MULTILAYER CAPACITOR
    11.
    发明申请
    MULTILAYER CAPACITOR 有权
    多层电容器

    公开(公告)号:US20120188681A1

    公开(公告)日:2012-07-26

    申请号:US13354745

    申请日:2012-01-20

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: A multilayer capacitor comprises a capacitor element body, a first terminal electrode connected to a first inner electrode, a second terminal electrode connected to a second inner electrode, a third terminal electrode connected to a third inner electrode, and a fourth terminal electrode connected to a fourth inner electrode. The capacitor element body includes therewithin a first capacitor unit having first and second inner electrodes stacked adjacent to each other through a dielectric layer and a second capacitor unit having third and fourth inner electrodes stacked adjacent to each other through a dielectric layer. The first and second terminal electrodes have high resistance layers exhibiting electrical resistances higher than those of the third and fourth terminal electrodes.

    Abstract translation: 多层电容器包括电容器元件本体,连接到第一内部电极的第一端子电极,连接到第二内部电极的第二端子电极,连接到第三内部电极的第三端子电极和与第三内部电极连接的第四端子电极 第四内电极。 所述电容器元件主体包括第一电容器单元,所述第一电容器单元具有通过电介质层彼此相邻堆叠的第一和第二内部电极,以及具有通过电介质层相互堆叠的第三和第四内部电极的第二电容器单元。 第一和第二端子电极具有高于第三和第四端子电极的电阻的高电阻层。

    MULTILAYER CAPACITOR
    12.
    发明申请
    MULTILAYER CAPACITOR 有权
    多层电容器

    公开(公告)号:US20100157506A1

    公开(公告)日:2010-06-24

    申请号:US12626108

    申请日:2009-11-25

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/012 H01G4/232 H01G4/30

    Abstract: Each of second terminal portions of a first terminal electrode has a wide part a width of which is larger than a first lead width of lead portions in each first internal electrode, and a narrow part a width of which decreases from the wide part toward the second terminal electrode and toward the first or second side face side. In a multilayer capacitor, the wide part causes an electric current to flow in the lead portions of the first internal electrodes in a direction opposite to that of an electric current flowing in the first terminal electrode, so as to cancel magnetic field thereof each other and thereby reduce ESL, and the narrow part prevents a solder bridge from occurring between the first terminal electrode and the second terminal electrode in a work of mounting the terminal electrodes of the multilayer capacitor on a circuit board or the like.

    Abstract translation: 第一端子电极的第二端子部分的宽度部分的宽度大于每个第一内部电极中的引线部分的第一引线宽度,并且宽度从宽部分朝向第二内部电极的宽度减小 并且朝向第一或第二侧面侧。 在多层电容器中,宽部分使得电流在与第一端子电极中流动的电流的方向相反的方向上在第一内部电极的引线部分中流动,以抵消彼此的磁场, 从而减小ESL,并且在将层叠电容器的端子电极安装在电路板等上的工作中,窄部分防止在第一端子电极和第二端子电极之间发生焊料桥。

    METHODS OF PRODUCING MULTILAYER CAPACITOR
    13.
    发明申请
    METHODS OF PRODUCING MULTILAYER CAPACITOR 失效
    生产多层电容器的方法

    公开(公告)号:US20100095498A1

    公开(公告)日:2010-04-22

    申请号:US12537834

    申请日:2009-08-07

    Abstract: A method of producing a multilayer capacitor has a step of preparing a plurality of first ceramic green sheets, a step of preparing a plurality of second ceramic green sheets, a step of laminating the plurality of first and second ceramic green sheets, and a step of cutting a ceramic green sheet laminate body along predetermined intended cutting lines to obtain laminate chips of individual multilayer capacitor units. In the step of preparing the first ceramic green sheets, first and second internal electrode patterns are formed so that the first and second internal electrode patterns are alternately arranged in a predetermined direction and in a direction perpendicular to the predetermined direction and so that portions corresponding to lead portions of first and second internal electrodes in the first and second internal electrode patterns are continuous across the predetermined intended cutting line. In the step of preparing the second ceramic green sheets, third and fourth internal electrode patterns are formed so that the third and fourth internal electrode patterns are alternately arranged in the predetermined direction and in the direction perpendicular to the predetermined direction and so that portions corresponding to lead portions of third and fourth internal electrodes in the third and fourth internal electrode patterns are continuous across the predetermined intended cutting lines.

    Abstract translation: 制备多层电容器的方法具有制备多个第一陶瓷生片的步骤,制备多个第二陶瓷生片的步骤,层叠多个第一和第二陶瓷生片的步骤,以及步骤 沿着预定的切割线切割陶瓷生片层压体,以获得各层叠电容器单元的层压片。 在制备第一陶瓷生片的步骤中,形成第一和第二内部电极图案,使得第一和第二内部电极图案沿预定方向和垂直于预定方向的方向交替布置,并且使得与 第一和第二内部电极图案中的第一和第二内部电极的引线部分跨越预定的预定切割线是连续的。 在制备第二陶瓷生片的步骤中,形成第三和第四内部电极图案,使得第三和第四内部电极图案沿预定方向和垂直于预定方向的方向交替布置,并且使得与 第三和第四内部电极图案中的第三和第四内部电极的引线部分跨越预定的预定切割线是连续的。

    MULTILAYER CAPACITOR HAVING HIGH ESR
    14.
    发明申请
    MULTILAYER CAPACITOR HAVING HIGH ESR 有权
    具有高ESR的多层电容器

    公开(公告)号:US20090168295A1

    公开(公告)日:2009-07-02

    申请号:US12275674

    申请日:2008-11-21

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/005 H01G4/228 H01G4/30

    Abstract: A first inner electrode has a first main electrode, a first lead conductor, a first coupling conductor, and a second lead conductor A second inner electrode has a second main electrode, a third lead conductor, and a second coupling conductor. A third inner electrode has a third main electrode, and a fourth lead conductor. The third inner electrode is connected to only a first connection conductor. In the extending direction of the first and third lead conductors, the first and second coupling conductors have a length shorter than the lengths of the first and third lead conductors and of the first and second main electrodes, respectively. The second inner electrode is adjacent to at least one of the first and third inner electrodes so as to sandwich the insulating layer

    Abstract translation: 第一内部电极具有第一主电极,第一引线导体,第一耦合导体和第二引线导体。第二内部电极具有第二主电极,第三引线导体和第二耦合导体。 第三内部电极具有第三主电极和第四引线导体。 第三内部电极仅连接到第一连接导体。 在第一和第三引线导体的延伸方向上,第一和第二耦合导体的长度分别比第一和第三引线导体以及第一和第二主电极的长度短。 第二内部电极与第一和第三内部电极中的至少一个相邻,以夹持绝缘层

    MULTILAYER CAPACITOR
    15.
    发明申请
    MULTILAYER CAPACITOR 有权
    多层电容器

    公开(公告)号:US20080310074A1

    公开(公告)日:2008-12-18

    申请号:US12017952

    申请日:2008-01-22

    CPC classification number: H01G4/30 H01G4/012 H01G4/232

    Abstract: A multilayer capacitor comprises a capacitor body, first and second inner electrodes, and first and second terminal electrodes. A first terminal electrode is arranged on a first surface of the capacitor body which is parallel to a first direction, and connected to the first inner electrode. A second terminal electrode is connected to the second inner electrode. The first inner electrode has a first main electrode portion including a first no-capacity generating region and a first capacity generating region, and a first lead electrode portion. In a second direction, the first terminal electrode is set smaller than the first surface, while the first lead electrode portion is set smaller than the first main electrode portion. The first no-capacity generating region and the first lead electrode portion overlap each other in the second direction when seen in the first direction.

    Abstract translation: 多层电容器包括电容器本体,第一和第二内部电极以及第一和第二端子电极。 第一端子电极布置在电容器主体的与第一方向平行的第一表面上,并连接到第一内部电极。 第二端子电极连接到第二内部电极。 第一内部电极具有包括第一无容量产生区域和第一电容产生区域的第一主电极部分和第一引线电极部分。 在第二方向上,第一端子电极被设定为小于第一表面,而第一引线电极部分被设定为小于第一主电极部分。 当从第一方向观察时,第一无容量产生区域和第一引线电极部分在第二方向上彼此重叠。

    LAMINATED CERAMIC CAPACITOR
    16.
    发明申请
    LAMINATED CERAMIC CAPACITOR 有权
    层压陶瓷电容器

    公开(公告)号:US20070211410A1

    公开(公告)日:2007-09-13

    申请号:US11670528

    申请日:2007-02-02

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/30 H01G4/232

    Abstract: A laminated ceramic capacitor includes a body having an inner layer portion and an outer layer portion and a plurality of terminal electrodes spaced apart from each other in a length direction of the body. The inner layer portion has a plurality of internal electrodes stacked in a height direction of the body. The internal electrodes have led-out portions led out to a side face of the body. The outer layer portion is disposed on one of opposite faces of the inner layer portion in the height direction. The terminal electrodes are each provided with a connecting portion and a spreading portion. The connecting portion extends along the height direction to cover corresponding one of the led-out portions. The spreading portion has a width gradually increasing from one of opposite ends of the connecting portion in the height direction toward an edge of the side face.

    Abstract translation: 层叠陶瓷电容器包括具有内层部分和外层部分的主体以及在主体的长度方向上彼此间隔开的多个端子电极。 内层部具有在主体的高度方向上堆叠的多个内部电极。 内部电极具有引出到主体的侧面的引出部分。 外层部分在高度方向上设置在内层部分的相对面之一上。 端子电极各自设置有连接部分和扩展部分。 连接部分沿着高度方向延伸以覆盖对应的一个引出部分。 扩展部分的宽度从连接部分的高度方向的相对端之一朝向侧面的边缘逐渐增加。

    MULTILAYER CAPACITOR
    17.
    发明申请
    MULTILAYER CAPACITOR 有权
    多层电容器

    公开(公告)号:US20130038979A1

    公开(公告)日:2013-02-14

    申请号:US13546729

    申请日:2012-07-11

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/30 H01G2/22 H01G2/24 H01G4/015

    Abstract: A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes.

    Abstract translation: 一种可以抑制电致振动而不受材料限制并适用于包括通用结构在内的各种结构的多层电容器。 多层电容器具有:由电介质陶瓷形成的元件体; 以及多个内部电极,其设置在所述元件主体内部,使得所述内部电极层叠有夹在其间的陶瓷层。 多层电容器设置有包括多个内部电极的电容器区域和用于减少由多个内部电极引起的电致伸缩以抑制噪声的第一抑制区域和第二抑制区域。 第一抑制区域与电容器区域相邻,并且第二抑制区域的厚度根据多个内部电极的布置来确定。

    MULTILAYER FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE OF MULTILAYER FEEDTHROUGH CAPACITOR
    18.
    发明申请
    MULTILAYER FEEDTHROUGH CAPACITOR AND MOUNTED STRUCTURE OF MULTILAYER FEEDTHROUGH CAPACITOR 有权
    多层馈电电容器的多层电容器和安装结构

    公开(公告)号:US20120039016A1

    公开(公告)日:2012-02-16

    申请号:US13178151

    申请日:2011-07-07

    Inventor: Masaaki TOGASHI

    CPC classification number: H01G4/35

    Abstract: A multilayer feedthrough capacitor has a capacitor element body of a substantially rectangular parallelepiped shape, a signal internal electrode, a ground internal electrode, first and second signal terminal electrodes, and a first ground terminal electrode. The capacitor element body includes first and second end faces opposed in a longitudinal direction thereof, and a mounting surface perpendicular to a direction in which a plurality of insulator layers are laminated. The first signal terminal electrode and the first ground terminal electrode are arranged in proximity to each other in a first region near the first end face in the mounting surface. The second signal terminal electrode is arranged in a second region near the second end face in the mounting surface. No conductor is arranged in a third region between the first region and the second region in the longitudinal direction of the capacitor element body, in the mounting surface.

    Abstract translation: 多层馈通电容器具有大致长方体形状的电容器元件主体,信号内部电极,接地内部电极,第一和第二信号端子电极以及第一接地端子电极。 电容器元件主体包括沿其纵向方向相对的第一和第二端面以及垂直于层叠多个绝缘体层的方向的安装面。 第一信号端子电极和第一接地端子电极在安装表面中靠近第一端面的第一区域彼此靠近地布置。 第二信号端子电极布置在安装表面中靠近第二端面的第二区域中。 在安装面上,在电容器元件主体的长度方向上的第一区域和第二区域之间的第三区域中不设置导体。

    ELECTRONIC COMPONENT MOUNTING STRUCTURE
    19.
    发明申请
    ELECTRONIC COMPONENT MOUNTING STRUCTURE 有权
    电子元件安装结构

    公开(公告)号:US20110110060A1

    公开(公告)日:2011-05-12

    申请号:US12941265

    申请日:2010-11-08

    Abstract: An electronic component mounting structure which can reduce the ESL while saving the space when mounting electronic components is provided. A first electronic component 7 is electrically connected to surface-mounted electrode parts 11A, 12A at metal terminals 26, 27 such that a first capacitor 24 having a greater capacitance and a mounting surface 4a of a multilayer substrate 4 are separated from each other. A second electronic component 8 is arranged between the first capacitor 24 and the mounting surface 4a and electrically connected to surface-mounted electrode parts 12B, 11B at second terminal electrodes 32, 33. The second electronic component 8 overlaps the first capacitor 24 when seen in the laminating direction. The first electronic component 7 is mounted to the multilayer substrate 4 such that first terminal electrodes 22, 23 oppose each other in a predetermined direction D1. The second electronic component 8 is mounted to the multilayer substrate 4 such that the second terminal electrodes 32, 33 oppose each other in the predetermined direction D1.

    Abstract translation: 提供一种电子部件安装结构,其能够在安装电子部件的同时节省空间的同时减小ESL。 第一电子部件7在金属端子26,27处电连接到表面安装电极部分11A,12A,使得具有较大电容的第一电容器24和多层基板4的安装表面4a彼此分离。 第二电子部件8布置在第一电容器24和安装表面4a之间,并且在第二端子电极32,33处与表面安装的电极部分12B,11B电连接。第二电子部件8与第一电容器24重叠, 层压方向。 第一电子部件7安装到多层基板4,使得第一端子电极22,23在预定方向D1上彼此相对。 第二电子部件8安装到多层基板4,使得第二端子电极32,33在预定方向D1上彼此相对。

    METHOD OF MOUNTING CAPACITOR ARRAY
    20.
    发明申请
    METHOD OF MOUNTING CAPACITOR ARRAY 有权
    电容阵列安装方法

    公开(公告)号:US20110047794A1

    公开(公告)日:2011-03-03

    申请号:US12826006

    申请日:2010-06-29

    Inventor: Masaaki TOGASHI

    Abstract: A capacitor array 1 is mounted onto a circuit board formed with first leads 42, 43 for connecting power lines 40, 41 to each other and a second lead 44 for grounding by using one of a first connection method of connecting such that first and second capacitor sections are parallel to each other, third and fourth capacitor sections are parallel to each other, and the third and fourth capacitor sections are in series with the parallel first and second capacitor sections; a second connection method of connecting such that the first to fourth capacitor sections are in series in sequence; and a third connection method of connecting such that the first and second capacitor sections are in series with each other without using the third and fourth capacitor sections.

    Abstract translation: 将电容器阵列1安装到形成有第一引线42,43的电路板上,用于通过使第一和第二电容器连接的第一连接方法之一将电源线40,41彼此连接和用于接地的第二引线44 部分彼此平行,第三和第四电容器部分彼此平行,并且第三和第四电容器部分与并联的第一和第二电容器部分串联; 连接的第二连接方法,使得第一至第四电容器部分依次串联; 以及连接的第三连接方法,使得第一和第二电容器部分彼此串联,而不使用第三和第四电容器部分。

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