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公开(公告)号：US10378927B2
公开(公告)日：2019-08-13
申请号：US15744240
申请日：2016-03-15
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Keun Cho , Jeong Han Kim , Bi Yi Kim , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
Abstract: A direction detection device, according to one embodiment of the present invention, comprises: a dielectric layer; a first electrode layer which is arranged on a first surface of the dielectric layer, and which comprises a plurality of first electrode patterns arranged in a first direction; a second direction arranged on a second surface of the dielectric layer, which faces the first surface; a capacitance detection unit which detects changes in capacitance due to time difference between a first region and a second region, wherein in the first region, at least one selected among the plurality of first electrode patterns overlaps the second electrode layer, and in the second region, at least one selected from the plurality of the remaining first electrode patterns overlaps the second electrode layer; and a direction detection unit which connects to the capacitance detection unit, and detects a movement direction on the basis of the time difference between the first region and the second region.
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公开(公告)号：US09874335B2
公开(公告)日：2018-01-23
申请号：US14091755
申请日：2013-11-27
Applicant: LG INNOTEK CO., LTD.
Inventor： Seung Kwon Hong , Hyun Gyu Park , In Hee Cho , Hyuk Soo Lee
IPC: F21V19/00 , H05K1/02 , H05K3/00 , G02F1/1335
CPC classification number: F21V19/003 , G02F2001/133612 , H05K1/0278 , H05K1/028 , H05K3/0061 , H05K2201/0394 , H05K2201/09063 , H05K2201/10106 , H05K2203/302
Abstract: Provided is a printed circuit board including: a support substrate including a first area in which a light emitting device is mounted, and a second area extending from the first area; a bending part which is configured such that a part between the first area and the second area is bent; a through hole passing through the bending part; a connection wiring connected to the light emitting device and disposed on the bending part; and a wiring connected to the connection wiring.
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公开(公告)号：US09730319B2
公开(公告)日：2017-08-08
申请号：US14568544
申请日：2014-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Man Hue Choi , Min Jae Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
IPC: H05K1/02 , H05K1/18 , H05K3/28 , G02F1/1335
CPC classification number: H05K1/0281 , G02F1/133615 , G02F2001/133612 , H05K1/0278 , H05K1/181 , H05K1/189 , H05K3/28 , H05K2201/046 , H05K2201/10106
Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.
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公开(公告)号：US09726811B2
公开(公告)日：2017-08-08
申请号：US14290519
申请日：2014-05-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woong Na , Min Jae Kim , Bi Yi Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: G02B6/0081 , F21V15/00 , G02B6/0091 , G02B6/0093
Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.
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公开(公告)号：US09506637B2
公开(公告)日：2016-11-29
申请号：US14472075
申请日：2014-08-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Gyu Park , Min Jae Kim , Se Woong Na , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: F21V21/14 , G02B6/0068 , G02B6/0091 , G02F1/133615 , H05K1/0278 , H05K1/028 , H05K1/056 , H05K3/0061 , H05K2201/0394 , H05K2201/09054 , H05K2201/09063 , H05K2201/10106 , H05K2203/0195 , H05K2203/302
Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.
Abstract translation: 提供一种电路板，包括：支撑基板，包括第一区域和从第一区域延伸成弯曲的第二区域; 安装到支撑基板的第一区域的发光器件; 以及在所述第一区域和所述第二区域之间弯曲的弯曲部分，其中所述弯曲部分包括：穿过互连线的互连线布置部分; 以及布置在所述互连线的周边上的互连线路保护部分，其中所述互连线路保护部分比所述互连线路布置部分突出。
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Patent Agency Ranking
16.发明授权公开(公告)号：US09504146B2
公开(公告)日：2016-11-22
申请号：US14367779
申请日：2012-12-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Gyu Park , In Hee Cho , Seung Kwon Hong , Min Jae Kim , Hyuk Soo Lee
IPC: G02F1/1335 , H05K1/02 , F21V8/00 , H05K1/05 , H05K1/09 , H01L25/075 , H01L33/64
CPC classification number: H05K1/028 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F2001/133628 , H01L25/0753 , H01L33/641 , H01L33/642 , H01L2224/73204 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/056 , H05K1/09 , H05K2201/10106 , H05K2201/10136 , H05K2203/302 , H01L2924/00
Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.
Abstract translation: 本发明提供一种散热印刷电路板及其制造方法，其特征在于，包括：在第一区域形成绝缘层，电路图案和阻焊剂的电路层， 金属基板的一个表面; 并且在不形成绝缘层的第二区域中形成弯曲部分，通过弯曲金属基板，从而可以预先防止在绝缘层中产生裂纹，并且印制的热辐射的耐久性和可靠性 可以提高电路板和使用其的背光单元。
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公开(公告)号：US09482810B2
公开(公告)日：2016-11-01
申请号：US14314920
申请日：2014-06-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Man Hue Choi , Min Jae Kim , Bi Yi Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
IPC: F21V23/00 , F21V29/00 , F21V8/00 , H05K1/02 , G02F1/1335
CPC classification number: G02B6/0083 , G02B6/0068 , G02B6/0073 , G02B6/009 , G02F1/133615 , G02F2001/133612 , H05K1/0284 , H05K2201/09063 , H05K2201/0999 , H05K2201/10106 , H05K2201/10136 , H05K2201/10189
Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.
Abstract translation: 提供一种电路板，包括：支撑基板; 安装在支撑基板上的发光元件; 穿过所述支撑基板的通孔; 以及插入到通孔中并用于向发光元件供给电流的连接器。
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18.发明申请公开(公告)号：US20150289358A1
公开(公告)日：2015-10-08
申请号：US14367779
申请日：2012-12-17
Applicant: LG Innotek Co., Ltd.
Inventor： Hyun Gyu Park , In Hee Cho , Seung Kwon Hong , Min Jae Kim , Hyuk Soo Lee
CPC classification number: H05K1/028 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F2001/133628 , H01L25/0753 , H01L33/641 , H01L33/642 , H01L2224/73204 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/056 , H05K1/09 , H05K2201/10106 , H05K2201/10136 , H05K2203/302 , H01L2924/00
Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.
Abstract translation: 本发明提供一种散热印刷电路板及其制造方法，其特征在于，包括：在第一区域形成绝缘层，电路图案和阻焊剂的电路层， 金属基板的一个表面; 并且在不形成绝缘层的第二区域中形成弯曲部分，通过弯曲金属基板，从而可以预先防止在绝缘层中产生裂纹，并且印制的热辐射的耐久性和可靠性 可以提高电路板和使用其的背光单元。
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公开(公告)号：US11553753B2
公开(公告)日：2023-01-17
申请号：US15774523
申请日：2016-11-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Keun Cho , Bi Yi Kim , Jeong Han Kim , Yong Hwa Park , Hyun Gyu Park , Hyun Jin Jo , In Hee Cho
Abstract: A pressure sensing insole according to an embodiment of the present invention includes: a first electrode layer including a first conductive region; a first adhesive layer disposed on the first electrode layer and including an insulating region; an intermediate layer disposed on the first adhesive layer; a second adhesive layer disposed on the intermediate layer and including an insulating region; and a second electrode layer disposed on the second adhesive layer and including a second conductive region.
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公开(公告)号：US11029222B2
公开(公告)日：2021-06-08
申请号：US16313110
申请日：2016-07-11
Applicant: LG INNOTEK CO., LTD.
Inventor： Won Keun Cho , Eun Jin Kim , Soo Min Lee , Jina Lee , In Hee Cho , Hyun Jin Jo , Sanga Ju
Abstract: A pressure sensor comprises: a first electrode layer; a second electrode layer; and an intermediate layer disposed between the first electrode layer and the second electrode layer, wherein the intermediate layer changes in resistance, depending on a change in at least one of a thickness or a volume thereof. In addition, the intermediate layer comprises: a foam having porous regions dispersed in a non-porous region thereof; and a conductive material being dispersed in the foam and being more conductive than the foam.
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