公开(公告)号：US20040022043A1

公开(公告)日：2004-02-05

申请号：US10620096

申请日：2003-07-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Mitsuyoshi Nishide ,  Masaaki Mizushiro ,  Kenji Kubota ,  Nobuyuki Suzuki

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4007 ,  H05K3/4611 ,  H05K3/4629 ,  H01L2924/00

Abstract: A laminated ceramic electronic component includes an embedded portion formed in the periphery of an external terminal electrode so as to extend and be embedded in a component main member defined by ceramic layers, whereby affects of a small edge angle are eliminated.

Abstract translation: 层叠陶瓷电子部件包括形成在外部端子电极的周围的嵌入部分，以便延伸并嵌入由陶瓷层限定的部件主要部件中，从而消除了小的边缘角度的影响。

公开(公告)号：US20020166694A1

公开(公告)日：2002-11-14

申请号：US10116646

申请日：2002-04-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuyoshi Nishide ,  Ryoji Nakamura ,  Norio Sakai

IPC: B32B017/00 ,  B32B003/00

CPC classification number: B32B18/00 ,  B32B2307/202 ,  B32B2307/204 ,  B32B2307/206 ,  B32B2307/208 ,  B32B2307/538 ,  B32B2311/04 ,  B32B2311/08 ,  B32B2311/12 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/36 ,  C04B2235/658 ,  C04B2237/40 ,  C04B2237/407 ,  C04B2237/408 ,  C04B2237/56 ,  C04B2237/562 ,  C04B2237/565 ,  C04B2237/706 ,  H01L21/481 ,  H01L21/4857 ,  H05K1/09 ,  H05K1/092 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0317 ,  H05K2201/0352 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/24926

Abstract: A monolithic ceramic substrate includes a green laminate having a plurality of green functional ceramic layers including a functional ceramic material, green support layers including a ceramic material that does not sinter at a sintering temperature for the green functional ceramic material to prevent shrinkage of the functional ceramic layers, first conductor patterns including a thin-film conductor, and second conductor patterns including a thick-film conductor. The green laminate is fired at the sintering temperature for the green functional ceramic material.

Abstract translation: 单片陶瓷基板包括具有多个功能性陶瓷材料的绿色功能性陶瓷层的绿色层压体，包含陶瓷材料的绿色支撑层，该陶瓷材料在烧结温度下不会烧结用于绿色功能性陶瓷材料，以防止功能性陶瓷的收缩 层，包括薄膜导体的第一导体图案和包括厚膜导体的第二导体图案。 绿色层压体在烧结温度下对于绿色功能性陶瓷材料进行烧制。

公开(公告)号：US20020058131A1

公开(公告)日：2002-05-16

申请号：US09828080

申请日：2001-04-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuyoshi Nishide ,  Norio Sakai ,  Akira Baba

IPC: B32B003/00

CPC classification number: H05K3/4688 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/25 ,  H01L2924/00

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

公开(公告)号：US20010000986A1

公开(公告)日：2001-05-10

申请号：US09757959

申请日：2001-01-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai

IPC: H01G009/00

CPC classification number: H01G4/232 ,  H01F41/043 ,  H01G4/30 ,  H03H7/0115 ,  H03H2001/0085 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A chip capacitor includes a multilayer body composed of a plurality of stacked sheet layers made of ceramics; capacitor electrodes and via hole electrodes disposed inside the multilayer body; and outer electrodes formed on only main surfaces of the multilayer body such that they are electrically connected to the capacitor electrodes via the via hole electrodes. Some of the capacitor electrodes are electrically connected by the via hole electrodes, and the other capacitor electrodes are electrically connected by other via hole electrodes.

Abstract translation: 芯片电容器包括由陶瓷制成的多个堆叠的片层组成的多层体; 设置在多层体内的电容电极和通孔电极; 以及仅在多层体的主表面上形成的外部电极，使得它们经由通孔电极电连接到电容器电极。 一些电容器电极通过通孔电极电连接，另一个电容电极通过其它通孔电极电连接。

公开(公告)号：US20030167629A1

公开(公告)日：2003-09-11

申请号：US10348024

申请日：2003-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H05K001/03 ,  H05K003/36

CPC classification number: H01L23/585 ,  H01L21/481 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/4979 ,  H01L2924/00

Abstract: A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

公开(公告)号：US20030128526A1

公开(公告)日：2003-07-10

申请号：US10372616

申请日：2003-02-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Isao Kato

IPC: H05K001/14

CPC classification number: H05K3/3405 ,  H01L23/053 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/4061 ,  H05K3/4629 ,  H05K5/0091 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A multilayer ceramic electronic component includes a laminated ceramic body provided with terminal electrodes on side surfaces thereof and a cover for covering the laminated ceramic body. Ground terminal electrodes are provided in notches provided in opposed side surfaces opposing of the laminated ceramic body, a plurality of terminal electrodes is arranged in parallel in each of notches provided in the other side surfaces opposing each other. These terminal electrodes are formed by dividing terminal via hole conductors. The cover is disposed so as to cover elements mounted on the laminated ceramic body, and foot portions of the cover are disposed in the notches and are bonded to the ground terminal electrodes.

Abstract translation: 多层陶瓷电子部件包括在其侧表面上设置有端子电极的层叠陶瓷体和用于覆盖层叠陶瓷体的盖。 接地端子电极设置在与层叠陶瓷体相对的相对侧表面中的凹口中，多个端子电极平行设置在彼此相对的另一侧表面中的每个凹口中。 这些端子电极通过分割端子通孔导体而形成。 盖被设置成覆盖安装在层叠陶瓷体上的元件，并且盖的脚部设置在凹口中并且接合到接地端子电极。

公开(公告)号：US20030067068A1

公开(公告)日：2003-04-10

申请号：US10261452

申请日：2002-10-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Isao Kato ,  Mitsuyoshi Nishide

IPC: H01L023/053

CPC classification number: H05K3/403 ,  H01L23/10 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without decreasing an area for mounting a component to be mounted.

公开(公告)号：US20020157760A1

公开(公告)日：2002-10-31

申请号：US10123162

申请日：2002-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Harufumi Mandai ,  Norio Sakai ,  Isao Kato ,  Atsushi Kumano

IPC: C03B029/00

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  Y10T29/49163 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  H01L2224/0401

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

Abstract translation: 公开了通过层叠由含有有机粘合剂和增塑剂的玻璃陶瓷制成的多个玻璃陶瓷生片来形成层叠体来制造陶瓷多层基板的方法， 并烧制层压板; 进一步包括：施加到或覆盖在玻璃 - 陶瓷生片无机组合物的表面上，无机组合物的烧结温度高于玻璃 - 陶瓷生片的烧结温度; 将具有无机组合物的多个玻璃陶瓷生片分别涂覆在玻璃陶瓷生片的表面上或覆盖在玻璃陶瓷生片的表面上以形成层压体的一部分; 并且层叠多个玻璃陶瓷生片以形成层压体的另一部分。

公开(公告)号：US20010018983A1

公开(公告)日：2001-09-06

申请号：US09783922

申请日：2001-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H05K001/03

CPC classification number: H01L23/585 ,  H01L21/481 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09781 ,  H05K2203/302 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/4979 ,  H01L2924/00

Abstract: A multilayer integrated substrate includes breaking grooves arranged in a grid pattern so as to section the main surface of the substrate into a plurality of blocks, and also includes fracture-preventing conductor films arranged so as to cross the breaking grooves. The fracture-preventing conductor films contain a metal component that prevents undesirable fracturing of the multilayer integrated substrate along the breaking grooves.

Abstract translation: 多层集成基板包括以栅格图案布置的断开槽，以将基板的主表面分割成多个块，并且还包括布置成穿过断开槽的防裂导体膜。 防断裂导体膜含有防止多层一体化基板沿着断裂槽的不希望的断裂的金属成分。

公开(公告)号：US20010006756A1

公开(公告)日：2001-07-05

申请号：US09794700

申请日：2001-02-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiko Kamada ,  Isao Kato ,  Norio Sakai

IPC: G03G009/093 ,  G03G009/08

CPC classification number: H05K3/102 ,  Y10T428/24802 ,  Y10T428/24926

Abstract: A circuit-forming charging powder allowing circuit patterns to resist being peeled off a printing object when the powder is used for printing a circuit pattern by an electrophotographic method on the object, wherein the circuit-forming charging powder has a conductive metal powder, a charge control agent and an adhesion reinforcing agent combined with a heat-melt resin and a method for producing the circuit-forming charging powder, as well as printed objects and multilayer wiring boards are described.

Abstract translation: 一种电路形成充电粉末，其允许电路图案抵抗当通过电子照相方法在该物体上印刷电路图案时将印刷对象剥离，其中所述电路形成充电粉末具有导电金属粉末，电荷 描述了与热熔树脂组合的粘合增强剂和电路形成充电粉末的制造方法以及印刷对象和多层布线板。