公开(公告)号：US20250137938A1

公开(公告)日：2025-05-01

申请号：US19000945

申请日：2024-12-24

Applicant: Orbotech Ltd.

Inventor： Vered Gatt ,  Itzhak Saki Hakim ,  Chay Goldenberg ,  Mordehay Amirim

IPC: G01N21/956

Abstract: A method for inspection of multiple features of patterned objects in the manufacture of electrical circuits, the method including performing defect detection on the patterned object, employing an optical defect detection machine (ODDM) and employing the ODDM to measure at least one of spatial coordinates and physical attributes of at least some of the multiple features.

公开(公告)号：US20240375222A1

公开(公告)日：2024-11-14

申请号：US18315998

申请日：2023-05-11

Applicant: Orbotech Ltd.

Inventor： Roman Vander ,  Boris Kling ,  Alexey Shkolnik ,  Idan Amsalem

IPC: B23K26/382 ,  B23K26/073 ,  G02B27/09 ,  G02F1/11

Abstract: A micromachining system includes a laser generator, an acousto-optical deflector (AOD), and at least one signal generator. The laser generator is configured to generate a laser beam, and the at least one AOD is positioned in a path of the laser beam. The at least one acoustic signal generator is configured to generate at least two acoustic signals, including a first acoustic signal having a periodic waveform and a second acoustic signal having a freeform waveform. The at least one acoustic signal generator is further configured to apply the first acoustic signal to the AOD to output a deflected laser beam having a Gaussian profile, and apply the second acoustic signal to the AOD to adjust the Gaussian profile of the deflected laser beam to a modified profile.

公开(公告)号：US12055810B2

公开(公告)日：2024-08-06

申请号：US18238183

申请日：2023-08-25

Applicant: Orbotech Ltd.

Inventor： Karla G. Gutierrez Cuevas ,  Jason Reid ,  Nungavaram Viswanathan

IPC: G02F1/1334 ,  C09B47/04 ,  C09B67/20 ,  C09K19/02 ,  C09K19/54 ,  C09K19/60 ,  G02F1/1333 ,  G02F1/137

CPC classification number: G02F1/1334 ,  C09B47/04 ,  C09B67/0069 ,  C09K19/0225 ,  C09K19/0275 ,  C09K19/542 ,  C09K19/60 ,  G02F1/133302 ,  G02F1/137 ,  C09K2019/546 ,  G02F2202/04

Abstract: A modulator material layer includes a polymer matrix formed of a plurality of cross-linked polymer molecules and a plurality of droplets of liquid crystals within the polymer matrix. A planar macrocycle dye is dispersed within the plurality of droplets of liquid crystals. The planar macrocycle dye can include one or more of a phthalocanine, a porphyrin, a naphthalocyanine, a metallophthalocyanine, a metalloporphyrin, or a metallonaphthalocyanine.

公开(公告)号：US12042984B2

公开(公告)日：2024-07-23

申请号：US16338498

申请日：2017-10-31

Applicant: ORBOTECH LTD.

Inventor： Zvi Kotler ,  Gil Bernstein Toker ,  Marc Altman

IPC: B29C64/00 ,  B29C64/10 ,  B29C64/147 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/218 ,  B29C64/223 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/268 ,  B29C64/295 ,  B29C64/30 ,  B29C64/307 ,  B29C64/40 ,  B29C67/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  B22F10/22 ,  B22F12/63 ,  B33Y10/00 ,  B33Y30/00

CPC classification number: B29C64/147 ,  B29C64/00 ,  B29C64/10 ,  B29C64/176 ,  B29C64/182 ,  B29C64/20 ,  B29C64/205 ,  B29C64/218 ,  B29C64/223 ,  B29C64/227 ,  B29C64/245 ,  B29C64/25 ,  B29C64/255 ,  B29C64/268 ,  B29C64/295 ,  B29C64/30 ,  B29C64/307 ,  B29C64/40 ,  B29C67/00 ,  B33Y40/00 ,  B33Y40/10 ,  B33Y40/20 ,  B33Y50/00 ,  B33Y70/00 ,  B33Y80/00 ,  B33Y99/00 ,  B22F10/22 ,  B22F12/63 ,  B22F2999/00 ,  B33Y10/00 ,  B33Y30/00 ,  Y02P10/25 ,  B22F2999/00 ,  B22F10/20 ,  B22F3/115

Abstract: A method for manufacturing includes applying patterned electromagnetic energy to each of a sequence of layers of a dry film comprising a photosensitive material so as to create in the photosensitive material in each of the layers a respective two-dimensional (2D) pattern corresponding to a slice of a predefined three-dimensional (3D) structure. The layers in the sequence in which the respective 2D pattern has been created are laminated together to produce a multi-layer stack. The multi-layer stack is developed so as to remove the photosensitive material in which the 2D pattern has not been created, thereby forming the 3D structure.

公开(公告)号：US20240222302A1

公开(公告)日：2024-07-04

申请号：US18552746

申请日：2021-07-19

Applicant: ORBOTECH LTD.

Inventor： Zvi KOTLER ,  Ofer FOGEL ,  Sharona COHEN ,  Gil BERNSTEIN TOKER ,  Niv GORODESKY

IPC: H01L23/00 ,  B23K1/00 ,  B23K1/005 ,  B23K3/047 ,  B23K3/06 ,  B23K3/08 ,  B23K101/40 ,  H01L21/66

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K1/0056 ,  B23K3/047 ,  B23K3/0638 ,  B23K3/08 ,  H01L22/20 ,  H01L24/742 ,  B23K2101/40 ,  H01L2224/11318 ,  H01L2224/1183 ,  H01L2224/11849 ,  H01L2224/11901 ,  H01L2224/742

Abstract: A method for circuit fabrication includes inspecting an array of solder bumps on a circuit substrate so as to identify a solder bump having a height above the substrate that is greater than a predefined maximum. A first laser beam is directed toward the identified solder bump so as to ablate a selected amount of a solder material from the identified solder bump. Alternatively or additionally, a further solder bump having a height above the substrate that is less than a predefined minimum is identified, and one or more molten droplets of the solder material are deposited on the further solder bump. After ablating or depositing the solder material, a second laser beam is directed toward the identified solder bump with sufficient energy to cause the solder material in the identified solder bump to melt and reflow.

公开(公告)号：US11977211B2

公开(公告)日：2024-05-07

申请号：US17441279

申请日：2020-07-09

Applicant: Orbotech Ltd.

Inventor： David Fisch ,  Avraham Adler ,  Ilia Lutsker ,  Yigal Katzir ,  Avinoam Rosenberg

IPC: G02B19/00 ,  G02B3/08 ,  G02B21/36 ,  G02B26/08 ,  G02F1/29

CPC classification number: G02B19/0066 ,  G02B3/08 ,  G02B21/361 ,  G02B26/0833 ,  G02F1/29

Abstract: Provided is an optical apparatus that includes an illumination assembly which include an extended radiation source emitting radiation with a controllable spatial distribution and telecentric condensing optics, configured to receive and project the emitted radiation with a numerical aperture exceeding 0.3 along a first optical axis onto a field and an imaging assembly that includes a sensor and objective optics configured to image the field along a second optical axis onto the sensor and also a prism combiner positioned between the field and the condensing and objective optics which is configured to combine the first and second optical axes, while reflecting at least one of the optical axes multiple times within the prism combiner.

公开(公告)号：US20240112325A1

公开(公告)日：2024-04-04

申请号：US18273269

申请日：2022-02-21

Applicant: Orbotech Ltd.

Inventor： Gonen RAVEH

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/20081 ,  G06T2207/20084 ,  G06T2207/30141

Abstract: A method, product and system for Automatic Optical Inspection (AOI) using hybrid imaging system, The method comprises obtaining a prediction model that is configured to predict enhanced-quality images of products based on a low-quality images of the products, wherein the prediction model is generated based images obtained by a dual-scanning system comprising a low-quality scanning system and a high-quality scanning system. Based on a low-quality image of the product that is captured using the low-quality scanning system and using the prediction model, an enhanced-quality image of the product is predicted and utilized for defects detection.

公开(公告)号：US11881466B2

公开(公告)日：2024-01-23

申请号：US16495112

申请日：2018-04-26

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Zvi Kotler ,  Ofer Fogel

IPC: H01L23/00 ,  H01L21/48

CPC classification number: H01L24/19 ,  H01L21/4846 ,  H01L24/73 ,  H01L24/76 ,  H01L24/82 ,  H01L24/83 ,  H01L2224/73259 ,  H01L2224/76158 ,  H01L2224/82103

Abstract: A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

公开(公告)号：US20230408579A1

公开(公告)日：2023-12-21

申请号：US18035148

申请日：2021-08-08

Applicant: Orbotech Ltd.

Inventor： Doron SINAI ,  Itzhak Saki HAKIM

IPC: G01R31/308 ,  H04N25/768 ,  H04N25/48

CPC classification number: G01R31/308 ,  H04N25/768 ,  H04N25/48

Abstract: Apparatus for inspecting electrical circuits including a scanner including at least one multiline Time Delay Integration (TDI) sensor having multiple parallel lines of sensor pixels, the multiple lines being separated from each other by a separation distance along a scanning axis, each of the sensor pixels having a sensor pixel dimension along the scanning axis, a linear displacer providing mutual displacement of the TDI sensor and an electrical circuit to be inspected along the scanning axis and scanning optics directing light reflected from the electrical circuit to the sensor pixels, the scanning optics defining a projection of each sensor pixel onto the electrical circuit, which projection defines the area on the electrical circuit from which light reaches each sensor pixel, each projection having a sensor pixel projection dimension along the scanning axis and an image generator constructing an image from composite output pixels of the TDI sensor.

公开(公告)号：US20230259070A1

公开(公告)日：2023-08-17

申请号：US18013112

申请日：2021-06-17

Applicant: Orbotech Ltd.

Inventor： Yigal KATZIR ,  Boaz ROSENBERG ,  Nir TURKO

IPC: G03H1/04 ,  G01B9/02 ,  G01B9/02055

CPC classification number: G03H1/0443 ,  G01B9/02047 ,  G01B9/02078

Abstract: A method for reconstructing a digital hologram of a surface having at least one three- dimensional feature thereon, including acquiring a digital hologram of the surface, reconstructing a wavefront based on the digital hologram, generating a phase map of at least a portion of the surface based on the wavefront, the phase map including phase ambiguities, obtaining at least one additional image of the surface, obtaining height data relating to the three-dimensional feature from the at least one additional image of the surface, the height data being obtained with a first precision, resolving the phase ambiguities based on the height data and deriving a height of the at least one three- dimensional feature based on the phase map following the resolving of the phase ambiguities therein, the height being derived with a second precision more precise than the first precision.