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公开(公告)号：US09730319B2
公开(公告)日：2017-08-08
申请号：US14568544
申请日：2014-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Man Hue Choi , Min Jae Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
IPC: H05K1/02 , H05K1/18 , H05K3/28 , G02F1/1335
CPC classification number: H05K1/0281 , G02F1/133615 , G02F2001/133612 , H05K1/0278 , H05K1/181 , H05K1/189 , H05K3/28 , H05K2201/046 , H05K2201/10106
Abstract: Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.
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公开(公告)号：US09726811B2
公开(公告)日：2017-08-08
申请号：US14290519
申请日：2014-05-29
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woong Na , Min Jae Kim , Bi Yi Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: G02B6/0081 , F21V15/00 , G02B6/0091 , G02B6/0093
Abstract: Provided is a circuit board including: a support substrate; a plurality of light emitting devices mounted on the support substrate; and a device protection portion surrounding one of the light emitting devices, or three or more surfaces of the plurality of light emitting devices.
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公开(公告)号：US09506637B2
公开(公告)日：2016-11-29
申请号：US14472075
申请日：2014-08-28
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Gyu Park , Min Jae Kim , Se Woong Na , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: F21V21/14 , G02B6/0068 , G02B6/0091 , G02F1/133615 , H05K1/0278 , H05K1/028 , H05K1/056 , H05K3/0061 , H05K2201/0394 , H05K2201/09054 , H05K2201/09063 , H05K2201/10106 , H05K2203/0195 , H05K2203/302
Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.
Abstract translation: 提供一种电路板，包括：支撑基板，包括第一区域和从第一区域延伸成弯曲的第二区域; 安装到支撑基板的第一区域的发光器件; 以及在所述第一区域和所述第二区域之间弯曲的弯曲部分，其中所述弯曲部分包括：穿过互连线的互连线布置部分; 以及布置在所述互连线的周边上的互连线路保护部分，其中所述互连线路保护部分比所述互连线路布置部分突出。
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4.发明授权公开(公告)号：US09504146B2
公开(公告)日：2016-11-22
申请号：US14367779
申请日：2012-12-17
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Gyu Park , In Hee Cho , Seung Kwon Hong , Min Jae Kim , Hyuk Soo Lee
IPC: G02F1/1335 , H05K1/02 , F21V8/00 , H05K1/05 , H05K1/09 , H01L25/075 , H01L33/64
CPC classification number: H05K1/028 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F2001/133628 , H01L25/0753 , H01L33/641 , H01L33/642 , H01L2224/73204 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/056 , H05K1/09 , H05K2201/10106 , H05K2201/10136 , H05K2203/302 , H01L2924/00
Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.
Abstract translation: 本发明提供一种散热印刷电路板及其制造方法，其特征在于，包括：在第一区域形成绝缘层，电路图案和阻焊剂的电路层， 金属基板的一个表面; 并且在不形成绝缘层的第二区域中形成弯曲部分，通过弯曲金属基板，从而可以预先防止在绝缘层中产生裂纹，并且印制的热辐射的耐久性和可靠性 可以提高电路板和使用其的背光单元。
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公开(公告)号：US09482810B2
公开(公告)日：2016-11-01
申请号：US14314920
申请日：2014-06-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Man Hue Choi , Min Jae Kim , Bi Yi Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Seung Kwon Hong
IPC: F21V23/00 , F21V29/00 , F21V8/00 , H05K1/02 , G02F1/1335
CPC classification number: G02B6/0083 , G02B6/0068 , G02B6/0073 , G02B6/009 , G02F1/133615 , G02F2001/133612 , H05K1/0284 , H05K2201/09063 , H05K2201/0999 , H05K2201/10106 , H05K2201/10136 , H05K2201/10189
Abstract: Provided is a circuit board including: a supporting substrate; light emitting elements mounted to the supporting substrate; a through hole passing through the supporting substrate; and a connector inserted into the through hole and for supplying an electric current to the light emitting elements.
Abstract translation: 提供一种电路板，包括：支撑基板; 安装在支撑基板上的发光元件; 穿过所述支撑基板的通孔; 以及插入到通孔中并用于向发光元件供给电流的连接器。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150289358A1
公开(公告)日：2015-10-08
申请号：US14367779
申请日：2012-12-17
Applicant: LG Innotek Co., Ltd.
Inventor： Hyun Gyu Park , In Hee Cho , Seung Kwon Hong , Min Jae Kim , Hyuk Soo Lee
CPC classification number: H05K1/028 , G02B6/0073 , G02B6/0083 , G02B6/0085 , G02F2001/133628 , H01L25/0753 , H01L33/641 , H01L33/642 , H01L2224/73204 , H01L2924/0002 , H01L2933/0075 , H05K1/0203 , H05K1/056 , H05K1/09 , H05K2201/10106 , H05K2201/10136 , H05K2203/302 , H01L2924/00
Abstract: Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved.
Abstract translation: 本发明提供一种散热印刷电路板及其制造方法，其特征在于，包括：在第一区域形成绝缘层，电路图案和阻焊剂的电路层， 金属基板的一个表面; 并且在不形成绝缘层的第二区域中形成弯曲部分，通过弯曲金属基板，从而可以预先防止在绝缘层中产生裂纹，并且印制的热辐射的耐久性和可靠性 可以提高电路板和使用其的背光单元。
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公开(公告)号：US09726810B2
公开(公告)日：2017-08-08
申请号：US14291559
申请日：2014-05-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Min Jae Kim , Bi Yi Kim , Se Woong Na , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
IPC: F21V8/00
CPC classification number: G02B6/0073 , G02B6/0021 , G02B6/0068 , G02B6/0091
Abstract: Provided are a lighting device and a flat panel display having the lighting device, the lighting device, including: a support substrate; a circuit board on the support substrate; light emitting devices mounted on the circuit board; and a light guide plate having a protruding portion protruding to a remaining region except for a region in which the light emitting devices are disposed.
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公开(公告)号：US10018777B2
公开(公告)日：2018-07-10
申请号：US14894628
申请日：2014-05-08
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woong Na , Min Jae Kim , Bi Yi Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
IPC: F21V8/00 , G02F1/1335 , F21S4/28 , F21Y105/00 , F21Y103/10 , F21Y115/10
CPC classification number: G02B6/0091 , F21S4/28 , F21Y2103/10 , F21Y2105/00 , F21Y2115/10 , G02B6/0088 , G02B6/0093 , G02F1/133615
Abstract: A circuit board, and a lighting device and board housing module having the circuit board. The circuit board includes a support substrate having a first region and a second region bent from the first region, light emitting devices disposed on the first region, and a protective support portion protruding more than the light emitting devices from the support substrate of the first region.
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公开(公告)号：US09462686B2
公开(公告)日：2016-10-04
申请号：US14319648
申请日：2014-06-30
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woong Na , Min Jae Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: H05K1/028 , H05K3/0058 , H05K2201/056
Abstract: Provided is a printed circuit board, comprising: a supporting substrate including a first region and a second region extending to be bent from the first region; an insulating substrate above the supporting substrate; a bending portion bent between the first region and the second region; and an adhesive layer between the supporting substrate and the insulating substrate and except for the bending portion.
Abstract translation: 提供一种印刷电路板，包括：支撑基板，包括第一区域和第二区域，所述第二区域从第一区域延伸以被弯曲; 在支撑基板上方的绝缘基板; 在所述第一区域和所述第二区域之间弯曲的弯曲部分; 以及在支撑基板和绝缘基板之间的粘合层，除了弯曲部分之外。
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公开(公告)号：US09377573B2
公开(公告)日：2016-06-28
申请号：US14339171
申请日：2014-07-23
Applicant: LG INNOTEK CO., LTD.
Inventor： Se Woong Na , Min Jae Kim , Hyun Gyu Park , In Hee Cho , Man Hue Choi , Seung Kwon Hong
CPC classification number: G02B6/0011 , G02B6/009
Abstract: Provided is a lighting device, including: a circuit board in which light emitting elements are mounted to one surface of a supporting substrate; a substrate housing disposed to be spaced apart from another surface opposite to the one surface of the supporting substrate; and a distance regulating portion formed between the circuit board and the substrate housing to adjust a spaced distance between the circuit board and the substrate housing according to movement of the circuit board, wherein the distance regulating portion functions to fix the circuit board to the substrate housing via a fixing element formed in the circuit board and the substrate housing.
Abstract translation: 提供一种照明装置，包括：电路板，其中发光元件安装在支撑基板的一个表面上; 衬底壳体，其设置成与与所述支撑衬底的所述一个表面相对的另一表面间隔开; 以及距离限制部分，形成在所述电路板和所述基板壳体之间，以根据所述电路板的移动来调整所述电路板和所述基板壳体之间的间隔距离，其中所述距离限制部分用于将所述电路板固定到所述基板壳体 通过形成在电路板和基板壳体中的固定元件。
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