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    ENCAPSULATION FILM
    11.
    发明申请
    ENCAPSULATION FILM 有权

    公开(公告)号：US20220154054A1

    公开(公告)日：2022-05-19

    申请号：US17434665

    申请日：2020-02-28

    Applicant: LG CHEM, LTD

    Inventor： Eun Gu HAN ,  So Young KIM ,  Seung Min LEE ,  Se Woo YANG

    IPC: C09J153/00 ,  C09J7/30 ,  C09J11/06 ,  H01L51/00 ,  H01L51/52 ,  H01L51/56

    Abstract: The present disclosure relates to an encapsulation film and an organic electronic device comprising the same, which provides an encapsulation film having excellent resilience without causing plastic deformation, while having flexible and rollable characteristics, as well as implementing excellent moisture barrier characteristics, and an organic electronic device comprising the same. The encapsulation film includes an encapsulation composition which includes a block copolymer having a first block derived from a monomer having a glass transition temperature of 0° C. or higher, and a multifunctional oligomer, where, after the encapsulation film is stretched 200% (2 times the existing length) in the longitudinal direction under conditions of a temperature of 25° C. and 60% relative humidity and left for 24 hours, the degree of restoration at the time of removing the stretched force and measuring the length after 1 hour is within 110% of the existing length.

    ADHESIVE FILM
    15.
    发明申请
    ADHESIVE FILM 有权
    胶粘膜

    公开(公告)号：US20140332782A1

    公开(公告)日：2014-11-13

    申请号：US14337990

    申请日：2014-07-22

    Applicant: LG CHEM, LTD.

    Inventor： Hyun Jee YOO ,  Suk Ky CHANG ,  Seung Min LEE

    IPC: H01L51/52 ,  C09J7/02

    CPC classification number: H01L51/5246 ,  C08K5/0025 ,  C09J7/00 ,  C09J7/10 ,  C09J7/20 ,  C09J7/22 ,  C09J7/35 ,  C09J2201/128 ,  C09J2201/40 ,  C09J2203/322 ,  C09J2205/102 ,  C09J2400/163 ,  H01L51/5237 ,  H01L51/5253 ,  H01L51/5259 ,  H01L2251/566 ,  Y10T156/1052 ,  Y10T428/1471 ,  Y10T428/26 ,  Y10T428/2835 ,  Y10T428/2848

    Abstract: An adhesive film, a method for preparing an adhesive film, and an organic electronic device are provided. According to the adhesive film in exemplary embodiments of the present invention, fluidity of an adhesive can be controlled in the case of applying the adhesive between objects to be subsequently adhered to each other and then thermal-compressing by including an adhesive layer with cured side faces contacting with the outside. The adhesive film is used, for example for assembling a panel and the like, and thereby a defect rate at the time of assembling a panel and the like can be reduced and excellent work characteristics can be provided. In addition, before being applied to a panel or the like, a moisture absorbent included inside an adhesive layer of an adhesive film can be protected from external moisture or the like, thereby being easily stored, and also when it is applied to a product, reliability of life span, and the like can be secured.

    Abstract translation: 提供粘合膜，制备粘合膜的方法和有机电子器件。 根据本发明的示例性实施方案中的粘合剂膜，在将粘合剂彼此粘附在一起的物体之间施加粘合剂的情况下可以控制粘合剂的流动性，然后通过包括具有固化侧面的粘合剂层进行热压缩 与外界接触。 使用粘合膜，例如用于组装面板等，从而可以减少组装面板等时的缺陷率，并且可以提供优异的工作特性。 此外，在涂布到面板等之前，可以防止包含在粘合剂膜的粘合剂层内的吸湿剂免受外部湿气等的影响，从而容易地储存，并且当将其应用于产品时， 寿命的可靠性等可以确保。

    TOUCH PANEL
    17.
    发明申请
    TOUCH PANEL 有权
    触控面板

    公开(公告)号：US20140134434A1

    公开(公告)日：2014-05-15

    申请号：US14158544

    申请日：2014-01-17

    Applicant: LG CHEM, LTD.

    Inventor： Min Soo PARK ,  Se Woo YANG ,  Suk Ky CHANG ,  Seung Min LEE

    IPC: G06F3/041 ,  C09J7/02

    CPC classification number: G06F3/0412 ,  C08F220/10 ,  C08K5/37 ,  C08L41/00 ,  C09J4/00 ,  C09J7/385 ,  C09J133/08 ,  C09J133/14 ,  G06F3/041 ,  Y10T428/2891

    Abstract: Provided is a touch panel. The touch panel includes a base and a pressure-sensitive adhesive layer attached to the base and having a peel strength with respect to a polycarbonate sheet of 1,900 g/25 mm or more. The pressure-sensitive adhesive layer includes an acryl polymer compound containing an acryl polymer and a thiol polymer derived by binding a thiol compound into a chain, or a side chain or terminal end of a chain of the acryl polymer. Accordingly, penetration of oxygen, moisture or other impurities at an interface between the base film and the pressure-sensitive adhesive layer, or at an interface between a conductor thin film and a pressure-sensitive adhesive layer may be effectively inhibited, and degradation in optical properties such as visibility due to bubbles generated at a pressure-sensitive adhesive interface may be prevented. In addition, when the pressure-sensitive adhesive layer is directly attached to the conductor thin film and even exposed to severe conditions such as high temperature or high temperature and high humidity, the change in the resistance of the conductor thin film may be effectively inhibited, and thus the touch panel may be stably driven for a long time.

    Abstract translation: 提供触摸屏。 触摸面板包括基底和粘合剂层，该粘合剂层附着到基底上并且相对于聚碳酸酯片材的剥离强度为1900g / 25mm以上。 压敏粘合剂层包括含有丙烯酸聚合物的丙烯酸类聚合物化合物和通过将硫醇化合物结合到丙烯酸聚合物的链的链或侧链或末端衍生的硫醇聚合物。 因此，可以有效地抑制在基膜和压敏粘合剂层之间的界面处或导体薄膜和压敏粘合剂层之间的界面处的氧气，水分或其它杂质的渗透，并且光学劣化 可以防止由于在压敏粘合剂界面处产生的气泡而导致的可视性等特性。 此外，当压敏粘合剂层直接附着在导体薄膜上并且甚至暴露于诸如高温或高温和高湿度的严酷条件下时，可以有效地抑制导体薄膜的电阻变化， 因此触摸面板可以长时间稳定地驱动。

    ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE
    18.
    发明申请
    ADHESIVE FILM AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE 有权
    粘合膜和封装有机电子器件的方法

    公开(公告)号：US20140091296A1

    公开(公告)日：2014-04-03

    申请号：US14098347

    申请日：2013-12-05

    Applicant: LG CHEM, LTD.

    Inventor： Hyun Jee YOO ,  Yoon Gyung CHO ,  Seung Min LEE ,  Suk Ky CHANG ,  Jung Sup SHIM

    IPC: H01L51/52

    CPC classification number: H01L51/5246 ,  C08K3/013 ,  C08K3/22 ,  C08K3/24 ,  C08K3/32 ,  C08K2003/2227 ,  C09J7/00 ,  C09J7/10 ,  C09J7/35 ,  C09J11/00 ,  C09J2201/134 ,  C09J2201/36 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2463/00 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/5259 ,  Y10T428/24942 ,  Y10T428/24959

    Abstract: Provided are an adhesive film, an encapsulated product of an organic electronic device using the same, and a method of encapsulating an organic electronic device. Particularly, the adhesive film encapsulating the organic electronic device to cover an entire surface of the organic electronic device includes an adhesive layer including a curable resin and a moisture adsorbent. The adhesive layer has a viscosity in a temperature range of 30 to 130° C. of 101 to 106 Pa·s and a viscosity at room temperature of 106 Pa·s or more in an uncured state, and when the adhesive layer has a multilayered structure, a difference in melting viscosity between layers is less than 30 Pa·s. In addition, the method of encapsulating an organic electronic device using the adhesive film is provided.

    Abstract translation: 提供一种粘合膜，使用其的有机电子器件的封装产品，以及封装有机电子器件的方法。 特别地，封装有机电子器件以覆盖有机电子器件的整个表面的粘合剂膜包括具有可固化树脂和水分吸附剂的粘合剂层。 粘合剂层在未固化状态下的粘度在30〜130℃的温度范围为101〜106Pa·s，室温下的粘度为106Pa·s以上，并且当粘合剂层具有多层 结构上，层间的熔融粘度差小于30Pa·s。 此外，提供了使用粘合膜封装有机电子器件的方法。

    ENCAPSULATION FILM
    19.
    发明申请
    ENCAPSULATION FILM 有权

    公开(公告)号：US20220393139A1

    公开(公告)日：2022-12-08

    申请号：US17769675

    申请日：2020-10-28

    Applicant: LG CHEM, LTD.

    Inventor： Yeong Bong MOK ,  Seung Min LEE ,  Sang Min PARK ,  Sung Nam MOON ,  Se Woo YANG

    IPC: H01L51/52

    Abstract: An encapsulation film, a method for manufacturing the same, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same are provided, where the encapsulation film allows forming a structure capable of blocking moisture or oxygen penetrating into an organic electronic device from outside and prevents generation of bright spots in the organic electronic device.

    ENCAPSULATION COMPOSITION
    20.
    发明申请
    ENCAPSULATION COMPOSITION 有权

    公开(公告)号：US20220029133A1

    公开(公告)日：2022-01-27

    申请号：US17299222

    申请日：2019-12-09

    Applicant: LG CHEM, LTD

    Inventor： Seung Min LEE ,  Yeong Bong MOK ,  Sung Nam MOON ,  Se Woo YANG

    IPC: H01L51/52 ,  B01J20/04 ,  B01J20/26 ,  B01J20/28 ,  H01L51/56

    Abstract: The present disclosure relates to an encapsulation composition, an encapsulation film comprising the same, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device using the same, which provides an encapsulation composition capable of effectively blocking moisture or oxygen introduced into an organic electronic device from the outside and realizing an organic electronic device with an extremely small bezel part structure.

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