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公开(公告)号：US09876949B2
公开(公告)日：2018-01-23
申请号：US15461413
申请日：2017-03-16
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N5/225 , H01L27/146
CPC classification number: H04N5/2257 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/1469 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H04N13/239 , H04N2213/001
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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12.发明申请公开(公告)号：US20180020138A1
公开(公告)日：2018-01-18
申请号：US15705232
申请日：2017-09-14
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu WANG , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
IPC: H04N5/225 , H01L21/56 , H01L25/065 , H01L27/146
CPC classification number: H04N5/2257 , B29C45/14639 , B29L2031/3481 , G02B3/0075 , G02B5/201 , G02B7/006 , G02B7/021 , G02B13/001 , G02B13/004 , H01L21/565 , H01L25/0655 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14634 , H01L27/14636 , H01L27/14685 , H01L27/14687 , H01L27/1469 , H04M1/0264 , H04N5/2252 , H04N5/2253 , H04N5/2254 , H04N5/2258 , H05K1/0203 , H05K1/0274 , H05K1/183 , H05K1/185 , H05K1/189 , H05K2201/0141 , H05K2201/0158 , H05K2201/0175 , H05K2201/09036 , H05K2201/10121
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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13.发明授权公开(公告)号：US12105350B2
公开(公告)日：2024-10-01
申请号：US17377343
申请日：2021-07-15
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Bojie Zhao , Heng Jiang , Liang Ding , Feifan Chen , Chunmei Liu , Nan Guo , Shoujie Wang
CPC classification number: G02B7/10 , G02B5/20 , G02B7/00 , G02B7/003 , G02B7/02 , G02B7/023 , G02B7/025 , H04N23/55 , G02B13/001
Abstract: An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.
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14.发明授权公开(公告)号：US11874584B2
公开(公告)日：2024-01-16
申请号：US16943603
申请日：2020-07-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Heng Jiang , Feifan Chen , Chunmei Liu , Nan Guo , Hong Li , Bojie Zhao , Liang Ding
Abstract: A split lens assembly module, comprising: a focusing mechanism; and a lens assembly, wherein the lens assembly comprises at least two optical lenses, at least one lens barrel member and a bearing structure, each of the at least one lens barrel member holds at least one optical lens to form at least one to-be-adjusted lens assembly, the bearing structure holds at least one optical lens to form a fixing lens assembly, the to-be-adjusted lens assembly is pre-assembled on the fixing lens assembly, the to-be-adjusted lens assembly is suitable for being adjusted relative to an assembly position of the fixing lens assembly, the fixing lens assembly is mounted inside the focusing mechanism through the bearing structure, and moves as the focusing mechanism is powered on, which is suitable for focusing.
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公开(公告)号：US11822099B2
公开(公告)日：2023-11-21
申请号：US17114466
申请日：2020-12-07
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Nan Guo , Zhenyu Chen , Heng Jiang , Zhongyu Luan , Fengsheng Xi , Feifan Chen , Liang Ding
CPC classification number: G02B3/0075 , G02B7/006 , H01L25/50 , H04N23/45 , H04N23/51 , H04N23/55 , H05K3/284
Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
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Patent Agency Ranking
公开(公告)号：US11706516B2
公开(公告)日：2023-07-18
申请号：US16919065
申请日：2020-07-01
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N23/57 , H01L27/146 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55
CPC classification number: H04N23/57 , H01L27/1469 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H04N13/239 , H04N23/45 , H04N23/51 , H04N23/54 , H04N23/55 , H01L2224/48091 , H04N2213/001 , H01L2224/48091 , H01L2924/00014
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US11652132B2
公开(公告)日：2023-05-16
申请号：US17345929
申请日：2021-06-11
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
CPC classification number: H01L27/14683 , H01L27/14618 , H04N23/55 , H05K1/0274 , H05K1/181 , H05K3/0052 , H05K3/284 , H04N23/57 , H05K2201/10121 , H05K2201/10151 , H05K2203/1316
Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US11303789B2
公开(公告)日：2022-04-12
申请号：US16908723
申请日：2020-06-22
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Qimin Mei , Liang Ding , Heng Jiang
IPC: H04N5/225 , H01L27/146 , H04N13/239
Abstract: A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module comprises two or more camera lenses and a circuit unit. The circuit unit comprises a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.
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公开(公告)号：US20210305308A1
公开(公告)日：2021-09-30
申请号：US17345929
申请日：2021-06-11
Applicant: Ningbo Sunny Opotech Co., Ltd.
Inventor： Mingzhu Wang , Nan Guo , Jingfei He , Zhenyu Chen , Bojie Zhao , Takehiko Tanaka , Feifan Chen , Ye Wu , Zhen Huang , Zhongyu Luan
Abstract: A method for manufacturing semiconductor modules for image-sensing devices is disclosed. The method may comprise applying a removable layer on a first surface of a printed circuit board (PCB) which comprises a plurality of PCB units; mounting a photosensitive member to a second surface of each of the PCB units; and encapsulating the photosensitive member with an encapsulation layer on each PCB unit. Each PCB unit may comprise at least a semiconductor component on a second surface of the PCB and one or more opening across the first surface and the second surface. The photosensitive member and the removable layer separate the one or more opening from outside, and the photosensitive member is positioned to receive light through the opening. At least one semiconductor component is also encapsulated by the encapsulation layer on each PCB unit.
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公开(公告)号：US11025805B2
公开(公告)日：2021-06-01
申请号：US16458164
申请日：2019-06-30
Applicant: NINGBO SUNNY OPOTECH CO., LTD.
Inventor： Mingzhu Wang , Bojie Zhao , Feifan Chen , Liang Ding , Nan Guo , Ye Wu , Heng Jiang
IPC: H04N5/225 , H01L27/146
Abstract: A camera module includes an optical lens, a photosensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
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