公开(公告)号：US20200093001A1

公开(公告)日：2020-03-19

申请号：US16689262

申请日：2019-11-20

Applicant: Orbotech Ltd.

Inventor： Zvi Kotler ,  Michael Zenou

IPC: H05K3/02 ,  H05K1/09 ,  H05K3/26 ,  H05K3/22 ,  H05K3/12

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

公开(公告)号：US10537027B2

公开(公告)日：2020-01-14

申请号：US13958043

申请日：2013-08-02

Applicant: Orbotech Ltd.

Inventor： Zvi Kotler ,  Michael Zenou

IPC: H05K3/02

Abstract: A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

公开(公告)号：US09925797B2

公开(公告)日：2018-03-27

申请号：US15326498

申请日：2015-08-02

Applicant: ORBOTECH LTD.

Inventor： Zvi Kotler ,  Michael Zenou ,  Itay Peled

IPC: B41J2/455

CPC classification number: B41J2/455 ,  B23K26/0676 ,  C23C14/04 ,  C23C14/28 ,  G03F7/2014

Abstract: Printing apparatus (20) includes a donor supply assembly (30), which provides a transparent donor substrate (26) having opposing first and second surfaces and a donor film formed on the second surface so as to position the donor film in proximity to a target area (28) on an acceptor substrate (22). An optical assembly (24) directs multiple output beams of laser radiation simultaneously in a predefined spatial pattern to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate according, thereby writing the predefined pattern onto the target area of the acceptor substrate.

公开(公告)号：US20170189995A1

公开(公告)日：2017-07-06

申请号：US15313569

申请日：2015-05-20

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: B23K26/34 ,  H01C17/06 ,  H05K3/18 ,  H05K1/16 ,  B23K26/00 ,  C23C26/02

CPC classification number: B23K26/34 ,  B23K26/57 ,  B23K2103/10 ,  B23K2103/14 ,  C23C14/048 ,  C23C14/08 ,  C23C26/02 ,  H01C17/06 ,  H05K1/167 ,  H05K3/101 ,  H05K3/18 ,  H05K2203/0315 ,  H05K2203/087 ,  H05K2203/107 ,  H05K2203/128

Abstract: A method for material deposition includes providing a transparent donor substrate (34) having opposing first and second surfaces and a donor film (36) including a metal formed over the second surface. The donor substrate is positioned in proximity to an acceptor substrate (22), with the second surface facing toward the acceptor substrate, in an atmosphere containing oxygen. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film of droplets (44) of molten material onto the acceptor substrate, forming on the acceptor substrate particles (46) of the metal with an outer layer (54) comprising an oxide of the metal.

公开(公告)号：US20170178946A1

公开(公告)日：2017-06-22

申请号：US15124036

申请日：2015-04-05

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Zvi Kotler ,  Jonathan Ankri ,  Abraham Rotnemer ,  Oleg Ermak

IPC: H01L21/70 ,  H05K3/12

CPC classification number: H01L21/705 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/097 ,  H05K3/02 ,  H05K3/105 ,  H05K2203/107 ,  H05K2203/1492

Abstract: A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

公开(公告)号：US20210028141A1

公开(公告)日：2021-01-28

申请号：US16495112

申请日：2018-04-26

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Zvi Kotler ,  Ofer Fogel

IPC: H01L23/00 ,  H01L21/48

Abstract: A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

公开(公告)号：US10688692B2

公开(公告)日：2020-06-23

申请号：US15763451

申请日：2016-11-01

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: B29C41/08 ,  B22C9/00 ,  B44C1/22 ,  B29C33/38 ,  G03F7/00 ,  B22D23/00 ,  B22D29/00 ,  B29C37/00 ,  B29C41/42 ,  B29C41/46

Abstract: A method for fabrication includes providing a substrate having an upper surface with pattern of one or more recesses formed therein. A laser beam is directed to impinge on a donor film so as to eject droplets of a fluid from the donor film by laser-induced forward transfer (LIFT) into the one or more recesses. The fluid hardens within the one or more recesses to form a solid piece having a shape defined by the one or more recesses. The substrate is removed from the solid piece. In some embodiments, the recesses are coated with a thin-film layer before ejecting the droplets into the recesses, such that the thin-film layer remains as an outer surface of the solid piece after removing the substrate.

公开(公告)号：US20190088804A1

公开(公告)日：2019-03-21

申请号：US16194407

申请日：2018-11-19

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: H01L31/0224 ,  C23C14/28 ,  C23C14/04 ,  B23K26/00 ,  H01L21/48 ,  H05K3/14 ,  H01L21/285 ,  H01L31/05

Abstract: A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.

公开(公告)号：US20180193948A1

公开(公告)日：2018-07-12

申请号：US15738134

申请日：2016-06-07

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: B23K26/064 ,  B23K26/067 ,  B23K26/57 ,  B23K26/06 ,  B23K26/342

Abstract: An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, and a donor film on the second surface. The apparatus additionally includes an optical assembly, which is configured to direct a beam of radiation to pass through the first surface of the donor substrate and impinge on the donor film at a location on the second surface so as to induce ejection of droplets of molten material from the donor film at an angle that is not normal to the second surface at the location onto the acceptor surface.

公开(公告)号：US20170250294A1

公开(公告)日：2017-08-31

申请号：US15509491

申请日：2015-10-19

Applicant: Orbotech Ltd.

Inventor： Michael Zenou ,  Zvi Kotler

IPC: H01L31/0224

CPC classification number: H01L31/022425 ,  B23K26/00 ,  B23K26/0006 ,  B23K26/0624 ,  B23K26/0861 ,  B23K26/1224 ,  B23K26/123 ,  B23K26/34 ,  B23K2101/40 ,  B23K2103/56 ,  C23C14/048 ,  C23C14/28 ,  H01L21/2855 ,  H01L21/4846 ,  H01L31/05 ,  H05K3/14 ,  H05K2203/0528 ,  H05K2203/107 ,  H05K2203/128 ,  Y02E10/50

Abstract: A method for metallization includes providing a transparent donor substrate (34) having deposited thereon a donor film (36) including a metal with a thickness less than 2 μm. The donor substrate is positioned in proximity to an acceptor substrate (22) including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets (44) of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace (25) in ohmic contact with the semiconductor material.