公开(公告)号：US20030030985A1

公开(公告)日：2003-02-13

申请号：US09836081

申请日：2001-04-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai

IPC: H05K007/20

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01078 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/115 ,  H05K3/4053 ,  H05K3/4614 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0191 ,  H05K2201/0352

Abstract: In a laminated ceramic electronic component, the sectional size of via-hole conductors extending through thicker ceramic layers is larger than that of via-hole conductors extending through thinner ceramic layers. This makes it possible to facilitate filling of a conductive paste for the via-hole conductors having a larger height and to inhibit a conductive paste for the via-hole conductors having a smaller height from being lost after filling.

Abstract translation: 在层叠陶瓷电子部件中，延伸穿过较厚陶瓷层的通孔导体的截面尺寸大于延伸穿过较薄陶瓷层的通孔导体的截面尺寸。 这使得可以方便地填充用于具有较大高度的通孔导体的导电浆料，并且可以抑制填充后具有较小高度的通孔导体的导电糊料不会丢失。

公开(公告)号：US20010000987A1

公开(公告)日：2001-05-10

申请号：US09757964

申请日：2001-01-10

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai

IPC: H01G009/00

CPC classification number: H01G4/232 ,  H01F41/043 ,  H01G4/30 ,  H03H7/0115 ,  H03H2001/0085 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A chip capacitor includes a multilayer body composed of a plurality of stacked sheet layers made of ceramics; capacitor electrodes and via hole electrodes disposed inside the multilayer body; and outer electrodes formed on only main surfaces of the multilayer body such that they are electrically connected to the capacitor electrodes via the via hole electrodes. Some of the capacitor electrodes are electrically connected by the via hole electrodes, and the other capacitor electrodes are electrically connected by other via hole electrodes.

Abstract translation: 芯片电容器包括由陶瓷制成的多个堆叠的片层组成的多层体; 设置在多层体内的电容电极和通孔电极; 以及仅在多层体的主表面上形成的外部电极，使得它们经由通孔电极电连接到电容器电极。 一些电容器电极通过通孔电极电连接，另一个电容电极通过其它通孔电极电连接。

公开(公告)号：US20030157749A1

公开(公告)日：2003-08-21

申请号：US10400026

申请日：2003-03-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/142 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15313 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H01L2224/0401

Abstract: A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form individual electronic components. Through-holes are formed in a laminated body providing an aggregate electronic component wherein via-hole conductors are arranged so as not pass through the aggregate electronic component in a thickness direction thereof, the via-hole conductors are divided by the through-holes, and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines passing through the through-holes, a plurality of individual electronic components are produced.

公开(公告)号：US20020122301A1

公开(公告)日：2002-09-05

申请号：US10004229

申请日：2001-11-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H01G4/232 ,  H01F27/292 ,  H01L23/053 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/97 ,  H01L2924/01004 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/403 ,  H05K3/4061 ,  H05K2201/09145 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: An electronic component includes via holes having an elongated cross section, which are provided in a ceramic green molded product provided with a plurality of terminal conductors to define external terminal electrodes. Thereby, a portion of each terminal conductor is exposed on the inner wall of a piecing hole. The ceramic molded product is fired to obtain a ceramic sintered product. Then, the sintered product is split along cutting grooves passing through the via-holes, wherein ceramic electronic components are produced.

Abstract translation: 电子部件包括具有细长截面的通孔，其设置在设置有多个端子导体以限定外部端子电极的陶瓷绿色模制产品中。 因此，每个端子导体的一部分暴露在接头孔的内壁上。 对陶瓷成型体进行烧成，得到陶瓷烧结体。 然后，烧结产品沿着通过通孔的切割槽分裂，其中制造陶瓷电子部件。

公开(公告)号：US20020005567A1

公开(公告)日：2002-01-17

申请号：US09863130

申请日：2001-05-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Kazuhiro Iida

IPC: H01L029/06

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/142 ,  H01L2924/15159 ,  H01L2924/15162 ,  H01L2924/15313 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1632 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H01L2224/0401

Abstract: A method for manufacturing an electronic component includes forming an aggregate electronic component including a plurality of electronic components and dividing the aggregate electronic component to separate the plurality of electronic components to form individual electronic components. Through-holes are formed in a laminated body providing an aggregate electronic component wherein via-hole conductors are arranged so as not pass through the aggregate electronic component in a thickness direction thereof, the via-hole conductors are divided by the through-holes, and each divided portion provides an external terminal electrode. Then, by dividing the laminated body along the dividing lines passing through the through-holes, a plurality of individual electronic components are produced.

Abstract translation: 一种电子部件的制造方法，其特征在于，形成包含多个电子部件的集合电子部件，并分割所述集合电子部件，分离所述多个电子部件，形成各个电子部件。 通孔形成在提供聚集电子部件的层叠体中，其中通孔导体布置成不沿其厚度方向通过聚集电子部件，通孔导体被通孔分隔，并且 每个分割部分提供外部端子电极。 然后，通过沿着通过通孔的分割线分割层叠体，制造多个单独的电子部件。

公开(公告)号：US20030211302A1

公开(公告)日：2003-11-13

申请号：US10454481

申请日：2003-06-05

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Harufumi Mandai ,  Norio Sakai ,  Isao Kato ,  Atsushi Kumano

IPC: B32B009/00

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0195 ,  Y10T29/49163 ,  Y10T156/1056 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  H01L2224/0401

Abstract: There is disclosed a method of producing a ceramic multilayer substrate by laminating a plurality of glass-ceramic green sheets made of a glass-ceramic containing an organic binder and a plasticizer to form a laminate; and firing the laminate; further comprising: applying to or overlaying on the surfaces of the glass-ceramic green sheets inorganic compositions, the sintering temperature of the inorganic compositions being higher than that of the glass-ceramic green sheets; laminating a plurality of the glass-ceramic green sheets having the inorganic compositions applied to or overlaid on the surfaces of the glass-ceramic green sheets respectively, to form a part of the laminate; and laminating a plurality of the glass-ceramic green sheets to form the other part of the laminate.

公开(公告)号：US20030006065A1

公开(公告)日：2003-01-09

申请号：US10242424

申请日：2002-09-13

Applicant: Murata Manufacturing Co., Ltd

Inventor： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

IPC: H05K001/16

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00012

Abstract: A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

Abstract translation: 单片电子部件包括具有多个层叠陶瓷层的复合体。 陶瓷层包括设置在每个陶瓷层中的互连导体，包括第一端子，其布置在复合体的层叠方向上的第一端面上，用于限定与互连衬底的连接，以及布置在第二端上的第二端子 与复合材料的第一端面相对的表面，用于限定与安装部件的连接。 第一端子由设置在第一端面上的导体层限定，第二端子由从复合体的内部延伸到第二端面的端子通孔导体的暴露的端面限定。 端子通孔导体的露出端面是平坦的，并且与第二端面基本上在同一平面上。

公开(公告)号：US20020155264A1

公开(公告)日：2002-10-24

申请号：US10124409

申请日：2002-04-18

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuyoshi Nishide ,  Norio Sakai ,  Akira Baba

IPC: C03B029/00

CPC classification number: H05K3/4688 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/4629 ,  H05K2201/0191 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24959 ,  Y10T428/25 ,  H01L2924/00

Abstract: In a green laminate body including a plurality of base green layers and a plurality of constraining green layers for forming a monolithic ceramic substrate by using a non-shrinking process, when the thicknesses of the base green layers differ from each other, a thicker base green layer shrinks largely during sintering, and hence, the resulting monolithic ceramic substrate may warp in some cases. In order to solve this problem, the constraining green layers, which are in contact with the main surfaces of the individual base green layers, have different thicknesses so that a relatively thicker constraining green layer is in contact with a relatively thicker base green layer, and a relatively thinner constraining green layer is in contact with a relatively thinner base green.

Abstract translation: 在包括多个基底绿色层的绿色层压体和用于通过非收缩工艺形成单片陶瓷基板的多个约束生层时，当基底绿色层的厚度彼此不同时，较厚的基底绿色 在烧结期间，层的收缩很大，因此在一些情况下，所得到的整体式陶瓷基板可能会翘曲。 为了解决这个问题，与各个基层绿色层的主表面接触的约束绿色层具有不同的厚度，使得相对较厚的约束生层与相对较厚的基底层接触，并且 相对较薄的约束绿色层与相对较薄的基底绿色接触。

公开(公告)号：US20010033474A1

公开(公告)日：2001-10-25

申请号：US09784904

申请日：2001-02-16

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

IPC: H01G004/06

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00012

Abstract: A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

Abstract translation: 单片电子部件包括具有多个层叠陶瓷层的复合体。 陶瓷层包括设置在每个陶瓷层中的互连导体，包括第一端子，其布置在复合体的层叠方向上的第一端面上，用于限定与互连衬底的连接，以及布置在第二端上的第二端子 与复合材料的第一端面相对的表面，用于限定与安装部件的连接。 第一端子由设置在第一端面上的导体层限定，第二端子由从复合体的内部延伸到第二端面的端子通孔导体的暴露的端面限定。 端子通孔导体的露出端面是平坦的，并且与第二端面基本上在同一平面上。

公开(公告)号：US20040045655A1

公开(公告)日：2004-03-11

申请号：US10637632

申请日：2003-08-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Norio Sakai ,  Isao Kato ,  Mitsuyoshi Nishide

IPC: C03B029/00

CPC classification number: H05K3/403 ,  H01L23/10 ,  H01L23/49805 ,  H01L2924/0002 ,  H01L2924/15174 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3405 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/10371 ,  H01L2924/00

Abstract: A multilayer ceramic electronic component includes an electronic component body a notch formed in a side surface of the electronic component body, and a joining electrode formed by dividing a joining via hole conductor is formed at a portion of an inside surface defining the notch. A cover that is mounted to the electronic component body has a leg, with the leg of the cover being positioned inside the notch. By joining the leg to the joining electrode, the cover is secured to the electronic component body. The multilayer ceramic electronic component includes an LGA (land grid array) type external terminal electrode. The multilayer ceramic electronic component makes it possible to mount a cover for covering a mounted component without increasing the planar dimensions of the electronic component and without

Abstract translation: 多层陶瓷电子部件包括形成在电子部件主体的侧面的切口形成的电子部件体，在形成凹口的内侧面的部分形成有通过分割接合通孔导体而形成的接合电极。 安装到电子部件主体上的盖子具有一个腿，盖的腿位于凹口内。 通过将腿连接到接合电极，盖被固定到电子部件主体。 多层陶瓷电子部件包括LGA（焊盘格栅阵列）型外部端子电极。 多层陶瓷电子部件使得可以安装用于覆盖安装部件的盖而不增加电子部件的平面尺寸，并且不需要