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公开(公告)号：US09296606B2
公开(公告)日：2016-03-29
申请号：US14172894
申请日：2014-02-04
Applicant: INVENSENSE, INC.
Inventor： Kirt Reed Williams , Matthew Julian Thompson , Joseph Seeger
CPC classification number: B81B3/0051 , B81B2201/0221 , B81B2201/0235 , B81B2201/0271 , B81C1/00666 , G01K1/00 , G01N3/20 , G01P15/125 , G01P2015/0828
Abstract: A method and system for a MEMS device is disclosed. The MEMS device includes a free layer, with a first portion and a second portion. The MEMS device also includes a underlying substrate, the free layer movably positioned relative to the underlying substrate. The first portion and second portion of the free layer are coupled through at least one stem. A sense material is disposed over portions of the second portion of the free layer. Stress in the sense material and second portion of the free layer does not cause substantial deflection of the first portion.
Abstract translation: 公开了一种用于MEMS器件的方法和系统。 MEMS器件包括具有第一部分和第二部分的自由层。 MEMS器件还包括下面的衬底，自由层相对于下面的衬底可移动地定位。 自由层的第一部分和第二部分通过至少一个杆连接。 感测材料设置在自由层的第二部分的部分上。 感应材料和自由层的第二部分的应力不会引起第一部分的实质的偏转。
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公开(公告)号：US09291456B2
公开(公告)日：2016-03-22
申请号：US14472143
申请日：2014-08-28
Applicant: InvenSense, Inc.
Inventor： Joseph Seeger , Ozan Anac
IPC: G01C19/00 , G01C19/5733 , G01C19/574 , G01C19/5755 , G01C19/5712
Abstract: A gyroscope is disclosed. The gyroscope comprises a substrate; and a guided mass system. The guided mass system comprises proof-mass and guiding arm. The proof-mass and the guiding arm are disposed in a plane parallel to the substrate. The proof-mass is coupled to the guiding arm. The guiding arm is also coupled to the substrate through a spring. The guiding arm allows motion of the proof-mass to a first direction in the plane. The guiding arm and the proof-mass rotate about a first sense axis. The first sense axis is in the plane and parallel to the first direction. The gyroscope includes an actuator for vibrating the proof-mass in the first direction. The gyroscope also includes a transducer for sensing motion of the proof-mass-normal to the plane in response to angular velocity about a first input axis that is in the plane and orthogonal to the first direction.
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13.发明授权公开(公告)号：US09086730B2
公开(公告)日：2015-07-21
申请号：US13673882
申请日：2012-11-09
Applicant: InvenSense, Inc.
Inventor： Behrad Aria , David Sachs , Joseph Seeger
CPC classification number: G06F3/017 , G06F3/03 , G06F3/0412
Abstract: Selectable communication interface configurations for motion sensing devices. In one aspect, a module for a motion sensing device includes a motion processor connected to a device component and a first motion sensor, and a multiplexer having first and second positions. Only one of the multiplexer positions is selectable at a time, where the first position selectively couples the first motion sensor and the device component using a first bus, and the second position selectively couples the first motion sensor and the motion processor using a second bus, wherein communication of information over the second bus does not influence a communication bandwidth of the first bus.
Abstract translation: 运动感应装置可选择的通讯接口配置。 一方面，用于运动感测装置的模块包括连接到装置部件和第一运动传感器的运动处理器以及具有第一和第二位置的多路复用器。 一次只能选择一个多路复用器位置，其中第一位置使用第一总线选择性地耦合第一运动传感器和设备部件，并且第二位置使用第二总线选择性地耦合第一运动传感器和运动处理器， 其中通过第二总线的信息通信不影响第一总线的通信带宽。
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公开(公告)号：US08945969B2
公开(公告)日：2015-02-03
申请号：US14456973
申请日：2014-08-11
Applicant: InvenSense, Inc.
Inventor： Kegang Huang , Jongwoo Shin , Martin Lim , Michael Julian Daneman , Joseph Seeger
CPC classification number: B81C1/00301 , B81B7/0064 , B81B2207/098 , B81C1/00269 , B81C2203/0118 , B81C2203/019 , B81C2203/031
Abstract: A method of fabricating electrical connections in an integrated MEMS device is disclosed. The method comprises forming a MEMS wafer. Forming a MEMS wafer includes forming one cavity in a first semiconductor layer, bonding the first semiconductor layer to a second semiconductor layer with a dielectric layer disposed between the first semiconductor layer and the second semiconductor layer, and etching at least one via through the second semiconductor layer and the dielectric layer and depositing a conductive material on the second semiconductor layer and filling the at least one via. Forming a MEMS wafer also includes patterning and etching the conductive material to form one standoff and depositing a germanium layer on the conductive material, patterning and etching the germanium layer, and patterning and etching the second semiconductor layer to define one MEMS structure. The method also includes bonding the MEMS wafer to a base substrate.
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公开(公告)号：US20140266170A1
公开(公告)日：2014-09-18
申请号：US14208222
申请日：2014-03-13
Applicant: Invensense, Inc.
Inventor： Joseph Seeger , Jin Qiu , Matthew Julian Thompson
CPC classification number: G01R33/02 , B81B2201/00 , G01P15/08 , G01R33/0286 , H01L21/00 , H01L2221/00
Abstract: A MEMS device including a first proof mass, a first magnetized magnetic material disposed partially on a surface of the first proof mass, a first spring anchored to a substrate to support the first proof mass, and a first sensing element coupled to the first proof mass and operable to sense the motion of the first proof mass caused by an ambient acceleration. The MEMS device further includes a second sensing element coupled to the first proof mass and operable to sense the motion of the first proof mass caused by an ambient magnetic field
Abstract translation: 一种MEMS器件，包括第一检测质量体，部分地设置在第一检验质量体的表面上的第一磁化磁性材料，锚固到基板以支撑第一检测质量块的第一弹簧，以及耦合到第一检测质量块的第一感测元件 并且可操作以感测由环境加速度引起的第一检测质量块的运动。 MEMS器件还包括耦合到第一检验质量块的第二感测元件，并且可操作以感测由环境磁场引起的第一检验质量块的运动
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Patent Agency Ranking
公开(公告)号：US11650078B2
公开(公告)日：2023-05-16
申请号：US17825856
申请日：2022-05-26
Applicant: InvenSense, Inc.
Inventor： Doruk Senkal , Houri Johari-Galle , Joseph Seeger
IPC: G01C25/00 , G01C19/5776 , G01C19/5719 , G01C19/5726 , G01R29/02 , G01R19/00 , G01R23/00 , G01R25/00
CPC classification number: G01C25/005 , G01C19/5719 , G01C19/5726 , G01C19/5776 , G01R19/0038 , G01R23/005 , G01R25/00 , G01R29/02 , B81B2201/0242 , B81B2207/03
Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.
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公开(公告)号：US20210116244A1
公开(公告)日：2021-04-22
申请号：US17138392
申请日：2020-12-30
Applicant: INVENSENSE, INC.
Inventor： Doruk Senkal , Robert Hennessy , Houri Johari-Galle , Joseph Seeger
IPC: G01C19/5712 , G01C19/5747 , G01C19/5762
Abstract: In a first aspect, the angular rate sensor comprises a substrate and a rotating structure anchored to the substrate. The angular rate sensor also includes a drive mass anchored to the substrate and an element coupling the drive mass and the rotating structure. The angular rate sensor further includes an actuator for driving the drive mass into oscillation along a first axis in plane to the substrate and for driving the rotating structure into rotational oscillation around a second axis normal to the substrate; a first transducer to sense the motion of the rotating structure in response to a Coriolis force in a sense mode; and a second transducer to sense the motion of the sensor during a drive mode. In a second aspect the angular rate sensor comprises a substrate and two shear masses which are parallel to the substrate and anchored to the substrate via flexible elements. In further embodiments, a dynamically balanced 3-axis gyroscope architecture is provided. Various embodiments described herein can facilitate providing linear and angular momentum balanced 3-axis gyroscope architectures for better offset stability, vibration rejection, and lower part-to-part coupling.
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公开(公告)号：US10793424B2
公开(公告)日：2020-10-06
申请号：US16558145
申请日：2019-09-01
Applicant: INVENSENSE, INC.
Inventor： Matthew Julian Thompson , Stephen Lloyd , Joseph Seeger
IPC: B81B7/00 , G01N3/02 , G01M7/08 , G01M17/007 , G01M1/16 , B81B7/02 , B81C99/00 , G06F11/30 , H01L21/66 , H03K21/02
Abstract: A device with a first MEMS device and a second MEMS device is disclosed. The first MEMS device is configured to sense at least one external influence. The second MEMS device is responsive to the at least one external influence. The first MEMS device is configured to change a state when the at least one external influence exceeds a threshold value. The first MEMS device is configured to retain the state below the threshold value, wherein the change in state of the first MEMS device is done passively and wherein the state of the first MEMS device is indicative of a status of the second MEMS device. In one example, the first MEMS device further comprises a normally open switch that closes when the external influence exceeds the threshold value.
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公开(公告)号：US10746565B2
公开(公告)日：2020-08-18
申请号：US16370664
申请日：2019-03-29
Applicant: InvenSense, Inc.
Inventor： Doruk Senkal , Joseph Seeger
IPC: G01C25/00 , G01C19/5614 , G01C19/5726 , G01C19/5649 , G01C19/5776
Abstract: A method includes receiving a signal from a sensor. The signal includes a first in-phase component and a first quadrature component. The first in-phase and quadrature components are identified. A rate signal is applied to the sensor and the sensor generates a sensed rate signal. A second in-phase and quadrature components associated with the sensed rate signal are determined. A phase error based on the first and the second in-phase components, and the first and the second quadrature components is determined. The method may further include reducing error in measurements associated with the sensor by dynamically compensating for the determined phase error, e.g., by modifying a clock signal, by changing a demodulation phase of a demodulator used to identify the in-phase and the quadrature components.
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公开(公告)号：US20200056887A1
公开(公告)日：2020-02-20
申请号：US16540852
申请日：2019-08-14
Applicant: INVENSENSE, INC.
Inventor： Joseph Seeger
IPC: G01C19/5776
Abstract: Reducing, at a common sense electrode of a group of sensors of a system, a common charge flow due to a common motion of the group of sensors is presented herein. The group of electromechanical sensors generates a common charge flow as a result of a common motion of the group of electromechanical sensors and a differential charge flow as a result of a differential motion of the group of electromechanical sensors—respective sense elements of the group of electromechanical sensors being electrically connected at the common sense electrode. The system further comprises a voltage-to-voltage converter component that generates, via an output of the voltage-to-voltage converter component, a positive feedback voltage, and minimizes the common charge flow by coupling, via a defined feedback capacitance, the positive feedback voltage to the common sense electrode—the common sense electrode being electrically coupled to an input of the voltage-to-voltage converter component.
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