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公开(公告)号：US20240347486A1
公开(公告)日：2024-10-17
申请号：US18677837
申请日：2024-05-29
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , MIN-HSI CHEN , CHANG-HUNG HSIEH , SHAN-HUI CHEN , YU-HSUAN CHU
IPC: H01L23/00 , H01L23/31 , H01L23/538 , H01L25/16
CPC classification number: H01L24/04 , H01L23/5383 , H01L25/167 , H01L23/3107 , H01L24/32 , H01L2224/02375 , H01L2224/04026 , H01L2224/32225
Abstract: An integrated circuit (IC) flip-chip and a light-emitting device are provided. The IC flip-chip includes a chip body, a plurality of metal pads, and a plurality of flip-chip pads. The chip body has a surface. The metal pads are disposed on the surface of the chip body. The flip-chip pads are disposed on the metal pads, and the flip-chip pads are electrically coupled to the metal pads through a redistribution layer therebetween. A distribution of the flip-chip pads is more even than a distribution of the metal pads.
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公开(公告)号：US20210148558A1
公开(公告)日：2021-05-20
申请号：US17097158
申请日：2020-11-13
Inventor： CHEN-HSIU LIN , WEN-HSIANG LIN , YUNG-CHANG JEN , SHIH-CHUNG HUANG
Abstract: A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.
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公开(公告)号：US20160380171A1
公开(公告)日：2016-12-29
申请号：US14954364
申请日：2015-11-30
Inventor： CHEN-HSIU LIN , KUO-MING CHIU
CPC classification number: H01L33/60 , H01L33/486 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/48465 , H01L2924/00014 , H01L2924/00
Abstract: An LED package structure includes a chip carrier and an LED chip. The chip carrier includes a ceramic substrate, a circuit layer, a ceramic reflective plate disposed on the ceramic substrate, and a metal slug. The ceramic substrate has a first thru-hole. A main portion of the metal slug is embedded in the first thru-hole, and partially protrudes from the first thru-hole with a height of 10˜30 μm to define as a protrusion block. An extending portion of the metal slug is connected to the outer edge of protrusion block, and the top surfaces of extending portion and protrusion block are coplanar to define a mounting surface. The ceramic reflective plate has a second thru-hole, and the mounting surface is exposed from the ceramic reflective plate via the second thru-hole. The LED chip is fixed on the mounting surface and is electrically connected to the circuit layer.
Abstract translation: LED封装结构包括芯片载体和LED芯片。 芯片载体包括陶瓷基板，电路层，设置在陶瓷基板上的陶瓷反射板和金属块。 陶瓷基板具有第一通孔。 金属块的主要部分嵌入第一通孔中，并以10〜30微米的高度部分地从第一通孔突出，以形成突出块。 金属块的延伸部分连接到突出块的外边缘，并且延伸部分和突出块的顶表面共面以限定安装表面。 陶瓷反射板具有第二通孔，安装面通过第二通孔从陶瓷反射板露出。 LED芯片固定在安装表面上并电连接到电路层。
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14.发明申请公开(公告)号：US20150014722A1
公开(公告)日：2015-01-15
申请号：US14309989
申请日：2014-06-20
Inventor： CHEN-HSIU LIN
CPC classification number: H01L33/62 , F21V19/001 , H01L24/97 , H01L25/0753 , H01L33/483 , H01L33/486 , H01L33/60 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: A metallic frame of an LED structure includes two conductive frames spaced apart from each other with a gap and a plurality of extending arms respectively and integrally extended from the conductive frames. Each conductive frame includes a top surface, a bottom surface, and a lateral surface connecting the top and bottom surfaces. Each top surface comprises a sealed region and a mounting region surrounded by the sealed region, and the sealed and mounting regions of each conductive frame are defined by an insulating body. Each conductive frame has at least one slot concavely formed on the sealed region, and the lateral surface is formed with two openings and the slot is communicated with the two openings, such that the slot of each of the conductive frames is configured to separate at least one of the extending arms from the mounting region of the conductive frames.
Abstract translation: LED结构的金属框架包括彼此隔开间隔的两个导电框架和分别从导电框架整体延伸的多个延伸臂。 每个导电框架包括顶表面，底表面和连接顶表面和底表面的侧表面。 每个顶表面包括密封区域和由密封区域包围的安装区域，并且每个导电框架的密封和安装区域由绝缘体限定。 每个导电框架具有凹入地形成在密封区域上的至少一个狭槽，并且侧表面形成有两个开口，并且该狭槽与两个开口连通，使得每个导电框架的狭槽被配置为至少分开 从导电框架的安装区域的延伸臂中的一个。
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公开(公告)号：US20240377244A1
公开(公告)日：2024-11-14
申请号：US18617716
申请日：2024-03-27
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , Yu-Chou Lin
Abstract: An optical sensing module includes a substrate, an optical sensing device, and a plurality of solders. The substrate has an upper surface, and the upper surface has a plurality of first soldering pads. The optical sensing device is disposed upright on the substrate. The optical sensing device includes a transposition plate and an optical sensing package. The transposition plate includes a first surface, a second surface, and a third surface. The first surface has a plurality of second soldering pads, the second surface has a plurality of conductive through holes, and the third surface has a plurality of metal ribs. The conductive through holes are electrically connected to the second soldering pads and the metal ribs. The optical sensing package is disposed on the first surface and electrically connected to the second soldering pads. The plurality of solders climb onto the plurality of metal ribs, respectively.
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Patent Agency Ranking
公开(公告)号：US20240347666A1
公开(公告)日：2024-10-17
申请号：US18634247
申请日：2024-04-12
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： CHEN-HSIU LIN , Kai-Chieh Liang
IPC: H01L31/173 , H01L31/02 , H01L31/0203 , H01L31/0216
CPC classification number: H01L31/173 , H01L31/02005 , H01L31/0203 , H01L31/02164
Abstract: An optoelectronic device includes a substrate, a sensing element, a light emitting element, a first dam, and a second dam. The sensing element and the light emitting element are disposed on the substrate. The first dam is disposed on the substrate and covers a side of the sensing element. The second dam is disposed on the first dam. The first dam and the second dam are located between the sensing element and the light emitting element.
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公开(公告)号：US20240345284A1
公开(公告)日：2024-10-17
申请号：US18601969
申请日：2024-03-11
Applicant: LITE-ON TECHNOLOGY CORPORATION
Inventor： SHENG-YUN WANG , CHEN-HSIU LIN , BO-JHIH CHEN
IPC: G01V8/12
CPC classification number: G01V8/12
Abstract: The photoelectric sensor includes a housing, a light-emitting module, a light-receiving module, and two adhesive members. The housing includes a first upright portion, a second upright portion, and a base. The first upright portion and the second upright portion are connected to the base, the first upright portion has a first concave structure and a first opening, and the second upright portion has a second concave structure and a second opening. The light-emitting module includes a first circuit board and a light-emitting element and is embedded in the first concave structure. The light-emitting element corresponds to the first opening. The light-receiving module includes a second circuit board and a light-receiving element and is embedded in the second concave structure. The light-receiving element corresponds to the second opening. The two adhesive members are respectively provided on side walls of the first concave structure and the second concave structure.
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公开(公告)号：US20210226099A1
公开(公告)日：2021-07-22
申请号：US17146460
申请日：2021-01-11
Inventor： HAO-WEI HONG , CHEN-HSIU LIN , TSUNG-KANG YING
Abstract: A light emitting diode (LED) package structure including a first light emitting portion, a second light emitting portion, a partition, and a surrounding wall is provided. The first light emitting portion includes a first LED chip emitting a first initial light, and the first initial light passes through the first light emitting portion to form a first white light. The second light emitting portion includes a second LED chip, a third LED chip, and a fourth LED chip. The partition is disposed between the first light emitting portion and the second light emitting portion. The surrounding wall is disposed around the partition, the first light emitting portion, and the second light emitting portion. The first white light has a view angle offset less than 1 degree.
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公开(公告)号：US20210074896A1
公开(公告)日：2021-03-11
申请号：US17018727
申请日：2020-09-11
Inventor： CHEN-HSIU LIN , CHIH-YUAN CHEN
IPC: H01L33/62 , H01L33/48 , H01L25/075 , H01L23/00
Abstract: A light emitting package is provided, the light emitting package includes a carrier having a main part that has multiple chip bonding regions, and each the chip bonding regions has two neighboring conductive parts. An insulating part is disposed on the main part and portion of the two neighboring conductive parts, and multiple hollow-out structures are formed by the insulating part and corresponded in position to the chip bonding regions. Each of the hollow-out structures has a side wall that surrounds the chip bonding regions, and the portion of the tops of the two neighboring conductive parts are exposed from a bottom portion of the hollow-out structure, and multiple light emitting chips are disposed onto the chip bonding surfaces.
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公开(公告)号：US20200235255A1
公开(公告)日：2020-07-23
申请号：US16738796
申请日：2020-01-09
Inventor： CHEN-HSIU LIN , SHIH-CHUNG HUANG , BO-JHIH CHEN
IPC: H01L31/101 , H01L31/02
Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
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