公开(公告)号：US07300820B2

公开(公告)日：2007-11-27

申请号：US10801894

申请日：2004-03-16

Applicant: Jinbao Jiao ,  Kevin D. Moore ,  Thomas P. Gall ,  William C. Weigler

Inventor： Jinbao Jiao ,  Kevin D. Moore ,  Thomas P. Gall ,  William C. Weigler

IPC: H01L21/00

CPC classification number: H05K3/0061 ,  H05K3/1225 ,  H05K3/386 ,  H05K2201/09827 ,  H05K2201/09909

Abstract: An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed upon one of the printed circuit board and/or substrate, and a liquid adhesive is printed onto the printing tool. The liquid adhesive forms islands of adhesive within each aperture. Removing the printing tool deforms each island to form a raised edge at a periphery of each island. A temporary liner can be placed on the raised edges to protect the adhesive until the printed circuit board can be assembled with the substrate.

Abstract translation: 一种用于将印刷电路板固定到基底的粘合剂组件的装置和方法。 该组件提供具有通过其限定的多个孔的印刷工具。 优选地，孔具有比底部开口更大的面积的顶部开口。 印刷工具放置在印刷电路板和/或基板之一上，并将液体粘合剂印刷到印刷工具上。 液体粘合剂在每个孔内形成粘合剂岛。 移除打印工具使每个岛变形，以在每个岛的周边形成凸起的边缘。 可以将临时衬垫放置在凸起边缘上以保护粘合剂，直到印刷电路板可以与衬底组装在一起。

公开(公告)号：US5327013A

公开(公告)日：1994-07-05

申请号：US91937

申请日：1993-07-15

Applicant: Kevin D. Moore ,  Carl Missele

Inventor： Kevin D. Moore ,  Carl Missele

IPC: B05D7/00 ,  C23C26/00 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34 ,  H01L23/48 ,  H01L29/40 ,  H01L29/44 ,  H01L29/52

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

公开(公告)号：US5281684A

公开(公告)日：1994-01-25

申请号：US876147

申请日：1992-04-30

Applicant: Kevin D. Moore ,  Carl Missele

Inventor： Kevin D. Moore ,  Carl Missele

IPC: B05D7/00 ,  C23C26/00 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder.

Abstract translation: 用于在集成电路管芯上形成焊料凸点的方法利用由铜颗粒和聚合物粘合剂构成的导电性，可焊接润湿的复合材料形成的端子（12）。 端子包括覆盖在模具上的钝化层（20）的接合焊盘（24）和将接合焊盘连接到金属接触件（16）的流道部分（26）。 端子通过丝网印刷例如作为油墨施加到模具，之后，焊接体的一部分与接合焊盘接触而形成凸块。 端子的优选材料由镀银铜颗粒和甲阶型酚醛粘合剂组成。

公开(公告)号：US5117609A

公开(公告)日：1992-06-02

申请号：US519860

申请日：1990-05-07

Applicant: Lonnie R. Seymour ,  Kevin D. Moore

Inventor： Lonnie R. Seymour ,  Kevin D. Moore

IPC: B65B17/02 ,  B65B61/04 ,  B65D67/02

CPC classification number: B65B61/04 ,  B65B17/025

Abstract: An apparatus and method for assembling a plurality of articles with carriers in a connected carrier strip. The apparatus and method separates the strip of carriers assembled with a plurality of articles to form discrete packages of a plurality of articles by dividing the carrier strip horizontally tranversely to the path of travel of the articles and the assembled carrier strip. The portion of the apparatus for separating the articles is positionable between groups of articles moving along a path of travel and provides tensioning of the carrier strip between groups of articles to facilitate dividing the carrier strip along weakened lines.

公开(公告)号：US4995224A

公开(公告)日：1991-02-26

申请号：US445936

申请日：1989-12-05

Applicant: Ray A. Yourgalite ,  Malcolm Moore ,  Neal C. Chamberlain ,  Kenneth F. Becicka ,  Samuel J. Hilgeman ,  Kevin D. Moore

Inventor： Ray A. Yourgalite ,  Malcolm Moore ,  Neal C. Chamberlain ,  Kenneth F. Becicka ,  Samuel J. Hilgeman ,  Kevin D. Moore

IPC: B65B11/04 ,  B65G61/00

CPC classification number: B65B11/045 ,  B65G61/00

Abstract: An article stack unifying device having article stacking elements is provided to stack a plurality of articles on a surface on or of a rotatable surface. While the articles are being stacked on the selected surface a quantity of wrapping film is wrapped around the stack of articles at intervals during the stacking process and at the completion of the stack.

Abstract translation: 具有物品堆叠元件的物品堆叠统一装置被设置成将多个物品堆叠在可旋转表面上或表面上的表面上。 当物品被堆叠在所选择的表面上时，在堆叠过程期间和堆叠完成时，一定数量的包装膜在堆叠物品周围被间隔缠绕。

公开(公告)号：US08387341B2

公开(公告)日：2013-03-05

申请号：US12688591

申请日：2010-01-15

Applicant: Kevin D. Moore ,  Christopher J. Samaras

Inventor： Kevin D. Moore ,  Christopher J. Samaras

IPC: B65B21/24

CPC classification number: B65B5/02 ,  B65B17/025 ,  B65B59/00

Abstract: A machine for packaging multiple containers wherein a flexible carrier stock is fed across a jaw drum. A plurality of containers are also moved through the machine whereby the carrier is subsequently positioned over the plurality of containers so that flexible carrier stock engages with one of the containers to form a package. The jaw drum and/or a connected feed drum are preferably adjustable to accommodate a range of container sizes and carrier configurations.

Abstract translation: 一种用于包装多个容器的机器，其中柔性载体坯料被供给穿过钳口滚筒。 多个容器也移动通过机器，由此托架随后定位在多个容器上方，使得柔性载体坯料与容器之一接合以形成包装。 下巴滚筒和/或连接的进料滚筒优选是可调节的，以适应一定范围的容器尺寸和载体构造。

公开(公告)号：US07075794B2

公开(公告)日：2006-07-11

申请号：US10659884

申请日：2003-09-11

Applicant: Thomas P. Gall ,  Kevin D. Moore ,  Timothy J. Trento

Inventor： Thomas P. Gall ,  Kevin D. Moore ,  Timothy J. Trento

IPC: H05K1/00

CPC classification number: H05K1/0281 ,  H05K1/0366 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/2009

Abstract: An electronic control unit having a flexible circuit board assembly is disclosed. The electronic control unit comprises a flexible circuit board with at least one layer having first and second portions separated by a bendable region. The electronic control unit further comprises a substantially rigid substrate having first and second portions separated by a bend region and inside and outside surfaces. The first and second portions of the circuit board are affixed to respective first and second portions of the substrate. The bend region has one of the group of a recess and aperture extending outwardly from the inside surface of the substrate with the one of the group of the recess and aperture sized to accept the bendable region of the circuit board.

Abstract translation: 公开了一种具有柔性电路板组件的电子控制单元。 电子控制单元包括具有至少一个层的柔性电路板，该层具有由可弯曲区域分开的第一和第二部分。 电子控制单元还包括具有由弯曲区域和内表面和外表面分开的第一和第二部分的基本上刚性的基板。 电路板的第一和第二部分固定到基板的相应的第一和第二部分。 弯曲区域具有从基板的内表面向外延伸的一组凹部和孔中的一个，其中一组凹部和孔的尺寸被设计成接纳电路板的可弯曲区域。

公开(公告)号：US06927344B1

公开(公告)日：2005-08-09

申请号：US10789522

申请日：2004-02-27

Applicant: Thomas P. Gall ,  Richard A. Hawkins ,  Kevin D. Moore

Inventor： Thomas P. Gall ,  Richard A. Hawkins ,  Kevin D. Moore

IPC: H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  B32B3/28

CPC classification number: H05K1/0278 ,  H05K1/0366 ,  H05K3/0044 ,  H05K2201/09036 ,  H05K2203/302 ,  Y10T428/24537

Abstract: A flexible circuit board assembly and method includes a rigid circuit board having a first portion and a second portion separated by a bending region. A plurality of grooves are cut into the bending region. The grooves are cut substantially parallel to an axis about which the bending region is bent. Preferably, the grooves are located on an inside bending radius of the circuit board, but can be located on the outside radius or both.

Abstract translation: 柔性电路板组件和方法包括具有第一部分和由弯曲区域分开的第二部分的刚性电路板。 多个槽被切入弯曲区域。 基本上平行于弯曲区域弯曲的轴线切割凹槽。 优选地，槽位于电路板的内侧弯曲半径上，但是可以位于外半径上或两者之间。

公开(公告)号：US06841739B2

公开(公告)日：2005-01-11

申请号：US10208942

申请日：2002-07-31

Applicant: Kevin D. Moore

Inventor： Kevin D. Moore

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K5/00

CPC classification number: H05K3/0014 ,  H05K1/0212 ,  H05K1/0366 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0061 ,  H05K5/0043 ,  H05K2201/09109 ,  H05K2201/0999 ,  H05K2201/2009 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A flexible circuit board (20) having a substantially rigid substrate (22) and an electrical resistance heater trace (24). The substantially rigid substrate (22) has a first portion (26), a second portion (28), and a bend region (30). The bend region (30) interconnects the first portion (26) and the second portion (28). The electrical resistance heater trace (24) is formed on the bend region (30) of the substrate (22). The first portion (26) of the substrate (22) is capable of being folded relative to the second portion (28) of the substrate (22) to form at least one bend (72, 172) in the bend region (30) when an electric current is applied to the heater trace (24). There is also an electronic control unit (60, 160) that includes the flexible circuit board (20) and a method of assembling an electronic control unit (60, 160).

Abstract translation: 具有基本上刚性的基板（22）和电阻加热器迹线（24）的柔性电路板（20）。 基本刚性的基底（22）具有第一部分（26），第二部分（28）和弯曲区域（30）。 弯曲区域（30）将第一部分（26）和第二部分（28）互连。 电阻加热器迹线（24）形成在基板（22）的弯曲区域（30）上。 基板（22）的第一部分（26）能够相对于基板（22）的第二部分（28）折叠，以在弯曲区域（30）中形成至少一个弯曲部（72,172），当弯曲区域 向加热器迹线（24）施加电流。 还有一个包括柔性电路板（20）的电子控制单元（60,160）和组装电子控制单元（60,160）的方法。

公开(公告)号：US06501661B1

公开(公告)日：2002-12-31

申请号：US10027443

申请日：2001-12-21

Applicant: Kevin D. Moore ,  Thomas P. Gall ,  Jeffrey Lord

Inventor： Kevin D. Moore ,  Thomas P. Gall ,  Jeffrey Lord

IPC: H05K500

CPC classification number: H05K1/0278 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09063 ,  H05K2201/09109 ,  H05K2201/09745 ,  H05K2203/302

Abstract: An electronic control unit (ECU) includes a flexible circuit substrate having a first partition interconnected to a third partition by a second, flexible partition. The electronic control unit further includes a rigidizer having a first partition interconnected to a third partition by a second partition. When the ECU is twice folded, the second, flexible partition of the circuit substrate assumes an approximate ‘U’-shape, resulting in a reduced cracking and splitting rate than the prior art. In various embodiments of the present invention, the assumption of a ‘U’-shaped fold in the second, flexible partition of the circuit substrate is facilitated by multiple apertures in a second rigidizer partition, by a depression in a second rigidizer partition, or by non-slidably affixing a first circuit substrate partition to a first rigidizer partition via a first adhesive and non-slidably affixing a third circuit substrate partition to a third rigidizer partition via a second adhesive.

Abstract translation: 电子控制单元（ECU）包括柔性电路基板，该柔性电路基板具有通过第二柔性隔板互连到第三隔板的第一隔板。 电子控制单元还包括刚性化器，其具有通过第二分隔件互连到第三分隔件的第一分隔件。 当ECU被两次折叠时，电路基板的第二柔性隔板呈现近似的“U”形，导致与现有技术相比降低的开裂和分裂速率。在本发明的各种实施例中，假设a “在第二刚性分隔器中的多个孔口，通过在第二刚性化器隔板中的凹陷，或通过不可滑动地将第一电路衬底隔板固定到第一刚性分隔件 经由第一粘合剂的刚性分隔件，并且通过第二粘合剂将第三电路基板隔板不可滑动地附接到第三刚性分隔件。