Abstract:
A method for driving one or more electrically powered light sources, such as LED modules, may include applying a pulse-width-modulated signal thereto having a pulse-repetition frequency and a duty-cycle, the duty-cycle being selectively variable in order to vary the intensity of light emitted by the light source or light sources. To counter the occurrence of temporal light artefacts, or TLAs, the method may include frequency modulating the pulse-width-modulated signal (VPWM) by varying the pulse-repetition frequency thereof around a certain value between a lower frequency value and a higher frequency value, thus giving rise to a signal with combined FM/PWM modulation.
Abstract:
Various embodiments may relate to a lighting system including a string of light sources connected in series between a first terminal and a second terminal, wherein at least one electrical contact of the string of light sources is accessible. The system further includes a protection circuit that protects the light sources from an electrostatic discharge applied to the electrical contact that is accessible. In particular, the protection circuit includes at least one TVS diode or set of antiparallel diodes connected to the second terminal, and for each electrical contact a respective capacitor connected between the respective electrical contact and a TVS diode or set of antiparallel diodes, in such a way that an electrostatic event applied to an electrical contact is discharged through the respective capacitor and the respective TVS diode or set of antiparallel diodes towards the second terminal.
Abstract:
An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion.The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.
Abstract:
A support structure for electrically-powered lighting devices (e.g. LED modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. copper, on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate, a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed by means of etching and distributed with a constant separation pitch along the second surface of the laminar substrate, electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and the electrically-conductive areas in said distribution, and a network of second electrically-conductive formations including electrically-conductive ink deposited (e.g. printed) on the second surface of the laminar substrate, with second electrically-conductive formations in said network being electrically connected with the electrically-conductive areas in said distribution.
Abstract:
A support structure for electrically-powered lighting devices (e.g. LED modules) includes: an elongated laminar substrate having first and second mutually opposed surfaces, a layer of electrically-conductive material, e.g. copper, on the first surface of the laminar substrate, the layer including etching forming first electrically-conductive formations extending along the first surface of the laminar substrate, a distribution of electrically-conductive areas on the second surface of the laminar substrate, the distribution including electrically-conductive areas formed by means of etching and distributed with a constant separation pitch along the second surface of the laminar substrate, electrically-conductive vias extending through the laminar substrate to connect the first electrically-conductive formations and the electrically-conductive areas in said distribution, and a network of second electrically-conductive formations including electrically-conductive ink deposited (e.g. printed) on the second surface of the laminar substrate, with second electrically-conductive formations in said network being electrically connected with the electrically-conductive areas in said distribution.
Abstract:
A method for mounting planar lighting modules on a mounting surface may include: providing on opposite sides of the lighting module fixing indentations opening toward the aforesaid sides, superimposing on said opposite sides of the lighting module stiffening bars having lateral lobes extending into said indentations, and fixing to the mounting surface the stiffening bars superimposed on the opposite sides of the lighting module with the opposite sides of the lighting module sandwiched between the stiffening bars and the mounting surface, whereby the stiffening bars urge the lighting module toward the mounting surface.
Abstract:
A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.
Abstract:
A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.
Abstract:
A lighting device may include a mounting board with first and second opposed faces and vias extending therethrough, one or more light radiation sources mounted on the first face of the mounting board, drive circuitry for the light radiation source mounted on the second face of the mounting board, with electrically conductive lines between the light radiation source and the drive circuitry passing through said vias, a vat-like holder housing the mounting board with the light radiation source and the drive circuitry mounted thereon. The holder has cavities for receiving therein the drive circuitry with the first face of the mounting board and the light radiation source mounted thereon facing outwardly of the holder. Over the first face of the mounting board at least one sealing layer is applied, which ensures an IP grade protection of device.
Abstract:
Various embodiments may relate to a lens couplable to a light radiation source, e.g. a LED source, so as to be traversed by the light radiation produced by the latter. The lens includes, embedded in the lens itself, at least one electrically conductive line adapted to enable the electrical supply of the light radiation source.