公开(公告)号：US07705453B2

公开(公告)日：2010-04-27

申请号：US11483698

申请日：2006-07-10

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A semiconductor device including: a semiconductor substrate including an electrode; a resin protrusion formed on the semiconductor substrate and including a plurality of first portions and a second portion disposed between two of the first portions adjacent to each other; and an interconnect electrically connected to the electrode and extending over one of the first portions of the resin protrusion. A lower portion of a side surface of the second portion includes a portion which extends in a direction intersecting a direction in which the resin protrusion extends.

Abstract translation: 一种半导体器件，包括：包括电极的半导体衬底; 树脂突起，其形成在所述半导体基板上并且包括多个第一部分和设置在彼此相邻的所述第一部分中的两个之间的第二部分; 以及电连接到电极并且在树脂突起的一个第一部分上延伸的互连。 第二部分的侧表面的下部包括沿与树脂突起延伸的方向相交的方向延伸的部分。

公开(公告)号：US07598459B2

公开(公告)日：2009-10-06

申请号：US11439417

申请日：2006-05-23

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H05K1/16

CPC classification number: H01L23/525 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/5223 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05548 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An electronic board includes: a substrate on which is formed an electronic circuit having a connection terminal; a stress-relaxation layer formed on the substrate; rearrangement wiring for the connection terminal disposed at a top side of the stress-relaxation layer; and a capacitor that has a first electrode that is disposed between the substrate and the stress-relaxation layer, a second electrode that is disposed at the top side of the stress-relaxation layer, and a dielectric material that is disposed between the first electrode and the second electrode.

Abstract translation: 电子板包括：基板，其上形成有具有连接端子的电子电路; 形成在所述基板上的应力松弛层; 用于设置在应力松弛层顶侧的连接端子的重排布线; 以及电容器，其具有设置在所述基板和所述应力松弛层之间的第一电极，设置在所述应力松弛层的上侧的第二电极和设置在所述第一电极与所述应力松弛层之间的电介质材料， 第二电极。

公开(公告)号：US07521796B2

公开(公告)日：2009-04-21

申请号：US11480846

申请日：2006-07-06

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/48

CPC classification number: H01L24/11 ,  H01L21/768 ,  H01L23/3114 ,  H01L23/3171 ,  H01L23/36 ,  H01L23/525 ,  H01L23/5329 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/02351 ,  H01L2224/0236 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05647 ,  H01L2224/13022 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2924/0001 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor device with a package size close to its chip size is, apart from a stress absorbing layer, such as to effectively absorb thermal stresses. A semiconductor device (150) has a semiconductor chip provided with electrodes (158), a resin layer (152) forming a stress relieving layer provided on the semiconductor chip, wiring (154) formed from the electrodes (158) to over the resin layer (152), and solder balls (157) formed on the wiring (154) over the resin layer (152); the resin layer (152) is formed so as to have a depression (152a) in the surface, and the wiring (154) is formed so as to pass over the depression (152a).

Abstract translation: 具有接近其芯片尺寸的封装尺寸的半导体器件除了应力吸收层之外还有效地吸收热应力。 半导体器件（150）具有设置有电极（158）的半导体芯片，形成在半导体芯片上的应力消除层的树脂层（152），由电极（158）形成在树脂层上方的布线（154） （152）和形成在所述布线（154）上的所述树脂层（152）上的焊球（157）; 树脂层（152）形成为在表面上具有凹部（152a），并且布线（154）形成为越过凹部（152a）。

公开(公告)号：US07514350B2

公开(公告)日：2009-04-07

申请号：US10788492

申请日：2004-03-01

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L29/04

CPC classification number: H01L24/25 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L29/0657 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/16225 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/25175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82001 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/10157 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05155

Abstract: An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which a pad is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate; a metal layer formed on the pad, the metal layer being less oxidizable than the pad; an insulating section formed of resin adjacent to the chip component; and an interconnect which is formed to extend from above the metal layer, over the insulating section and to above the interconnect pattern.

Abstract translation: 电子设备包括：其上形成有互连图案的基板; 芯片部件，其具有形成有焊盘的第一表面和与所述第一表面相对的第二表面，所述芯片部件以使得所述第二表面面向所述基板的方式安装; 形成在所述垫上的金属层，所述金属层比所述焊盘更不可氧化; 由与所述芯片部件相邻的树脂形成的绝缘部; 以及互连，其形成为从金属层的上方延伸超过绝缘部分并且在互连图案之上。

公开(公告)号：US07432585B2

公开(公告)日：2008-10-07

申请号：US11500264

申请日：2006-08-07

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/02 ,  H01L21/44

CPC classification number: H01L23/3114 ,  H01L23/525 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/85 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013 ,  H01L2924/01074

Abstract: A semiconductor device includes: a semiconductor substrate having an active face; a first electrode provided on or above the active face; an external connection terminal provided on or above the active face and electrically connected to the first electrode; and a connection terminal provided on or above the active face of the semiconductor substrate.

Abstract translation: 半导体器件包括：具有有源面的半导体衬底; 设置在所述主动面上或上方的第一电极; 外部连接端子，设置在所述有源面上或上方，并电连接到所述第一电极; 以及设置在半导体基板的有源面上或之上的连接端子。

公开(公告)号：US20080128918A1

公开(公告)日：2008-06-05

申请号：US12011584

申请日：2008-01-28

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/02

CPC classification number: H03H3/10 ,  B81B7/0048 ,  B81C2203/0109 ,  H01L21/563 ,  H01L2224/73204 ,  H03H9/0552 ,  H03H9/1071

Abstract: A manufacturing method for electronic device, includes: preparing a first substrate having a plurality of first regions; preparing a second substrate having a plurality of second regions; facing the first region and the second region each other, and connecting the first substrate and the second substrate while disposing at least a part of a functional element within a space between the first region and the second region; obtaining a plurality of first divisional substrates by cutting the first substrate at each of the first regions, after the connecting of the first substrate and the second substrate; forming a sealing film covering the plurality of the first divisional substrates on the second substrate, after cutting the first substrate; obtaining a plurality of second divisional substrates by cutting the second substrate at each of the second regions, after forming the sealing film; and obtaining a plurality of individual electronic devices.

公开(公告)号：US20080057146A1

公开(公告)日：2008-03-06

申请号：US11892801

申请日：2007-08-27

Applicant: Koichi Nishimura ,  Nobuaki Hashimoto

Inventor： Koichi Nishimura ,  Nobuaki Hashimoto

IPC: B29C45/80

CPC classification number: B29C45/84 ,  B29C45/661 ,  B29C45/768 ,  B29C45/80 ,  B29C2945/76083 ,  B29C2945/76093 ,  B29C2945/7623 ,  B29C2945/76923

Abstract: In a toggle-type clamping device that drives by belt driving by a motor, to detect securely a break in a belt using a simple and inexpensive construction. A dog is mounted on a crosshead of a toggle mechanism, a proximity switch is mounted on a rear platen, and arrival of the crosshead at a predetermined position is detected. A position detector is mounted on a motor that drives the toggle mechanism via a belt and a ball screw. When arrival of the crosshead at the predetermined position (a mold touch position or a position at which the mold is open a predetermined distance from the mold touch position) is detected by the position detector, if the dog is not detected by the proximity switch, the clamping device outputs an alarm as an indication that an abnormality such as a break in the belt has occurred. Simply by adding to a conventional toggle-type clamping device a simple and inexpensive detection unit such as the proximity switch, the dog, and the like, abnormalities such as belt breakage and the like can be securely detected.

Abstract translation: 在通过电动机的带驱动驱动的肘节式夹紧装置中，通过简单且廉价的结构可靠地检测带中的断裂。 狗安装在肘节机构的十字头上，接近开关安装在后压板上，并且检测到十字头到达预定位置。 位置检测器安装在通过皮带和滚珠丝杠驱动肘节机构的马达上。 当位置检测器检测到十字头到达预定位置（模具接触位置或模具打开距离模具接触位置预定距离的位置）时，如果接近开关没有检测到狗， 夹紧装置输出警报作为发生诸如皮带断裂等异常的指示。 简而言之，通过向传统的肘式夹紧装置添加诸如接近开关，狗等的简单且廉价的检测单元，可以可靠地检测诸如皮带断裂等异常。

公开(公告)号：US07332371B2

公开(公告)日：2008-02-19

申请号：US11391559

申请日：2006-03-29

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/00

CPC classification number: H01L24/29 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/4985 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75252 ,  H01L2224/83095 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83859 ,  H01L2224/83862 ,  H01L2224/83874 ,  H01L2224/90 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/112 ,  H05K1/189 ,  H05K3/28 ,  H05K3/284 ,  H05K3/323 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/10674 ,  H05K2203/0278 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2224/05644

Abstract: A method of manufacturing a semiconductor device comprises: a first step of interposing a thermosetting anisotropic conductive material 16 between a substrate 12 and a semiconductor chip 20; a second step in which pressure and heat are applied between the semiconductor chip 20 and the substrate 12, an interconnect pattern 10 and electrodes 22 are electrically connected, and the anisotropic conductive material 16 is spreading out beyond the semiconductor chip 20 and is cured in the region of contact with the semiconductor chip 20; and a third step in which the region of the anisotropic conductive material 16 other than the region of contact with the semiconductor chip 20 is heated.

Abstract translation: 一种制造半导体器件的方法包括：在基板12和半导体芯片20之间插入热固性各向异性导电材料16的第一步骤; 在半导体芯片20和基板12之间施加压力和热量的第二步骤，布线图案10和电极22电连接，并且各向异性导电材料16扩散到半导体芯片20之外并在 与半导体芯片20的接触区域; 以及第三步骤，其中除了与半导体芯片20的接触区域之外的各向异性导电材料16的区域被加热。

公开(公告)号：US20070296088A1

公开(公告)日：2007-12-27

申请号：US11889467

申请日：2007-08-14

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L23/485

CPC classification number: H01L23/3107 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/02125 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01021 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/013

Abstract: A semiconductor device comprising: a semiconductor element having a plurality of electrodes; a passivation film formed on the semiconductor element in a region avoiding at least a part of each of the electrodes; a conductive foil provided at a given spacing from the surface on which the passivation film is formed; an external electrodes formed on the conductive foil; intermediate layer formed between the passivation film and the conductive foil to support the conductive foil; and wires electrically connecting the electrodes to the conductive foil; wherein a depression tapered in a direction from the conductive foil to the passivation film if formed under a part of the conductive foil that includes the connection with the external electrodes.

公开(公告)号：US20070155050A1

公开(公告)日：2007-07-05

申请号：US11716568

申请日：2007-03-12

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H01L21/00

CPC classification number: H01L24/25 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/24 ,  H01L24/29 ,  H01L24/82 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/24011 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/25175 ,  H01L2224/2518 ,  H01L2224/29 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82007 ,  H01L2224/82102 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/01083 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An electronic device includes: a substrate on which an interconnect pattern is formed; a chip component having a first surface on which an electrode is formed and a second surface opposite to the first surface, the chip component being mounted in such a manner that the second surface faces the substrate; an insulating section formed of a resin and provided adjacent to the chip component; and an interconnect which is formed to extend from above the electrode, over the insulating section and to above the interconnect pattern.