A microprocessor carrier, comprising a frame comprising a metal. The first frame surrounds an aperture for receiving a microprocessor package. At least one hinge assembly is on a first frame edge, and at least one latch assembly is on a second frame edge. One or more alignment tabs coupled to the frame. The one or more alignment tabs extend orthogonally from at least one frame edge. The alignment tabs are to align the microprocessor package with a microprocessor socket. The hinge assembly and the latch assembly are to engage with a microprocessor loading mechanism coupled to a printed circuit board.
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